LSIS XGT Series User Manual
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LSIS XGT Series User Manual

Programmable logic controller xgb standard/economic type main unit (iec)
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Right choice for ultimate yield
LSIS strives to maximize customers' profit in gratitude of choosing us for your partner.
Programmable Logic Controller
XGB Standard/Economic Type Main Unit (IEC)
XGT Series
Read this manual carefully before
installing, wiring, operating, servicing
or inspecting this equipment.
Keep this manual within easy reach
for quick reference.
XEC-DN20SU
Main unit
XEC-DN30SU
XEC-DN40SU
XEC-DN60SU
XEC-DR20SU
XEC-DR30SU
XEC-DR40SU
XEC-DR60SU
User's Manual
XEC-DR10E
XEC-DN10E
XEC-DP10E
XEC-DR14E
XEC-DN14E
XEC-DP14E
XEC-DR20E
XEC-DN20E
XEC-DP20E
XEC-DR30E
XEC-DN30E
XEC-DP30E
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  • Page 1 Right choice for ultimate yield LSIS strives to maximize customers' profit in gratitude of choosing us for your partner. Programmable Logic Controller XGB Standard/Economic Type Main Unit (IEC) XGT Series User’s Manual XEC-DR10E XEC-DN20SU Main unit XEC-DN30SU XEC-DN10E XEC-DN40SU XEC-DP10E...
  • Page 2 Safety Instruction Before using the product … For your safety and effective operation, please read the safety instructions thoroughly before using the product. ► Safety Instructions should always be observed in order to prevent accident or risk with the safe and proper use the product. ►...
  • Page 3 Safety Instruction Safety Instructions when designing Warning  Please, install protection circuit on the exterior of PLC to protect the whole control system from any error in external power or PLC module. Any abnormal output or operation may cause serious problem in safety of the whole system.
  • Page 4 Safety Instruction Safety Instructions when designing Caution I/O signal or communication line shall be wired at least 100mm  away from a high-voltage cable or power line. If not, it may cause abnormal output or operation. Safety Instructions when designing Caution ...
  • Page 5 Safety Instruction Safety Instructions when wiring Warning Prior to wiring, make sure that power of PLC and external power is  turned off. If not, electric shock or damage on the product may be caused. Before PLC system is powered on, make sure that all the covers ...
  • Page 6 Safety Instruction Safety Instructions for test-operation or repair Warning  Do not touch the terminal when powered on. Electric shock or abnormal operation may occur.  Prior to cleaning or tightening the terminal screws, let all the external power off including PLC power. If not, electric shock or abnormal operation may occur.
  • Page 7 Ch7.1, Ch8.4 Ch10.4,Ch11.2 Ch12.1 2. XGB Special module added (XBF-AD04C,XBF-DV04C,XBF-DC04C) 1. Data Backup time modified 4-12 V1.2 2013.1 ※ The number of User’s manual is indicated on the right side of the back cover. ⓒ LSIS Co.,Ltd. 2009 All Rights Reserved.
  • Page 8 It describes how to use XG5000 software especially about XG5000 User’s online functions such as programming, printing, monitoring 10310000512 Manual and debugging by using XGT series products. It describes how to use the instructions for programming XGI/XGR/XEC Series using XGB (IEC language) series. Instruction &...
  • Page 9 About User’s Manual No. of User Title Description Manual High Speed Counter It describes how to use High Speed Counter module 10310001242 Module User’s Manual...

  • Page 10: Table Of Contents

    Contents ◎ Contents ◎ Chapter 1 Introduction ................................1-1~1-5 1.1 Guide to This Manual ..................................1-1 1.2 Features ......................................1-2 1.3 Terminology ...................................... 1-4 Chapter 2 System Configuration..............................2-1~2-13 2.1 XGB System Configuration ................................2-1 2.2 Product List ..................................... 2-2 2.3 Classification and Type of Product Name ............................
  • Page 11 Contents 5.3.1 RUN mode ................................... 5-20 5.3.2 STOP mode ..................................5-21 5.3.3 DEBUG mode ..................................5-21 5.3.4 Change operation mode ..............................5-25 5.4 Memory ......................................5-26 5.4.1 Program memory ................................5-26 5.4.2 Data memory ..................................5-27 5.4.3 Data retain area setting ............................... 5-27 5.4.4 Data memory Map ................................
  • Page 12 Contents 7.3.6 XEC-DN14E 6 point transistor output (Sink type) ......................7-20 7.3.7 XEC-DN20E 8 point transistor output (Sink type) ......................7-21 7.3.8 XEC-DN30E 12 point transistor output (Sink type) ......................7-22 7.3.9 XEC-DP10E 4 point transistor output (Source type) ......................7-23 7.3.10 XEC-DP14E 6 point transistor output (Source type) .......................
  • Page 13 Contents 9.1 Battery ....................................... 9-1 9.1.1 Battery specification ................................9-1 9.1.2 Notice in using ..................................9-1 9.1.3 Life of battery .................................... 9-1 9.1.4 How to change battery ................................9-2 9.2 RTC Function ....................................9-3 9.2.1 How to use ....................................9-3 9.3 Name and Function of Each Part ..............................
  • Page 14 Contents 12.1.4 How to use when password is set ............................ 12-8 Chapter 13 Installation and Wiring ............................13-1~13-18 13.1 Safety Instruction ..................................13-1 13.1.1 Fail safe circuit ..................................13-3 13.1.2 PLC heat calculation ................................13-6 13.2 Attachment/Detachment of Modules ............................13-8 13.2.1 Attachment/Detachment of modules ..........................
  • Page 15 Contents Appendix 4 Instruction List ............................App.4-1~App.4-17 Appendix 4.1 Basic Function ................................. App.4-1 Appendix 4.2 GLOFA Function ..............................App.4-13 Appendix 4.3 Array Operation Function ............................. App.4-13 Appendix 4.4 Basic Function Block ............................App.4-14 Appendix 4.5 Expanded Function .............................. App.4-17...

  • Page 16: Chapter 1 Introduction

    Chapter1 Introduction Chapter 1 Introduction 1.1 Guide to This Manual This manual includes specifications, functions and handling instructions for XGB series PLC. This manual is divided up into chapters as follows. Title Contents Chapter 1 Introduction Describes configuration of this manual, unit’s features and terminology. Chapter 2 System Configurations Describes available units and system configuration in the XGB series.

  • Page 17: Features

    Chapter1 Introduction 1.2 Features The features of XGB system are as follows. (1) The system secures the following high performances. (a) High Processing Speed (b) Max. 284 I/O control supporting small & mid-sized system implementation Type Item Reference Economy (XEC-DxxxE) Standard (XEC-DxxxSU) Operation processing 0.24㎲...
  • Page 18 Chapter1 Introduction (4) Improved maintenance ability with register, RTC option, comment backup and etc (a) Convenient programming environment by providing analog register and index register. (b) Improved maintenance ability by operating multiple programs and task program through module program. (c) Built-in Flash ROM enabling permanent backup of program without any separate battery. (d) Improved maintenance ability by types of comment backup.

  • Page 19: Terminology

    Chapter1 Introduction (10) Built-in position control function (“SU” type TR output main unit) (a) Supports max 100Kpps 2 axes. (b) Provides parameter setting, operation data collection, diverse monitoring and diagnosis by using XG5000. (c) Commissioning by monitoring of XG5000, without program, inspects external wiring and operation data setting. (11) Built-in PID (“SU”...
  • Page 20 Chapter1 Introduction Terms Definition Remark Current flows from the switch to the PLC input terminal if a input signal turns on. Z: Input Sink Input  impedance Current flows from the PLC input terminal to the switch after a input signal turns on.

  • Page 21: Chapter 2 System Configuration

    Chapter2 System Configuration Chapter 2 System Configuration The XGB series is suitable to configuration of the basic, computer link and network systems. This chapter describes the configuration and features of each system. 2.1 XGB System Configuration The System Configuration of XGB series is as follows. For ‘E’...

  • Page 22: Product List

    Chapter2 System Configuration Item Description  XBL-C41A  XBL-C21A  XBL-EIPT Expansion Communication I/F  XBL-EMTA  XBL-EIMT/H/F  XBL-CMEA/CSEA module module  XBO-DC04A  XBO-TN04A Digital I/O module Items  XBO-AH02A  XBO-AD02A  XBO-DA02A Option Special module  XBO-RD01A ...
  • Page 23 Chapter2 System Configuration Types Model Description Remark XBF-AD08A Current/voltage input 8 channel XBF-TC04S TC (Thermocouple) input 4 channel XBF-PD02A 2 axis, line driver type XBF-HO02A Open-collector input 2 channel XBF-HD02A LineDriver input 2 channel XBF-AD04C Current/Voltage input 4 channel, High resolution XBF-DV04C Current output 4 channel, High resolution XBF-DC04C...

