Belden HIRSCHMANN EESX Series Hardware Integration Manual
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Belden HIRSCHMANN EESX Series Hardware Integration Manual

Belden HIRSCHMANN EESX Series Hardware Integration Manual

Embedded ethernet switch extended
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EESX Hardware Integration Guide
Embedded Ethernet Switch eXtended
Product Family
EESX20 and EESX30
EESX20 and EESX30
Technical Support
Release 1.5 04/2020
https://hirschmann-support.belden.eu.com

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  • Page 1 EESX Hardware Integration Guide Embedded Ethernet Switch eXtended Product Family EESX20 and EESX30 EESX20 and EESX30 Technical Support Release 1.5 04/2020 https://hirschmann-support.belden.eu.com...
  • Page 2 The naming of copyrighted trademarks in this manual, even when not specially indicated, should not be taken to mean that these names may be considered as free in the sense of the trademark and tradename protection law and hence that they may be freely used by anyone. ©...

  • Page 3: Table Of Contents

    Contents About this Guide References Legend Revision History EESX-Evaluation-Board Interfaces Overview Power supply Twisted Pair Ethernet Interface Fiber optic Ethernet Interface Mode-switch Settings for Ethernet Ports Port count LED Status Indication Measuring Point Connectors EESX Socket (CO201 and CO202) 1.10 JTAG Connection (CPLD) 1.11 Sub D9 Socket RS232...
  • Page 4 3.7.2 Magnetics Coupling – 10/100Base-TX 3.7.3 Capacitive Coupling – 1000Base-FX 3.7.4 Magnetics Coupling – 1000Base-TX Layout recommendations Recommended Magnetic Heat sink Permissible operating temperature Estimation of heat sink’s cooling performance Technical Data Further Support EESX20 and EESX30 Release 1.5 04/2020...
  • Page 5 Safety instructions This documentation contains instructions which must be observed to ensure your own personal safety and to avoid damage to devices and machinery. ■ Certified usage The device may only be employed for the purposes described in the catalog and technical description, and only in conjunction with external devices and components recommended or approved by the manufacturer.

  • Page 6: About This Guide

    About this Guide This document provides technical specifications for the Embedded Ethernet Switch eXtended (EESX) Evaluation-Board. It also illustrates hardware integration guidelines for a Hirschmann Embedded Ethernet Switch eXtended (EESX) module. It describes the board level interfaces as well as the key operation parameters.

  • Page 7: Eesx-Evaluation-Board Interfaces

    1 EESX-Evaluation-Board Interfaces 1.1 Overview Figure 1-1: Components of the PCB-assembly The hardware EESX-Evaluation-Board offers: DC Jack for 24 VDC external power supply 8 x Magnetics + RJ45 connector for 10/100Base-TX. 8 x SFP cages for 100Base-FX transceivers. 2 x DSC adapter for 100Base-FX transceivers at FE-Port 1 and GE-Port 1 2 x Magnetics + RJ45 connector for 10/100/1000Base-TX.

  • Page 8: Power Supply

    (12) 80-pin, dual-row vertical male EESX connectors (CO202) (13) CPLD for control signals (14) CPLD JTAG connector (CO401) (15) RS-232 connector (SubD-9) for serial communication Push button: “Ue_Ok” (SW401) – Module Reset (16) Push button: “PGOOD_PLD” (SW402) (17) (18) SD Card slot (19) USB connector (20)

  • Page 9: Twisted Pair Ethernet Interface

    1.3 Twisted Pair Ethernet Interface The 10/100 and 1000 Mbit/s Ethernet ports (IEEE 802.3 10/100 Base-TX) use RJ45 sockets, and support: ► Auto negotiation ► Auto polarity ► Auto crossing (if auto negotiation is activated) ► 1000 Mbit/s full-duplex mode, only Ports 1 and 2 of EESX30 ►...

  • Page 10: Fiber Optic Ethernet Interface

    1.4 Fiber optic Ethernet Interface The EESX-Evaluation-Board provides SFP cages for optical Fast Ethernet (100Base-FX) SFP transceivers for every Ethernet port. Even EESX30 module supports additionally 1000BASE-FX for GE-at Ports # 1 and 2. An optical DSC (1*9) transceiver is available at FE-Port 1 and can be implemented at costumer’s design for each FE-Port.

