Acrylamide In Food; Test Dishes; Baking - Siemens HB34A Series Instruction Manual

Acrylamide in food

Acrylamide is produced particularly in cereal and potato
products prepared at high temperatures, e. g., chips, toast,
rolls, bread and pastries (biscuits, spiced biscuits, Christmas
biscuits).
Tips for preparing food with a low acrylamide content
General

Baking

Pastries and biscuits
Oven potato chips

Test dishes

These tables have been produced for test institutes to facilitate
the inspection and testing of the various appliances.
In accordance with EN 50304/EN 60350 (2009) and IEC
60350.
Baking
Baking on 2 levels:
Always place the universal deep tray on the upper level and the
flat oven tray on the lower level.
Baking on 3 levels:
Always place the universal deep tray on the upper level.
Butter cookies:
Trays put in the oven at the same time are not necessarily
ready at the same time.
Covered apple pie on level 1:
Place dark springform tins with some space between them.
Dish
Butter cookies (preheat*)
Butter cookies
Small cakes (preheat*)
Water sponge cake (preheat*)
Water sponge cake
Flat yeast cake
* Do not use rapid heating to preheat the oven
Wire shelves and baking trays may be obtained as optional accessories from specialist retail outlets.
Keep the cooking time to a minimum.
■
Brown the food, making sure it is not overtoasted.
■
Large, thick pieces of food contain a low acrylamide content.
■
With top and bottom heat max. 200 °C
With 3D Hot air max. 180 °C.
With top and bottom heat max. 190 °C.
With 3D Hot air max. 170 °C.
Eggs or egg yolks reduce the formation of acrylamide.
Spread them evenly on a single layer in the baking tray. Bake at least 400 g on each
baking tray so that the chips do not dry out
Accessories and tins
Universal tray
Universal tray + oven tray
2 oven trays + universal tray 5+3+1
Universal tray
Universal tray
Universal tray + oven tray
Universal tray
2 oven trays + universal tray 5+3+1
Springform tin on the wire
shelf
Springform tin on the wire
shelf
Universal tray
Universal tray
Universal tray + oven tray
Covered apple pie on 2 levels:
Place dark springform tins on top of one another.
Cakes in springform tins:
Bake using top and bottom heating
universal tray instead of the wire shelf and place the springform
tins on it.
Level Type of heating Temperature in
3
%
3+1
:
:
3
'
3
%
3+1
:
3
:
:
2
%
2
'
3
%
3
:
3+1
:
on level 1. Use the
%
Time in min-
°C utes
150-160 20-30
140-150 25-35
140-150 25-35
140-150 30-45
150-170 20-30
140-160 25-35
150-160 25-30
140-150 25-30
170-180 30-40
165-175 35-45
160-180 30-40
150-170 30-45
160-170 30-40
25