  • Page 24: Classification And Type Of Product Name

    Chapter2 System Configuration 2.3 Classification and Type of Product Name 2.3.1 Classification and type of basic unit Name of basic unit is classified as follows. Built in USB port (SU) XGB PLC economy (E) XGB PLC XGB PLC standard (S) XGB PLC High-end type (H) MK language supported (B) IEC language supported (E)
  • Page 25 Chapter2 System Configuration Classification Name DC input Relay output Transistor output Power XBC-DN14E 8 point None 6 point XBC-DN20E 12 point None 8 point XBC-DN30E 18 point None 12 point Compact type main Unit XBC-DP10E 6 point None 4 point (MK language) XBC-DP14E 8 point...

  • Page 26: Classification And Type Of Expansion Module

    Chapter2 System Configuration 2.3.2 Classification and type of expansion module Name of expansion module is classified as follows. Type No. of IO point XGB series I/O expansion module Relay output(RY) Transistor output (TN/TP) Digital input (DC) Digital input+ sink type transistor output (DN) Digital input+ source type transistor output (DP) Digital input + Relay output (DR) Name...

  • Page 27: Classification And Type Of Special Module

    Chapter2 System Configuration 2.3.3 Classification and type of special module Special module is classified as follows Non-insulation type (A) Insulation type (S) XGB series No. of IO point Expansion special module Analog input (AD) Analog voltage output (DC) Analog current output (DV) Voltage, current I/O (AH) RTD input (RD) Thermocouple input (TC)

  • Page 28: Classification And Type Of Communication Module

    Chapter2 System Configuration 2.3.4 Classification and type of communication module Name of communication module is classified as follows. Cnet 1 channel (RS-232C): C21A Cnet 1 channel (RS-422/485): C41A XGB series FEnet 1 port: EMTA RAPIEnet 1 port: EIMT EtherNet/IP 2 port: EIPT CANOpen Master : CMEA CANOpen Slave: CSEA Expansion communication module...

  • Page 29: Classification And Type Of Option Module

    Chapter2 System Configuration 2.3.5 Classification and type of option module Name of option module is classified as follows. No. of IO point XGB PLC Memory capacity Option module DC input (DC) TR output (TN) Analog input (AD) Analog output (DA) Voltage, current I/O (AH) RTD input (RD) Thermocouple input (TC)

  • Page 30: Chapter 3 General Specifications

     Peak acceleration : 147 m/s (15G)  Duration : 11ms Shock resistance  Half-sine, 3 times each direction per each axis AC: 1,500 V Square wave LSIS standard DC: 900 V impulse noise Electrostatic IEC61131-2 Voltage: 4kV (Contact discharge) discharge...

  • Page 31: Chapter 4 Cpu Specifications

    Chapter 4 CPU Specifications Chapter 4 CPU Specifications 4.1 Performance Specifications The following table shows the general specifications of the XGB module type CPU (XEC-Dx10/14/20/30E). Specifications (‘E’ type) XEC-DR10E XEC-DR14E XEC-DR20E XEC-DR30E Items Remark XEC-DN10E XEC-DN14E XEC-DN20E XEC-DN30E XEC-DP10E XEC-DP14E XEC-DP20E XEC-DP30E Reiterative operation, fixed cycle operation...
  • Page 32 Chapter 4 CPU Specifications Specifications (‘E’ type) XEC-DR10E XEC-DR14E XEC-DR20E XEC-DR30E Items Remark XEC-DN10E XEC-DN14E XEC-DN20E XEC-DN30E XEC-DP10E XEC-DP14E XEC-DP20E XEC-DP30E No limit in points Timer Counter No limit in points (Counter range: 64 bit range) Operation Mode RUN, STOP Restart modes Cold, Warm Total number of program...
  • Page 33 Chapter 4 CPU Specifications The following table shows the general specifications of the XGB compact type CPU (XEC-DN20/30/40/60SU, XEC-DR20/30/40/60SU). Specifications (‘SU’ type) Items Remark XEC-DN20SU XEC-DN30SU XEC-DN40SU XEC-DN60SU XEC-DR20SU XEC-DR30SU XEC-DR40SU XEC-DR60SU Program control method Reiterative operation, fixed cycle operation, constant scan Scan synchronous batch processing method (Refresh method), I/O control method Directed by program instruction...
  • Page 34 Chapter 4 CPU Specifications Specifications (‘SU’ type) Items Remark XEC-DN20SU XEC-DN30SU XEC-DN40SU XEC-DN60SU XEC-DR20SU XEC-DR30SU XEC-DR40SU XEC-DR60SU Operation modes RUN, STOP, DEBUG Cold, Warm Restart mode Total number of program block Initialization Fixed period Task External input 8 (%IX0.0.0 ~ %IX0.0.7) Internal device 8 Self diagnosis Detecting operation delay, memory error, I/O error...
  • Page 35 Chapter 4 CPU Specifications Specifications Items Remark XEC-DxxxE(Economy) XEC-DxxxSU(Standard) Controlled by instructions, Auto-tuning, PWM output, Supported in Forced output, Adjustable operation scan time, Anti Windup, Delta MV PID control function ‘SU’ type function, SV-Ramp function,The mixed forward/reverse run, Cascade Dedicated protocol support MODBUS protocol support Cnet I/F function User defined protocol support...

  • Page 36: Names Of Part And Function

    Chapter 4 CPU Specifications 4.2 Names of Part and Function ‘ E’ Type 명 칭 용 도 Input indicator LED ▪ Input indicator LED ① PADT connecting ▪ PADT connector ② connector -RS-232C 1 channel Input terminal block ▪ Input terminal bl ck ③...
  • Page 37 Chapter 4 CPU Specifications ‘SU’ Type Name Description Input indicator LED ▪ Input indicator LED ① PADT connecting ▪ PADT connector ② connector RS-232C 1 channel, USB 1 channel ③ Input terminal block ▪ Input terminal block ④ Output terminal block ▪...

  • Page 38: Power Supply Specifications

    Chapter 4 CPU Specifications 4.3 Power Supply Specifications It describes the power supply specification of main unit. Specification XEC-DR10/14E XEC-DR20/30E Items XEC-DN20/30SU XEC-DN40SU XEC-DN60SU XEC-DN10/14E XEC-DN20/30E XEC-DR20/30SU XEC-DR40SU XEC-DR60SU XEC-DP10/14E XEC-DP20/30E Rated voltage AC 100 ~ 240 V (UL warranty voltage) AC85~264V(-15%, +10%) Input voltage range or less...
  • Page 39 Chapter 4 CPU Specifications 1) Consumption current (DC 5V) Consumption current Type Model (Unit : ㎃) XEC-DR32H XEC-DR64H 1,040 XEC-DN32H XEC-DN64H XEC-DN20SU XEC-DN30SU XEC-DN40SU XEC-DN60SU XEC-DR20SU XEC-DR30SU XEC-DR40SU XEC-DR60SU XEC-DR30E Main Unit XEC-DR20E XEC-DR14E XEC-DR10E XEC-DN30E XEC-DN20E XEC-DN14E XEC-DN10E XEC-DP30E XEC-DP20E XEC-DP14E XEC-DP10E...
  • Page 40 Chapter 4 CPU Specifications Consumption current Type Model (Unit : ㎃) XBL-C21A XBL-C41A XBL-EMTA XBL-EIMT/F/H 280/670/480 Communication Expansion module XBL-EIPT XBL-CMEA XBL-CSEA XBO-DC04A XBO-TN04A XBO-AD02A XBO-DA02A Option module XBO-AH02A XBO-RD01A XBO-TC02A XBO-RTCA XBO-M2MB 4-10...
  • Page 41 Chapter 4 CPU Specifications 4.4 Calculation Example of Consumption Current/Voltage Calculate the consumption current and configure the system not to exceed the output current capacity of basic unit. (1) XGB PLC configuration example 1 Consumption of current/voltage is calculated as follows. Internal 5V consumption Type...

