Thermal Design - Seco COMe-C55-CT6 User Manual

Com express type 6 module with the intel 8 th generation core and celeron 4000 cpus

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4.1 Thermal Design

A parameter that has to be kept in very high consideration is the thermal design of the system.

Highly integrated modules, like COMe-C55-CT6 module, offer to the user very good performances in minimal spaces, therefore allowing the system

On the counterpart, the miniaturising of IC

to prevent system hang-off or faults.

COM Express

specifications take into account the use of a heatspreader, which will act only as thermal coupling device between the COM Express

an external dissipating surface/cooler. The heatspreader also needs to be thermally coupled to all the heat generating surfaces using a thermal gap pad, which will

optimise the heat exchange between the module and the heatspreader.

The heatspreader is not intended to be a cooling system by itself, but only as means for transferring heat to another surface/cooler, like heatsinks, fans, heat pipes

and so on.

Conversely, heatsink with fan in some situation can represent the cooling solution. Indeed, when using COMe-C55-CT6 module, it is necessary to consider carefully

the heat generated by the module in the assembled final system, and the scenario of utilisation.

Until the module is used on a development Carrier board, on free air, just for software development and system tuning, then a finned heatsink with FAN could be

sufficient for module

s cooling. Anyhow, please remember that all depends also on the workload of the processor. Heavy computational tasks will generate much

heat with all processor versions.

Therefore, it is always necessary that the customer study and develop accurately the cooling solution for his system, by evaluating processor

scenarios, the enclosures of the system, the air flow and so on. This is particularly needed for industrial grade modules.

SECO can provide COMe-C55-CT6 specific heatspreaders and heatsinks, but please remember that their use must be evaluated accurately inside the final system,

and that they should be used only as a part of a more comprehensive ad-hoc cooling solutions. Please ask SECO for specific ordering codes.

COMe-C55-CT6

s and the rise of operative frequencies of processors lead to the generation of a big amount of heat, that must be dissipated

s minimisation.

module and

s workload, utilisation

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