Mechanical, Packaging, And Orderable Information; Mechanical, Land, And Solder Paste Drawings - Texas Instruments SimpleLink CC3135MOD Manual

CC3135MOD
SWRS225B – FEBRUARY 2019 – REVISED MARCH 2020

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document.

10.1 Mechanical, Land, and Solder Paste Drawings

The total height of the module is 2.4 mm.
The weight of the module is 1.8g typical.
1. All dimensions are in mm.
2. Solder mask should be the same or 5% larger than the dimension of the pad
3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make
the solder paste 20% smaller than the pad.
62 Mechanical, Packaging, and Orderable Information
NOTE
NOTE
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