  • Page 42: Data Backup Time

    Chapter 4 CPU Specifications (3) XGB PLC configuration example 3 Internal 5V consumption Type Model Unit No. Remark current (Unit : ㎃) Main unit XBC-DN32H When of all contact points are On. XBE-DR16A (Maximum consumption current) XBE-RY16A Expansion module XBF-AD04A All channel is used.

  • Page 43: Chapter 5 Program Configuration And Operation Method

    Chapter 5 Program Configuration and Operation Method Chapter 5 Program Configuration and Operation Method 5.1 Program Instruction 5.1.1 Program execution methods (1) Cyclic operation method (Scan) This is a basic program proceeding method of PLC that performs the operation repeatedly for the prepared program from the beginning to the last step, which is called ‘program scan’.

  • Page 44: Operation Processing During Momentary Power Failure

    Chapter 5 Program Configuration and Operation Method (2) Interrupt operation (Cycle time, Internal device) This is the method that stops the program operation in proceeding temporarily and carries out the operation processing which corresponds to interrupt program immediately in case that there occurs the status to process emergently during PLC program execution.

  • Page 45: Scan Time

    Chapter 5 Program Configuration and Operation Method 5.1.3 Scan time The processing time from program step 0 to the next step 0 is called ‘Scan Time’. (1) Scan time calculation expression Scan time is the sum of the processing time of scan program and interrupt program prepared by the user and PLC internal time, and is distinguished by the following formula.
  • Page 46 Chapter 5 Program Configuration and Operation Method (2) Example The scan time of a system consisting of main unit (program 4kstep) + five 32-point I/O modules + one analog module + one communication modules (200 byte 1 block) Scan time(㎲) = Scan program process ＋ System check & Task process ＋I/O data Refresh + Network Service + XG5000 Service + User Task Program process = (2047 x (0.67(LOAD)+ 0.80(OUT)) + (500) + (300 x 5) + (3000 x 1) + (800 x 1) + (100) ㎲...

  • Page 47: Scan Watchdog Timer

    Chapter 5 Program Configuration and Operation Method 5.1.4 Scan Watchdog timer WDT (Watchdog Timer) is the function to detect the program congestion by the error of hardware and software of PLC CPU module. (1) WDT is the timer used to detect the operation delay by user program error. The detection time of WDT is set in Basic parameter of XG5000.

  • Page 48: Program Execution

    Chapter 5 Program Configuration and Operation Method 5.2 Program Execution 5.2.1 Configuration of program All functional elements need to execute a certain control process which is called as a ‘program’. Program is stored in the built-in RAM mounted on a CPU module or flash memory of a external memory module. The following table shows the classification of the program. Program type Description ...
  • Page 49 Chapter 5 Program Configuration and Operation Method (1) Scan program (a) Function  This program performs the operation repeatedly from 0 step to last step in order prepared by the program to process the signal that is repeatedly regularly every scan. ...

  • Page 50: Interrupt

    Chapter 5 Program Configuration and Operation Method 5.2.3 Interrupt For your understanding of Interrupt function, this section describes program setting method of XG5000 which is XGB programming S/W.Example of interrupt setting is as shown bellows.  Interrupt setting Interrupt Interrupt name priority Task No.
  • Page 51 Chapter 5 Program Configuration and Operation Method (1) How to make Initialization task program Generate the task in the project window of XG5000 as below and add the program to be performed by each task. For further information, please refer to XG5000 user’s manual. (It can be additional when XG5000 is not connected with PLC.) (a) Click right button of mouse on project name and click 『Add item』-『Task』.
  • Page 52 Chapter 5 Program Configuration and Operation Method (c) Right click on registered task and select『Add Item』-『Program』. (d) Make initializing program. In initializing program, INIT_DONE instruction must be made. If not, Scan program is not executed. 5-10...
  • Page 53 Chapter 5 Program Configuration and Operation Method (2) How to make cycle time interrupt task program Generate the task in the project window of XG5000 as below and add the program to be performed by each task. For further information, please refer to XG5000 user’s manual. (It can be additional when XG5000 is not connected with PLC) (a) Right click on registered task and select『Add Item』-『Task』.
  • Page 54 Chapter 5 Program Configuration and Operation Method (b) Task type Classification Description Remark Character, number Task name Make Task name. available “2” is the highest priority Priority Set the priority of task. (2~7) number. Set the Task number.  Cycle time task (0 ~ 7): 8 ...
  • Page 55 Chapter 5 Program Configuration and Operation Method (d) Register the Program name and Program description. (e) Displays the program window to write task program. (f) Displays the setting in project window. 5-13...
  • Page 56 Chapter 5 Program Configuration and Operation Method (3) Task type Task type and function is as follows. Type External input task Cycle time task Internal device task Spec. ‘SU’ type ‘E’type Max. Task number Cyclic Rising or falling edge Rising or falling edge (setting up to max.
  • Page 57 Chapter 5 Program Configuration and Operation Method (e) Protection of Program in execution from Task Program 1) In case that the continuity of program execution is interrupted by high priority Task Program during program execution, it is available to prohibit the execution of Task Program partially for the part in problem. In this case, it is available to perform the program protection by ‘...
  • Page 58 Chapter 5 Program Configuration and Operation Method (a) Items to be set in Task Set the execution cycle and priority which are the start condition o f Task program to execution. Check the task no. to manage the task. (b) Cyclic task processing Performance the corresponding cyclic task program per setting time interval (execution cycle).
  • Page 59 Chapter 5 Program Configuration and Operation Method (a) Items to be set in Task Set the execution condition and priority to the task being executed. Check the task no. to manage the task. (b) I/O task processing If interrupt signal from external input is occurred on main unit (“SU” type: %IX0.0.0 ~ %IX0.0.7. ‘E’ type:%IX0.0.0~%IX0.0.3), task program is executed by external input.
  • Page 60 Chapter 5 Program Configuration and Operation Method (8) Verification of task program (a) Is the task setting proper? If task occurs frequently more than needed or several tasks occur in one scan at the same time, scan time may lengthen or be irregular.
  • Page 61 Chapter 5 Program Configuration and Operation Method Scan started Scan program stopped New scan started (Initial operation started) Scan program Program 1 10ms_Cycle time Program 2 Internal device_%MX0.0.0 Program 3 External I/O_%IX0.0.0 Time 6 7 8 10 12 20 22 24 25 30 32 34 Process per time Time (㎳)

  • Page 62: Operation Mode

    Chapter 5 Program Configuration and Operation Method 5.3 Operation Mode For operation mode of CPU module, there are 3 types such as RUN mode, STOP mode and DEBUG mode.. The section describes the operation processing of each operation mode. 5.3.1 RUN mode This is the mode to executed program operation normally.

  • Page 63: Stop Mode

    Chapter 5 Program Configuration and Operation Method 5.3.2 STOP mode This is the stop state mode without Program operation. It transmits the program through XG5000 only in STOP mode. (1) Processing at Mode Change Clear the output image area and execute output refresh. (2) Operation Processing Contents (a) Executes I/O refresh.
  • Page 64 Chapter 5 Program Configuration and Operation Method Item Description Remark Start/Stop Debugging Change the debug ↔ stop mode It starts debug operation. Step Over It operates by 1 step. Other operation Step Into It come in the subroutine program. is identical to Step Out It go out the subroutine program.
  • Page 65 Chapter 5 Program Configuration and Operation Method (c) Step Over ▪ Run the program to next step. At break point, Current indicator is displayed. Motor1 error 1 Stop Motor2 error 2 Stop (d) Breakpoint List ▪ It displays current Breakpoint List. It supports Select All, Reset All, Goto, Remove, Remove All. 5-23...
  • Page 66 Chapter 5 Program Configuration and Operation Method (e) Break condition ▪ It sets Variable Break and Scan Break. Remark 1) Refer to XG5000 User’s Manual ‘Chapter 12 Debugging’ for detailed information. 5-24...

  • Page 67: Change Operation Mode

    Chapter 5 Program Configuration and Operation Method 5.3.4 Change operation mode (1) Operation Mode Change Method The method change operation modes as follows. (a) By mode key of CPU module (b) By connecting the Programming And Debugging Tool (XG5000) to communication port of CPU (c) By changing the operation mode of other CPU module connected to network by XG5000 connected to communication port of CPU.