  • Page 11: Port Count

    1.6 Port count Depending from the hardware type of EESX module the port count used in the software is different. Module EESX20 has eight Fast Ethernet ports (FE) and EESX30 has additionally two Gigabit Ethernet ports (GE). In Table 1-1 means Physical Port the port numbering on EESX-Evaluation-Board and Logical Port means the numbering by the software.

  • Page 12: Measuring Point Connectors

    Status Description EESX-Evaluation-Board is unpowered. POWER Green EESX-Evaluation-Board is powered. Signal “Relay_Control” is low, System is not RELAY ready. Green Signal “Relay_Control” is high, System is ready. Software is not loaded. SWBOOT2 Green Software is loaded. Software is not loaded, System is not ready. READY Light green Software is loaded, System is ready.

  • Page 13: Eesx Socket (Co201 And Co202)

    1.9 EESX Socket (CO201 and CO202) The 120-pin dual-row socket CO201 and 80-pin dual-row socket CO202 on EESX-Evaluation-Board are used to mount the EESX20/30 module. Both sockets are the electrical interface between the EESX module and its Evaluation-Board. The interface connects the power supply, the Ethernet, logical and other signals.

  • Page 14: Push Buttons

    1.12 Push Buttons The following push buttons are available on the EESX-Evaluation-Board: ► Push button SW401 to signal “Ue_Ok”: Resets the EESX module if button pushed. See (16) in Figure 1-1. ► Push button SW402 to signal “PGOOD_PLD“:See (17) in Figure 1-1. Tracks the signal “PGOOD_PLD” to ground (GND) potential if button pushed.

  • Page 15: Eesx Module Socket

    2 EESX Module Socket 2.1 Mechanics Figure 2-1: EESX module with interconnectors; Bottom view The opposite interconnectors on the EESX-Evaluation-Board are manufactured by TE Connectivity (www.te.com). Part number:  Connector male 120 pins: 5084614-5 (Package Tube) or 5-5177986-5 (Package Tape and Reel). ...
  • Page 16 Figure 2-2: EESX module mounted on EESX-Evaluation-Board with screws and nuts; sectional drawing Note: It is recommended for costumer’s applications to let the space idle beneath the module board for better heat dissipation of the module. EESX20 and EESX30 Release 1.5 04/2020...

  • Page 17: Eesx-Module With Heat Spreader

    2.1.1 EESX-Module with Heat Spreader The figure below shows the position of the drill-holes for the screws of the cooling block and the total height of the module. For details about the Heat dissipation parameters see chapter “Heat sink”: Figure 2-3: EESX module with mounted cooling plate; Bottom-, side-, and top-view EESX20 and EESX30 Release 1.5 04/2020...

  • Page 18: Components To Be Cooled On Eesx-Module

    2.1.2 Components to be cooled on EESX-Module The following ICs should be cooled if the permissible case temperature will be exceeded. (See Chapter Technical Data for case temperature.) Component x-direction / mm y-direction / mm IC401 IC901 17,5 17,5 IC902 IC1002 IC602 12,2...

  • Page 19: Pin Assignment At Connector Co201

    2.2 PIN Assignment at connector CO201 Table 2-1 and Table 2-2 describe the pin out and signals names of the interconnectors CO201 mounted on the EESX-Evaluation-Board and its complementary one on the module. CO201 Name Name VCC3.3_EES VCC3.3_EES VCC3.3_EES VCC3.3_EES VCC3.3_EES Ue_Ok VMag_P38...
  • Page 20 CO201 Name Name TD+P6 RD+P6 TD-P6 RD-P6 TD-P5 RD-P5 TD+P5 RD+P5 TD+P4 RD+P4 TD-P4 RD-P4 TD-P3 RD-P3 TD+P3 RD+P3 TD+P2 RD+P2 TD-P2 RD-P2 TD-P1 RD-P1 TD+P1 RD+P1 Table 2-2: Pin assignment of interface connector CO201 EESX20 and EESX30 Release 1.5 04/2020...

