Texas Instruments SimpleLink CC3135MOD Manual page 67

MOB0063A
54X ( 0.81)
1
2
(45 X 1)
SOLDER MASK
OPENING
9X
PKG
(0.65)
TYP
(1.27) TYP
15
16
(R0.05)
ALL PADS
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
PKG
54
( 8.1)
0.05 MIN TYP
58
55
59
56
57
60
(0.65)
TYP
17
2X (16.1)
LAND PATTERN EXAMPLE
SOLDER MASK DEFINED
SCALE:6X
0.05 MIN
ALL AROUND
SIGNAL PADS DETAIL
www.ti.com
EXAMPLE BOARD LAYOUT
QFM - 2.4 mm max height
SEE DETAIL
44
9X ( 2)
( 0.2) TYP
VIA
61
METAL UNDER
SOLDER MASK
62
6X (3)
(1.5)
63
(1.5)
6X (3)
27
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
QUAD FLAT MODULE
43
42
2X (19.1)
29
28
4221462/D 06/2019