  • Page 68: Memory

    Chapter 5 Program Configuration and Operation Method 5.4 Memory There are two types of memory in CPU module that the user can use. One is Program Memory that saves the user program written by the user to build the system, and the other is Data Memory that provides the device area to save the data during operation. 5.4.1 Program memory Contents and size of program memory are as follows.

  • Page 69: Data Memory

    Chapter 5 Program Configuration and Operation Method 5.4.2 Data memory Contents and size of data memory are as follows Size Item ‘SU’ type ‘E’ type Data memory entire area 128 KB 128 KB System area :  I/O information table 81 KB 105 KB ...
  • Page 70 Chapter 5 Program Configuration and Operation Method (1) Initialization of data according to restart mode There are three variable related with restart mode (Default, initialization and retain variable). Initialization method about each variable in case of executing restart mode is as follows. Mode COLD WARM...

  • Page 71: Data Memory Map

    Chapter 5 Program Configuration and Operation Method 5.5 Data Memory Map 5.5.1 ‘E’ type Data area User program area Automatic variable Parameter area (8 KB) User program area Input variable %IX0.0.0 (50 KB) (256 B) ‘I’ %IX2.15.63 Output variable %QX0.0.0 (256B) ‘Q’...
  • Page 72 Chapter 5 Program Configuration and Operation Method 5.5.2 ‘SU’ type Data area User program area Automatic variable Parameter area (16 KB) User program area Input variable %IX0.0.0 (200 KB) (2 KB) ‘I’ %IX15.15.63 Output variable %QX0.0.0 (2 KB) ‘Q’ %QX15.15.63 Direct variable M area %MW0 (8 KB)

  • Page 73: Chapter 6 Cpu Functions

    Chapter 6 CPU Functions Chapter 6 CPU Functions 6.1 Type Setting It describes setting of XGB PLC type. CPU type Description Reference Series XGB-DR16C3 Dedicated product Modular type XGB-DR32HL Dedicated product Modular type XGB-XBCE “E” type : XBC-DR10/14/20/30E Compact type XGB-XBCH “H”...

  • Page 74: Parameter Setting

    Chapter 6 CPU Functions 6.2 Parameter Setting Describes how to set parameters. 6.2.1 Basic parameter setting Clicking Basic Parameter in the project window shows the following window. There are three main options ; “Basic Operation Setup” , “Device Area Setup” and “Error Operation Setup”. Category Item Description...

  • Page 75: I/O Parameter Setting

    Chapter 6 CPU Functions 6.2.2 I/O parameter setting This sets and reserves each I/O information. Clicking 『I/O Parameter』 in the project window shows the following setting window. Clicking 『Module』 in 『Slot Position』 indicates a list of modules, in which you may set I/O corresponding to the actual system. Then, the following window is displayed.

  • Page 76: Self-Diagnosis Function

    Chapter 6 CPU Functions 6.3 Self-diagnosis Function 6.3.1 Saving of error log CPU module logs errors occurred so that the causes will be identified and fixed easily. Clicking 『Error/Warning』 of 『Online』 shows the current error and previous error log. Item Description Remarks Error/Warning...

  • Page 77: Troubleshooting

    Chapter 6 CPU Functions 6.3.2 Troubleshooting (1) Trouble types Malfunction occurs due to PLC itself, system configuration error or abnormal operation result detected. Trouble is divided into trouble mode stopping operation for the safety and warning mode generating alert to user with a mode in trouble. The causes for PLC system malfunction are as follows.

  • Page 78: Remote Functions

    Chapter 6 CPU Functions 6.4 Remote Functions CPU module may change operation by communication as well as by key switches mounted on the module. To operate it remotely, it is necessary to set ‘RUN/STOP’ switch to ‘STOP’. (1) Remote operations are as follows (a) Operable by accessing to XG5000 through RS-232C port mounted on CPU module.

  • Page 79: Forced Input/Output On And Off Function

    Chapter 6 CPU Functions 6.5 Forced Input/Output On and Off Function Force I/O function forces to turn I/O areas on or off, regardless of program results. 6.5.1 Force I/O setup Click『 Online 』-『 Force I/O 』. Item Description Module address Select Base and Slot Application Set whether to allow or not Force I/O...
  • Page 80 Chapter 6 CPU Functions 6.5.2 Processing time and processing method of Force Input/Output On and Off (1) Forced Input Regarding input, at the time of input refresh it replaces the data of contact set as Force On/Off among data read from input module with the data as Force and updates input image area.

  • Page 81: Direct Input/Output Operation

    Chapter 6 CPU Functions 6.6 Direct Input/Output Operation Refreshing I/O operates after completion of scan program. If data of I/O is changed while program is scanned, it does not refreshed at the changed moment. Refreshed I/O data is applied after ‘END’ instruction on program. In order to refresh I/O data during program execution, use ‘DIREC_IN, DIREC_OUT’...

  • Page 82: Diagnosis Of External Device

    Chapter 6 CPU Functions 6.7 Diagnosis of External Device This flag is provided for a user to diagnose any fault of external device and, in turn, execute halt or warning of the system. Use of this flag displays faults of external device without any complicated program prepared and monitors fault location without any specific device (XG5000 and etc) or source program.

  • Page 83: Allocation Of Input/Output Number

    Chapter 6 CPU Functions 6.8 Allocation of Input/Output Number Allocation of I/O number is to allocate an address to every I/O of each module to read data from input module and output data to output module when it executes operations. XGB series adopts 64 points occupation to every module.
  • Page 84 Chapter 6 CPU Functions (2) When allocating IO of IO parameter, allocation information is displayed. When using monitor function of XG5000, I/O allocation information is displayed. 6-12...

  • Page 85: Online Editing

    Chapter 6 CPU Functions 6.9 Online Editing It is possible to modify program and communication parameter during operation of PLC during control operation The following describes basic modification. For details of modifying program, refer to XG5000 Users Manual. The Items to be modified during operation are as follows. ...
  • Page 86 Chapter 6 CPU Functions (3) If you modify program, background color changes to indicate start of online editing. (4) Upon the modification of program, click 『Online』-『Write Modified Program』. 6-14...
  • Page 87 Chapter 6 CPU Functions (5) Upon the writing of program, click 『Online』-『End Online Editing』. (6) The program background returns and the program modification during run is completed. Remark ▪ For parameter modification during run, change each parameter on XG-PD and click『Online』-『Write Modified Program 』.

  • Page 88: Reading Input/Output Information

    Chapter 6 CPU Functions 6.10 Reading Input/Output Information It monitors information of individual modules consisted of XGB series system. (1) Click『Online』-『I/O Info』. Then, the information of each module connected to the system is monitored. (2) When details are clicked after selecting a module, it displays detail information of a selected module. 6-16...

  • Page 89: Monitoring

    Chapter 6 CPU Functions 6.11 Monitoring It monitors system information of XGB series system. (1) Clicking『Monitor』 displays the following sub-menus. (2) Items and descriptions Item Description Remarks Start/Stop Monitoring Designate the start and stop of monitor. Click for reverse turn. Pause Pause monitoring.
  • Page 90 Chapter 6 CPU Functions (a) Device monitoring It displays all data in each device area (b) Change current value It changes the current value of each device selected in the current program window. 6-18...
  • Page 91 Chapter 6 CPU Functions (c) Pausing conditions It stops monitoring if a device value set in the program corresponds. (d) Trend monitoring It displays device values graphically. 6-19...
  • Page 92 Chapter 6 CPU Functions (e) Custom events 1) It monitors detail information when an event set by a user occurs. Additional user event may be registered. 2) It sets basic setting and relative device. If rising edge of M0000 device occurs, it records the message of an alarm, “Out of order Water Tank 1” and the device values of %MX0,%MW50 are recorded.
  • Page 93 Chapter 6 CPU Functions 4) Monitor event history of custom event. 5) Double-clicking a number produced monitors the relative values of device and the detail message as follows. Remark ▪For details of monitor, refer to XG5000 User’s Manual. 6-21...

  • Page 94: Clear All Plc

    Chapter 6 CPU Functions 6.12 Clear All PLC Clear All PLC function clears program, parameter, password , data saved on PLC (1) How to clear all PLC (a) Click 『Online』-『Clear All PLC』. (b) After selection connection method, click 『Connect』 or 『OK』. (c) If you select 『Yes』...