  • Page 21: Pin Description For Connector Co201

    2.3 PIN Description for connector CO201 Signal Name Type I/O Type Description (EESX) (EESX) VCC3.3_EES Power 3.3 Volts +-5% Power supply of the module for 3.3 Volts. Ue_Ok Input LVTTL Power supply for EESX-Evaluation-Board available. Ground 0 Volts Ground potential for signals and power supply.

  • Page 22: Pin Assignment At Connector Co202

    2.4 PIN Assignment at connector CO202 Table 2-1 and Table 2-2 describe the pin out and signal names of the interconnectors CO202 mounted on the EESX-Evaluation-Board and its complementary ones on the module. CO202 Name Name VMag_G12 VMag_G12 VMag_G12 VMag_G12 I2C_Clk_G2 SD_Dat3 I2C_Clk_G1...

  • Page 23: Pin Description For Connector Co202

    2.5 PIN Description for connector CO202 Signal Name Type I/O Type Description (EESX) (EESX) Ground 0 Volts Ground potential for signals and power supply. VMag_G12 Power 1.8 Volts Power supply for Gigabit-Ports’ magnetics. I2C_Clk_G[1..2] Bidirectional LVTTL Clock lines of I2C for Gigabit-Ports 1 and 2.

  • Page 24: Application Guide Line

    3 Application Guide Line This chapter provides recommendations for implementation of the Ethernet and SPI interfaces. 3.1 Ethernet interface for 10/100Base-TX connection Figure 3-1: 10/100Base-TX interface recommandation Table 3-1: 10/100Base-TX center tap voltage For operational reasons the ports require different supply voltages for the center taps of the magnetic poles.

  • Page 25: Ethernet Interface For 1000Base-Tx

    3.2 Ethernet interface for 1000Base-TX Figure 3-2: 1000Base-TX interface recommandation 3.3 Ethernet interface for 100Base-FX 3.3.1 Interface Connection (SFP Transceiver) Figure 3-3: 100Base-FX (SFP) interface recommandation Table 3-2: 100Base-FX (SFP) schematic information EESX20 and EESX30 Release 1.5 04/2020...

  • Page 26: Interface Connection (1*9 Transceiver)

    3.3.2 Interface connection (1*9 Transceiver) Figure 3-4: 100Base-FX (1*9 transceiver) interface recommendation Table 3-3: 100Base-FX (1*9 transceiver) schematic information EESX20 and EESX30 Release 1.5 04/2020...

  • Page 27: Ethernet Interface For 1000Base-Fx

    3.4 Ethernet interface for 1000Base-FX 3.4.1 Interface Connection (SFP Transceiver) Figure 3-5: 1000Base-FX (SFP) interface recommandation EESX20 and EESX30 Release 1.5 04/2020...

  • Page 28: Interface Connection (1*9 Transceiver)

    3.4.2 Interface connection (1*9 Transceiver) Figure 3-6: 1000Base-FX (1*9 transceiver) interface recommendation The feature 1*9 Transceiver is currently not supported for the Gigabit ports 1 and 2. Use the Fast Ethernet ports instead. EESX20 and EESX30 Release 1.5 04/2020...

  • Page 29: Spi Interface Connection

    3.5 SPI Interface connection The EESX module provides a SPI interface (acts as SPI master) for status indication. The EESX-Evaluation-Board communicates with the on-board CPLD via a SPI interface. The CPLD serializes and de-serializes the SPI data stream and provides the signals to I/O pins. Direction * Description SPI_/SS...
  • Page 30 Figure 3-7: SPI implementation example as alternative for the CPLD chip EESX20 and EESX30 Release 1.5 04/2020...

  • Page 31: Spi Protocol Timing

    3.5.1 SPI Protocol Timing Figure 3-5 illustrates every timing parameter in the SPI Protocol. These timing parameters are a result of the EESX internal operation and both constrain host behavior and characterize EESX operation. Note that Figure 3-5 is not drawn to scale, but is instead drawn only to illustrate where the parameters are measured.

  • Page 32: I2C Interface Connection

    Signal name Description 31… Signal “SFP present” for FE-Ports 8..1 on Evaluation-Board; n_SFP_Present_P[8..1] low = SFP module is present / high = SFP module is not present 23… Signal “SFP present” for GE-Ports 2..1 on Evaluation-Board; n_SFP_Present_G[2..1] low = SFP module is present / high = SFP module is not present 21…...

