Quectel EG91 Series Hardware Design page 10

LTE Standard Module Series
EG91 Hardware Design
FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 76
FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS' PCB)
................................................................................................................................................................... 77
FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 78
FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 79
FIGURE 43: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 80
FIGURE 44: TOP VIEW OF THE MODULE ...................................................................................................... 81
FIGURE 45: BOTTOM VIEW OF THE MODULE .............................................................................................. 81
FIGURE 46: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 83
FIGURE 47: TAPE DIMENSIONS ..................................................................................................................... 84
FIGURE 48: REEL DIMENSIONS ..................................................................................................................... 85
FIGURE 49: TAPE AND REEL DIRECTIONS ................................................................................................... 85
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