  • Page 95: Chapter 7 Input/Output Specifications

    Chapter7 Input/Output Specifications Chapter 7 Input/Output Specifications 7.1 Introduction The section describes the notices when selecting digital I/O module used for XGB series. (1) For the type of digital input, there are two types such as current sink input and current source input. (2) The number of max.
  • Page 96 Chapter7 Input/Output Specifications (7) Relay life of Relay output module is shown as below. Max. life of Relay used in Relay output module is shown as below. AC 125V Resistive load DC 30V Resistive load AC 250V Resistive load Open/Close current (A)
  • Page 97 Chapter7 Input/Output Specifications (8) A clamped terminal with sleeve can not be used for the XGB terminal strip. The clamped terminals suitable for terminal strip are as follows 6.0mm or less 6.0mm or less (9) The cable size connected to a terminal strip should be 0.3~0.75㎟ stranded cable and 2.8㎜ thick. The cable may have different current allowance depending on the insulation thickness.
  • Page 98 Chapter7 Input/Output Specifications (a) Setting input filter 1) Click I/O Parameter』in the project window of XG5000 2) Click『Module』 at the slot location. 3) Set I/O module equipped.
  • Page 99 Chapter7 Input/Output Specifications 4) After setting I/O module, click Input Filter. 5) Set filter value.
  • Page 100 Chapter7 Input/Output Specifications (b) Setting output status when error occurs 1) Click Emergency Out in the I/O parameter setting window. 2) Click Emergency Output. If selected as Clear, the output will be Off. And if hold is selected, the output will be kept.

  • Page 101: Main Unit Digital Input Specifications

    Chapter7 Input/Output Specifications 7.2 Main Unit Digital Input Specifications 7.2.1 XEC-DR10E/DN10E/DP10E 6 point DC24V input (Source/Sink type) Model Main unit Specification XEC-DR10E XEC-DN10E XEC-DP10E Input point 6 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃...

  • Page 102: Xec-Dr14E/Dn14E/Dp14E 8Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.2 XEC-DR14E/DN14E/DP14E 8point DC24V input (Source/Sink type) Model Main unit Specification XBC-DR14E XEC-DN14E XEC-DP14E Input point 8 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current` About 4㎃ (Contact point 0~3: about 7㎃) Operation voltage range DC20.4~28.8V (Within ripple rate 5%) On voltage / On current...

  • Page 103: Xec-Dr20E/Dn20E/Dp20E 12Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.3 XEC-DR20E/DN20E/DP20E 12point DC24V input (Source/Sink type) Main unit Model XEC-DR20E XEC-DN20E XEC-DP20E Specification Input point 12 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (Contact point 0~3: about 7㎃) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 104: Xec-Dr30E/Dn30E/Dp30E 18Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.4 XEC-DR30E/DN30E/DP30E 18point DC24V input (Source/Sink type) Model Main unit Specification XEC-DR30E XEC-DN30E XEC-DP30E Input point 18 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (Contact point 0~3: about 7㎃) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 105: Xec-Dn20Su/Dr20Su 12 Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.5 XEC-DN20SU/DR20SU 12 point DC24V input (Source/Sink type) Mode Main unit Specification XEC-DN20SU XEC-DR20SU Input point 12 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (Contact point 0~3: about 7㎃) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 106: Xec-Dn30Su/Dr30Su 18 Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.6 XEC-DN30SU/DR30SU 18 point DC24V input (Source/Sink type) Model Main unit Specification XEC-DN30SU XEC-DR30SU Input point 18 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (point 0~1: about 16㎃, point 2~7: about 10mA) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 107: Xec-Dn40Su/Dr40Su 24 Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.7 XEC-DN40SU/DR40SU 24 point DC24V input (Source/Sink Type) Model Main unit Specification XEC-DN40SU XEC-DN40SU Input point 24 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (point 0~1: about 16㎃, point 2~7: about 10㎃) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 108: Xec-Dn60Su/Dr60Su 36 Point Dc24V Input (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.2.8 XEC-DN60SU/DR60SU 36 point DC24V input (Source/Sink Type) Model Main unit Specification XEC-DN60SU XEC-DR60SU Input point 36 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ (point 0~1: about 16㎃, point 2~7: about 10㎃) Operation voltage range DC20.4~28.8V (within ripple rate 5%) On voltage / On current...

  • Page 109: Main Unit Digital Output Specifications

    Chapter7 Input/Output Specifications 7.3 Main Unit Digital Output Specification 7.3.1 XEC-DR10E 4 point relay output Model Main unit Specification XEC-DR10E Output point 4 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min.

  • Page 110: Xec-Dr14E 6 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.2 XEC-DR14E 6 point relay output Model Main unit Specification XEC-DR14E Output point 6 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 111: Xec-Dr20E 8 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.3 XEC-DR20E 8 point relay output Model Main unit Specification XEC-DR20E Output point 8 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 112: Xec-Dr30E 12 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.4 XEC-DR30E 12 point relay output Model Main unit Specification XEC-DR30E Output point 12 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 113: Xec-Dn10E 4 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.5 XEC-DN10E 4 point transistor output (Sink type) Model Main unit Specification XEC-DN10E Output point 4 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 114: Xec-Dn14E 6 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.6 XEC-DN14E 6 point transistor output (Sink type) Model Main unit Specification XEC-DN14E Output point 6 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 115: Xec-Dn20E 8 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.7 XEC-DN20E 8 point transistor output (Sink type) Model Main unit Specification XEC-DN20E Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 116: Xec-Dn30E 12 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.8 XEC-DN30E 12 point transistor output (Sink type) Model Main unit Specification XEC-DP30E Output point 12 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 117: Xec-Dp10E 4 Point Transistor Output (Source Type)

    Chapter7 Input/Output Specifications 7.3.9 XEC-DP10E 4 point transistor output (Source type) Model Main unit Specification XEC-DP10E Output point 4 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 118: Xec-Dp14E 6 Point Transistor Output (Source Type)

    Chapter7 Input/Output Specifications 7.3.10 XEC-DP14E 6 point transistor output (Source type) Model Main unit Specification XEC-DP14E Output point 6 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 119: Xec-Dp20E 8 Point Transistor Output (Source Type)

    Chapter7 Input/Output Specifications 7.3.11 XEC-DP20E 8 point transistor output (Source type) Model Main unit Specification XEC-DP20E Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 120: Xec-Dp30E 12 Point Transistor Output (Source Type)

    Chapter7 Input/Output Specifications 7.3.12 XEC-DP30E 12 point transistor output (Source type) Model Main unit Specification XEC-DP30E Output point 12 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage DC 10.2 ~ 26.4V range Max.

  • Page 121: Xec-Dn20Su 8 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.13 XEC-DN20SU 8 point transistor output (Sink type) Model Main unit Specification XEC-DN20SU Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 122: Xec-Dn30Su 12 Point Transistor Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.14 XEC-DN30SU 12 point transistor output (Sink type) Model Main unit XEC-DN30SU Specification Output point 12 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Operation load voltage range DC 10.2 ~ 26.4V Max.

  • Page 123: Xec-Dr20Su 8 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.15 XEC-DR20SU 8 point relay output Model Main unit Specification XEC-DR20SU Output point 8 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 124: Xec-Dr30Su 12 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.16 XEC-DR30SU 12 point relay output Model Main unit XEC-DR30SU Specification Output point 12 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM Min. load voltage/current DC5V / 1㎃ Max.

  • Page 125: Xec-Dn40Su 16 Point Tr Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.17 XEC-DN40SU 16 point TR output (Sink type) Model Main unit Specification XEC-DN40SU Output point 16 point Insulation method Photo-coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point) Off leakage current 0.1㎃...

  • Page 126: Xec-Dn60Su 24 Point Tr Output (Sink Type)

    Chapter7 Input/Output Specifications 7.3.18 XEC-DN60SU 24 point TR output (Sink type) Model Main unit Specification XEC-DN60SU Output point 24 point Insulation method Photo-coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max. load current 0.5A / 1point, 2A / 1COM (P40, P41: 0.1A / 1point) Off leakage current 0.1㎃...

  • Page 127: Xec-Dr40Su 16 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.19 XEC-DR40SU 16 point relay output Model Main unit Specification XEC-DR40SU Output point 16 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 128: Xec-Dr60Su 24 Point Relay Output

    Chapter7 Input/Output Specifications 7.3.20 XEC-DR60SU 24 point relay output Model Main unit Specification XEC-DR60SU Output point 24 point Insulation method Relay insulation Rated load DC24V 2A (resistive load) / AC220V 2A (COS = 1), 5A/COM voltage/current Min. load voltage/current DC5V / 1㎃ Max.