  • Page 33: Capacitive Coupling - 100Base-Fx

    Devices for a galvanic separation are not present on the EESX module itself. Appropriate isolation can be achieved by using an external 1:1-Ethernet transformer. If no electrical isolation is required, the module can also be connected directly to another Ethernet PHY device.
  • Page 34 Figure 3-11: Magnetics Coupling - Circuit Diagram Capacitive Coupling – 1000Base-FX 3.7.3 Figure 3-12: Capacitive Coupling - Circuit Diagram EESX20 and EESX30 Release 1.5 04/2020...
  • Page 35 Magnetics Coupling – 1000Base-TX 3.7.4 Figure 3-13: Capacitive Coupling - Circuit Diagram 3.8 Layout recommendations Some recommendations to adapt the EESX-Evaluation-Board design to your application design. A) Quick switches - The mode switches SW403 and SW601 can be removed in customer’s application design - if only using TX- OR FX- (SFP or DSC) Mode.
  • Page 36 Figure 3-14: Single port RJ45 Ethernet Jack with integrated transformer and spring contacts Figure 3-15: 4-port RJ45 Ethernet Jack with integrated transformers and spring contacts 3.9 Recommended Magnetic Producer Datarate Temp. Range Misc HALO Electronics, Inc TG110-HPE7N5LF 100Mbit/s -40°C to 85°C PoE+ EESX20 and EESX30 Release 1.5 04/2020...
  • Page 37 4 Heat sink Case Temperature on the EESX-Board Note: The Case temperature on the EESX module should not be exceeded! Case temperature for EESX20: 91°C Case temperature for EESX30: 85°C 4.1 Permissible operating temperature The maximum permissible operating temperature of the EESX module is +91 °C for EESX20 and +85°C for EESX30 at the measuring point of the Case Temperature.
  • Page 38 4.2 Estimation of heat sink’s cooling performance To determine that the location is suitable for installing the device, perform a reference measurement: - Install the device in the planned location. - Switch on the device and wait until it has reached its operating temperature. - Check whether the operating temperature at the measuring point remains below the maximum permissible value.
  • Page 39 5 Technical Data Parameter min. typ. max. Unit Switch type Store- and- (Standard Ports) Forward Latency (end receive – begin transmit) 10 Mbit; 64 ... 1518 Byte Paketlänge 10,0 µs 100 Mbit; 64 ... 1518 Byte 11,0 µs Paketlänge 1000 Mbit; 64 ... 1518 Byte 11,0 µs Paketlänge...
  • Page 40 Parameter (Tx-Mode, min. typ. Max. Units 100Base-Tx) Output signal by 100  0,95 1,05 Symmetry output signal Parameter (Tx-Mode, min. typ. Max. Units 1000Base-Tx) Output signal by 100  0,95 1,05 Symmetry output signal Table 5-3: Electrical specification Ethernet Tx lines Parameter (Fx-Mode, 100/1000Base-Fx) min.
  • Page 41 Parameter min. typ. max. Unit Storage temperature °C Humidity (non-condensing) preliminary Air-pressure by operating (+2000 m a.s.l) Air-pressure by storage preliminary (+4000 m a.s.l) Table 5-6: Miscellaneous Board Weights Name Net weight EESX20 42 g EESX30 42 g EESX-Evaluation-Board 370 g Table 5-7: Board Weights Ambient Air Temperature EESX20/30 module...
  • Page 42 Parts on EESX20/30 module or EESX-Evaluation-Board should not touched in operation! Due to possible hot spots of electronical components – especially the case of integrated circuits. MTBF Product Comment Standard MTBF Value EESX20 207,4 years Gb 25°C 87,2 years Gb 60°C EESX30 198,6 years Gb 25°C 85,1 years Gb 60°C...
  • Page 43 Contact our support at https://hirschmann-support.belden.eu.com You can contact us in the EMEA region at ► Tel.: +49 (0)1805 14-1538 ► E-mail: hac.support@belden.com in the America region at ► Tel.: +1 (717) 217-2270 ► E-mail: inet-support.us@belden.com in the Asia-Pacific region at ►...

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