Baking Requirements; Packaging - SimCom SIM5300E Hardware Design

Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the
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label.
Notes:
1. If the vacuum package is not open for 6 months or longer than the packing date, baking is also
recommended before re-flow soldering.
2. Product handling, storage and processing must follow IPC / JEDEC J-STD-033.

6.3 BAKING REQUIREMENTS

Because of its sensitivity to moisture absorption, SIM5300E should be baked sufficiently before re-flow
soldering. Otherwise SIM5300E will be at the risk of permanent damage during re-flow soldering. SIM5300E
should be baked 192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device
containers, or 72 hours at temperature 80°C±5°C for high-temperature device containers. When baking
SIM5300E modules, note that the plastic tray is not heat resistant. Otherwise the tray may be damaged by
high-temperature during baking.
Table 34: Baking requirements
Baking temperature
40°C±5°C
120°C±5°C
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PACKAGING

SIM5300E module support tray packaging.
SIM5300E_Hardware_Design_V1.02
Moisture
<5%
<5%
Time
192 hours
4 hours
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