  • Page 129: Digital Input Module Specifications

    Chapter7 Input/Output Specifications 7.4 Digital Input Module Specification 7.4.1 8 point DC24V input module (Source/Sink type) Model DC input module Specification XBE-DC08A Input point 8 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ Operation voltage range DC20.4~28.8V (ripple rate <...
  • Page 130 Chapter7 Input/Output Specifications 7.4.2 16 point DC24V input module (Sink/Source type) Model DC input module Specification XBE-DC16A XBE-DC16B Input point 16 point Insulation method Photo coupler insulation Rated input voltage DC24V DC12/24V Rated input current About 4㎃ About 4/8㎃ DC20.4~28.8V Operation voltage range DC9.5~30V (ripple rate <...

  • Page 131: Point Dc24V Input Module (Source/Sink Type)

    Chapter7 Input/Output Specifications 7.4.3 32 point DC24V input module (Source/Sink type) Model DC input module Specification XBE-DC32A Input point 32 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ Operation voltage range DC20.4~28.8V (ripple rate < 5%) Input Derating Refer to Derating diagram On Voltage/Current...

  • Page 132: Digital Output Module Specifications

    Chapter7 Input/Output Specifications 7.5 Digital Output Module Specification 7.5.1 8 point relay output module Model Relay output module Specification XBE-RY08A Output point 8 point Insulation method Relay insulation Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COS = 1), 5A/COM Min.

  • Page 133: Point Relay Output Module (Independent Point)

    Chapter7 Input/Output Specifications 7.5.2 8 point relay output module (Independent point) Model Relay output module Specification XBE-RY08B Output point 8 point Insulation method Relay insulation Rated load voltage / Current DC24V 2A (Resistive load) / AC220V 2A (COS = 1), 2A/COM Min.
  • Page 134 Chapter7 Input/Output Specifications 7.5.3 16 point relay output module Model Relay output module Specification XBE-RY16A Output point 16 point Insulation method Relay insulation Rated load voltage/ current DC24V 2A (Resistive load) / AC220V 2A (COS = 1), 5A/COM Min. load voltage/current DC5V / 1㎃...

  • Page 135: Point Transistor Output Module (Sink Type)

    Chapter7 Input/Output Specifications 7.5.4 8 point transistor output module (Sink type) Model Transistor output module Specification XBE-TN08A Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
  • Page 136 Chapter7 Input/Output Specifications 7.5.5 16 point transistor output module (Sink type) Model Transistor output module Specification XBE-TN16A Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
  • Page 137 Chapter7 Input/Output Specifications 7.5.6 32 point transistor output module (Sink type) Model Transistor output module Specification XBE-TN32A Output point 32 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
  • Page 138 Chapter7 Input/Output Specifications 7.5.7 8 point transistor output module (Source type) Model Transistor output module Specification XBE-TP08A Output point 8 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
  • Page 139 Chapter7 Input/Output Specifications 7.5.8 16 point transistor output module (Source type) Model Transistor output module Specification XBE-TP16A Output point 16 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.
  • Page 140 Chapter7 Input/Output Specifications 7.5.9 32 point transistor output module (Source type) Model Transistor output module Specification XBE-TP32A Output point 32 point Insulation method Photo coupler insulation Rated load voltage DC 12 / 24V Load voltage range DC 10.2 ~ 26.4V Max.

  • Page 141: Combined Digital I/O Module Input Specification

    Chapter7 Input/Output Specifications 7.6 Combined Digital I/O module Input Specification 7.6.1 8 point DC24V input (Source/Sink type) Model DC input module Specification XBE-DR16A Input point 8 point Insulation method Photo coupler insulation Rated input voltage DC24V Rated input current About 4㎃ Operation voltage range DC20.4~28.8V (within ripple rate 5%) On Voltage/Current...

  • Page 142: Combined Digital I/O Module Output Specification

    Chapter7 Input/Output Specifications 7.7 Combined Digital I/O module Output Specification 7.7.1 8 point relay output Model Relay output module Specification XBE-DR16A Output point 8 point Insulation method Relay insulation Rated load DC24V 2A(Resistive load) / AC220V 2A(COS = 1), 5A/COM voltage / Current Min.

  • Page 143: Built-In High-Speed Counter Function

    Chapter8 Built-in High-speed Counter Function Chapter 8 Built-in High-speed Counter Function XGB series have built-in function of High-speed counter in main unit. This chapter describes specifications and usage of High-speed counter’s function. 8.1 High-speed Counter Specifications This section describes specifications, setting and usage of function, programming and wiring with external device of built-in main unit.
  • Page 144 Chapter8 Built-in High-speed Counter Function Description Classification ‘E’ type ‘SU’ type Auxiliary mode Count Latch (Program setting) Revolution per unit time (time setting value: 1~60,000ms) (2) Counter/Preset input specification Classification Spcification 24V DC (20.4V ~ 28.8V) Input voltage Input current 4㎃...

  • Page 145: Designation Of Parts

    Chapter8 Built-in High-speed Counter Function 8.1.2 Designation of parts (1) Designation of parts (a) ‘E’ type Names Usage Terminal 1-phase 2-phase 1-phase 2-phase IX0.0.0 Ch0 counter input Ch0 A-phase input Counter input terminal A-phase input Counter input terminal IX0.0.1 Ch1 counter input Ch0 B-phase input B-phase input IX0.0.2...
  • Page 146 Chapter8 Built-in High-speed Counter Function (2) Interface with external devices The internal circuit of High-speed counter is as shown below. (a)’E’ type On/Off Signal Terminal guaranteed Internal circuit 1-phase 2-phase voltage 20.4~28.8V Ch 0 Ch 0 IX0.0.0 2.7 k Pulse input A-phase input 6V or less 20.4~28.8V...
  • Page 147 Chapter8 Built-in High-speed Counter Function (b) ‘SU’ type On/Off Signal Terminal guaranteed Internal circuit 1-phase 2-phase voltage Ch 0 Ch 0 20.4~28.8V IX0.0.0 2.7 k Pulse input A-phase input 6V or less 20.4~28.8V Ch 1 Ch 0 IX0.0.1 Pulse input B-phase input 2.7 k...

  • Page 148: Type Functions

    Chapter8 Built-in High-speed Counter Function 8.1.3 “E” type Functions (1) Counter mode Speed counter module can count High Speed pulses which can not be processed by CPU High module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (- 2,147,483,648 ~ 2,147,483,647).
  • Page 149 Chapter8 Built-in High-speed Counter Function ● Operation example A-phase input pulse B-phase input pulse Count value Decreasing Increasing Increasing 2) 2-phase count mode a) 2-phase 2-multiplication operation mode A-phase input pulse and B-phase input pulse count at rising. If A-phase input is antecedent to B-phase input, increasing operation starts, and if B-phase input is antecedent to A-phase input, decreasing operation starts.
  • Page 150 Chapter8 Built-in High-speed Counter Function (2) Counter type 2 types of counts (Linear counter, Ring counter) can be selected for the applicable use based on functions. ▪ Counter mode is saved in the following special K area. Area per each channel (word) Mode Reference Ch.0...
  • Page 151 Chapter8 Built-in High-speed Counter Function (b) Ring count ■ Ring Count range: user-defined minimum value ~ user-defined maximum value ■ Count display: If Ring Counted, user-defined minimum value of Ring Count is counted and displayed, but the value is not displayed. •...
  • Page 152 Chapter8 Built-in High-speed Counter Function 2) During decreasing count ■ Even if count value exceeds user-defined minimum value during decreasing count, Borrow only occurs and count does not stop differently to Linear Count. Ring Count maximum value Present position Preset value ○:Not included ●:Included Ring Count...
  • Page 153 Chapter8 Built-in High-speed Counter Function 4) Operation when setting Ring Count based on present count value (during decreasing count) ■ If present count value exceeds user-defined range when setting Ring Count - Error (code no. 27) is occurred and it operates linear counter. ■...
  • Page 154 Chapter8 Built-in High-speed Counter Function (3) Compared output (a) High Speed counter module has a compared output function used to compare present count value with compared value in size to output as compared. (b) Available compared outputs are 2 for 1 channel, which can be used separately. (c) Compared output conditions are 7 associated with >, =, <...
  • Page 155 Chapter8 Built-in High-speed Counter Function ▪ In order to make external output, the compared equivalent output signal (%QX0.0.0~%QX0.0.15) must be set. If Compared output contact is Off, Compared coincidence output signal (internal device) is only output. Area per channel Classification Operation Ch.
  • Page 156 Chapter8 Built-in High-speed Counter Function (e) Detailed description for compared output 1) Mode 0 (Present value < Compared value) ■ If counted present value is less than min set value, output is sent out, and if present value increases to be equal to or greater than compared value, output is not sent out.
  • Page 157 Chapter8 Built-in High-speed Counter Function 3) Mode 2 (Count value = Compared value) ■ If present count value is equal to min set value, output is sent out. In order to turn the output Off, Compared output Enable and Compared output signal is to be On. Count value 123456 123457...
  • Page 158 Chapter8 Built-in High-speed Counter Function 5) Mode 4 (Count value > Compared value) ■ If present count value is greater than min set value, output is sent out, and if count value decreases to be less than or equal to compared value, output is not sent out. 123456 123457 123458...
  • Page 159 Chapter8 Built-in High-speed Counter Function 7) Mode 6 (Count value ≤ Compared output Min. value, Count value ≥ Compared output Max. value) ■ If present count value is less than or equal to compared output Min. value and greater than or equal to compared output Max.
  • Page 160 Chapter8 Built-in High-speed Counter Function (4) Carry signal (a) Carry signal occurs 1) When count range maximum value of 2,147,483,647 is reached during Linear Count. 2) When user-defined maximum value of Ring Count changed to the minimum value during Ring Count. (b) Count when Carry Signal occurs 1) Count stops if Carry occurs during Linear Count.
  • Page 161 Chapter8 Built-in High-speed Counter Function (6) Revolution/Unit time While auxiliary mode enable signal is On, it counts the number of input pulses for a specified time. (a) Setting 1) Input unit time and pulse number per 1 revolution Setting value is saved at the following special K are and user can designate it directly. Device area per channel Classification Channel 0...
  • Page 162 Chapter8 Built-in High-speed Counter Function Command 1000 Revolution per time (K264) 1000㎳ 1000㎳ 1000㎳ 1000㎳ (f) In order to indicate revolution per minute (RPM), the program is as shown below. During DMUL operation, RPM value is saved 64 bit in %DW100~%DW103. If operated RPM value is used, it can use to Word or Dword type according to system (case of RPM value is small number).
  • Page 163 Chapter8 Built-in High-speed Counter Function (g) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms is as shown below. Command 1000 Revolution per time 60000㎳ 60000㎳ 60000㎳ 60000㎳ (7) Count latch (a) When Count latch signal is On, present count value is latched.
  • Page 164 Chapter8 Built-in High-speed Counter Function (8) Preset function It changes the current value into preset value. There are two types of preset function, internal preset and external preset. External preset is fixed as input contact point. • Preset setting value is saved at the following special K area. Area per each channel (Double word) Type Ref.

  • Page 165: Su" Type Functions

    Chapter8 Built-in High-speed Counter Function 8.1.4 ‘SU’ type Functions (1) Counter mode (a) High Speed counter module can count High Speed pulses which can not be processed by CPU module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-2,147,483,648 ~ 2,147,483,647). (b) Available input is 1-phase input, 2-phase input and CW/ CCW input.
  • Page 166 Chapter8 Built-in High-speed Counter Function ● Operation example A-phase input pulse B-phase input pulse Count value Decreasing Increasing Increasing 2) 2-phase count mode a) 2-phase 4-multiplication operation mode A-phase input pulse and B-phase input pulse count at rising/falling respectively. If A-phase input is antecedent to B- phase input, increasing operation starts, and if B-phase input is antecedent to A-phase input, decreasing operation starts.
  • Page 167 Chapter8 Built-in High-speed Counter Function (2) Counter mode 2 types of count (Linear counter, Ring counter) can be selected for the applicable use based on functions. ▪ Counter mode is saved at the following special K area. Area per each channel (word) Mode Ref.
  • Page 168 Chapter8 Built-in High-speed Counter Function (b) Ring count Set Ring Counter Min. Value and Max. value. Preset value and compared set value should be in range of ring counter min. value and max. value. • Ring counter max. and min value is saved at the following special K area. Area per each channel (Double word) type Ref.
  • Page 169 Chapter8 Built-in High-speed Counter Function 2) During decreasing count ■ Even if count value exceeds user-defined minimum value during decreasing count, Borrow only occurs and count does not stop differently to Linear Count. Ring Count maximum value Present position Preset value ○:Not included ●:Included Ring Count...
  • Page 170 Chapter8 Built-in High-speed Counter Function 4) Operation when setting Ring Count based on present count value (during decreasing count) ■ If present count value exceeds user-defined range when setting Ring Count - Error (code no. 27) is occurred and it operates linear counter. ■...
  • Page 171 Chapter8 Built-in High-speed Counter Function (3) Compared output (a) High Speed counter module has a compared output function used to compare present count value with compared value in size to output as compared. (b) Available compared outputs are 2 for 1 channel, which can be used separately. (c) Compared output conditions are 7 associated with >, =, <...
  • Page 172 Chapter8 Built-in High-speed Counter Function ■ In order to output the compared output signal, compared output enable flag set to ‘1’ after compared output condition set. Area per channel Classification Operation Ch. 0 Ch. 1 Ch. 2 Ch. 3 Ch. 4 Ch.
  • Page 173 Chapter8 Built-in High-speed Counter Function (e) Detail of comparator output It describes detail of comparator output (based on comparator output 0) 1) Mode 0 (Present value < Compared value) ■ If counted present value is less than the minimum value of compared output 0, output is sent out, and if present value increases to be equal to or greater than the minimum value of compared output 0, output is not sent out.
  • Page 174 Chapter8 Built-in High-speed Counter Function 3) Mode 2 (Count value = Compared value) ■ If present count value is equal to the minimum set value of compared output 0, output is sent out. In order to turn the output Off, Compared output Enable signal 0 or Compared Coincidence Output Enable signal 0 is to be Off. Count value 123456 123457...
  • Page 175 Chapter8 Built-in High-speed Counter Function 5) Mode 4 (Count value > Compared Output value) ■ If present count value is greater than the minimum set value of compared output 0, output is sent out, and if count value decreases to be less than or equal to the minimum set value of compared output 0, output is not sent out.
  • Page 176 Chapter8 Built-in High-speed Counter Function 7) Mode 6 (Count value ≤ Min. set value of Compared Output 0 or Count value ≥ Max. set value of Compared Output 0) ■ If present count value is less than or equal to the minimum set value of compared 0 and greater than or equal to the maximum set value of compared 0, output is sent out, and if count value increases/decreases to exceed compared value’s range, output is not sent out.
  • Page 177 Chapter8 Built-in High-speed Counter Function (4) Carry signal (a) Carry signal occurs 1) When count range maximum value of 2,147,483,647 is reached during Linear Count. 2) When user-defined maximum value of Ring Count changed to the minimum value during Ring Count. (b) Count when Carry Signal occurs 1) Count stops if Carry occurs during Linear Count.
  • Page 178 Chapter8 Built-in High-speed Counter Function (6) Revolution/Unit time While the Flag about the number of revolution per unit time is On, it counts the number of input pulses for a specified time. (a) Setting 1) Set the unit time and the number of pulse per 1 revolution. Setting value is saved at the following special K area and user can designate directly.
  • Page 179 Chapter8 Built-in High-speed Counter Function (b) Count function of Revolution/Unit time is used to count the number of pulses for a specified time while auxiliary mode enable signal is On. (c) With the displayed number of pulses updated for a specified time and the number of pulses per revolution input, Revolution/Unit time can be counted.
  • Page 180 Chapter8 Built-in High-speed Counter Function (g) The example that number of pulse per 1 revolution set to ‘10’ and time is set to 60,000 ms is as shown below. Command 1000 Revolution per time 60000㎳ 60000㎳ 60000㎳ 60000㎳ (7) Count latch When Count latch signal is On, present count value is latched.
  • Page 181 Chapter8 Built-in High-speed Counter Function (8) Preset function It changes the current value into preset value. There are two types of preset function, internal preset and external preset. External preset is fixed as input contact point. • Preset setting value is saved at the following special K area. Area per each channel (Double word) Type Ref.

  • Page 182: Installation And Wiring

    Chapter8 Built-in High-speed Counter Function 8.2 Installation and Wiring 8.2.1 Precaution for wiring Pay attention to the counteractions against wiring noise especially for High-speed pulse input. (1) Make sure to use twisted pair shielded cable, grounded with 3 class applied. (2) Keep away from power cable or I/O line which may cause noise.

  • Page 183: Internal Memory

    Chapter8 Built-in High-speed Counter Function 8.3 Internal Memory 8.3.1 Special area for High-speed counter Parameter and operation command area of built-in high-speed counter use a special K device. If values set in parameter are changed, it works with the changed values. At the moment, makes sure to use APM_WRT function to save the changed value to flash.
  • Page 184 Chapter8 Built-in High-speed Counter Function (1) ’E’ type (a) Parameter setting Description Device area per channel Parameter Remark Value Setting Ch 0 Ch 1 Ch 2 Ch 3 h0000 Linear count Word Counter mode %KW300 %KW330 %KW360 %KW390 h0001 Ring count h0000 1 phase 1 input 1 multiplication Pulse input...
  • Page 185 Chapter8 Built-in High-speed Counter Function (b) Operation command Device area per channel Parameter Ch 0 Ch 1 Ch 2 Ch 3 Counter enabling %KX2600 %KX2700 %KX2800 %KX2900 Internal preset designation of counter %KX2601 %KX2701 %KX2801 %KX2901 External preset enabling of counter %KX2602 %KX2702 %KX2802...
  • Page 186 Chapter8 Built-in High-speed Counter Function (2) ‘SU’ type (a) Parameter setting Description Device area per channel Remark Parameter Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 h0000 Linear count Word Counter mode h0001 Ring count...
  • Page 187 Chapter8 Built-in High-speed Counter Function Description Device area per channel Remark Parameter Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 Ring counter min. -2,147,483,648 ~ 2,147,483,645 DWord value setting 1114 1129 1144 1159...
  • Page 188 Chapter8 Built-in High-speed Counter Function Description Device area per channel Parameter Remark Ch 0 Ch 1 Ch 2 Ch 3 Value Setting Ch 4 Ch 5 Ch 6 Ch 7 HFFFF No use h0000 %QX0.0.0 h0001 %QX0.0.1 h0002 %QX0.0.2 h0003 %QX0.0.3 h0004 %QX0.0.4...
  • Page 189 Chapter8 Built-in High-speed Counter Function (b) Operation command Device area per channel Parameter Ch 0 Ch 1 Ch 2 Ch 3 Ch 4 Ch 5 Ch 6 Ch 7 Counter enabling %KX4160 %KX4320 %KX4480 %KX4640 %KX34880 %KX35040 %KX35200 %KX35360 Internal preset designation of %KX4161 %KX4321 %KX4481 %KX4641 %KX34881 %KX35041 %KX35201 %KX35361 counter External preset enabling of...

  • Page 190: Error Code

    Chapter8 Built-in High-speed Counter Function 8.3.2 Error code It describes errors of the built-in high-speed counter. ▪ Error occurred is saved in the following area. Device area per channel Category Remark Error code Word %KW266 %KW276 %KW286 %KW296 %KW2186 %KW2196 %KW2206 %KW2216 ▪...

  • Page 191: Examples: Using High-Speed Counter

    Chapter8 Built-in High-speed Counter Function 8.4 Examples: Using High-speed Counter The section describes examples of using high-speed counter. (1) Setting high-speed counter parameter How to set types of parameters to operate a high-speed counter is described as follows. (a) Set 『 Internal Parameters 』 in the basic project window. (b) Selecting high-speed counter opens a window to set high-speed counter parameters as follows.
  • Page 192 Chapter8 Built-in High-speed Counter Function (c) Turn ‘ON’ the high-speed counter Enable signal (Ch0: :%KX4160) in the program. (d) To use additional functions of the high-speed counter, you needs to turn on the flag allowing an operation command. * Refer to 2) Operation Command, <8.3.1 Special K Area for High-speed Counter> For instance, turn on %KX4165 bit if among additional functions, rotation number function is used.
  • Page 193 Chapter8 Built-in High-speed Counter Function (2) Monitoring and setting command Monitoring and command setting of high-speed counter are described as follows. (a) When a monitor and clicking a Special Module Monitor are started, the following window is opened. 8-51...
  • Page 194 Chapter8 Built-in High-speed Counter Function (b) Clicking 『 Monitor 』 shows monitor and test window of high-speed counter. Item Description FLAG Monitor Show flag monitoring and command window of high-speed counter Start Monitoring Start monitoring each item (special K device area monitor). Write each item setting to PLC.
  • Page 195 Chapter8 Built-in High-speed Counter Function (c) Clicking 『 Start Monitoring 』 shows the high-speed counter monitor display, in which you may set each parameter. In this mode, changed values are not saved if power on or mode is changed. (d) Clicking 『 FLAG Monitor 』 shows the monitor of each flag in high-speed counter, in which you may direct operation commands by flags (clicking commands reverse turn).

  • Page 196: Battery

    Chapter9 RTC Option Board Chapter 9 RTC Option Board 9.1 Battery 9.1.1 Battery specification Item Specification Voltage/Current DC 3V / 220 mA Warranty period 3 years (ambient temp.) Program and data backup, Purpose RTC operation in case of power failure Specification Manganese Dioxide lithium battery ...

  • Page 197: How To Change Battery

    Chapter9 RTC Option Board 9.1.4 How to change battery A user should change the battery used to save the program and backup the data in case of power failure periodically. Though a user eliminate the battery, it works for 30 minute by super capacitor. Change the battery as fast as possible. Sequence changing battery is as follows.

  • Page 198: Rtc Function

    Chapter9 RTC Option Board 9.2 RTC Function Economic type (XBC-DxxxE), standard type (XBC-DxxxS, XBC-DxxxSU) doesn’t support RTC function. If you equip RTC option board, you can use this function for time management of system or error log. RTC function is executed steadily when power is off or instantaneous power cut status.
  • Page 199 Chapter9 RTC Option Board (c) Modification of clock data by program Variable Flag Content %FW210 _MON_YEAR_DT Month, year %FW211 _TIME_DAY_DT Hour, date %FW212 _SEC_MIN_DT Second, minute %FW213 _HUND_WK_DT Centaury, day Write clock data to temporary device (I,Q,M,R,W,F,K,L,U) and turn on/off input contact point. ( If date and day data is not matched, Write is not available.) Monitor and check the above special area (%FW53~%FW56) (d) How to express the day...

  • Page 200: Name And Function Of Each Part

    Chapter9 RTC Option Board 9.3 Name and Function of Each Part Describes the name and function of each part ① Hook for fixation ② Option board cover ③ Battery cover ④ Hook for fixation Name Contents ①④ Hook for fixation ▶ Hook for fixing the option board to main unit Option board ②...

  • Page 201: Dc Input Option Board Specification

    Chapter10 DC Input Option function Chapter 10 DC Input Option Function This chapter describes specifications and usage of input option board’s function. 10.1 DC input Option Board Specification 10.1.1 DC Input Option Board Specification Specification of XGB input option board is as follows. DC input specification Item XBO-DC04A...

  • Page 202: High Speed Counter Specification

    Chapter 10 DC Input Option Function 10.2 High Speed Counter Specification High speed counter function is built in XGB input option board. It describes specifications, setting and usage of function, programming and wiring with external device. 10.2.1 Performance Specification (1) Performance Specification Specification Item XBO-DC04A...

  • Page 203: Name Of Each Part

    Chapter10 DC Input Option function 10.2.2 Name of Each Part (1) Name of each part Name XBO-DC04A Structure Name Usage Terminal 1-phase 2-phase 1-phase 2-phase Counter input terminal A-phase input Ch0 counter input Ch0 A-phase input terminal B-phase input Counter input terminal Ch1 counter input Ch0 B-phase input terminal...

  • Page 204: Function

    Chapter 10 DC Input Option Function 10.2.3 Function (1)Counter mode (a) High Speed counter module can count High Speed pulses which can not be processed by CPU module’s counter instructions (CTU, CTD, CTUD, etc.), up to binary value of 32 bits (-2,147,483,648 ~ 2,147,483,647). (b) Available input mode is 1-phase input, 2-phase input (c) Count increasing/decreasing methods are as follows;...
  • Page 205 Chapter10 DC Input Option function • Operation example A-phase input pulse B-phase input pulse Count value Decreasing Increasing Increasing 2) 2-phase count mode a) 2-phase 2-multiplication A-phase input pulse and B-phase input pulse are counted at rising respectively. If A-phase input is antecedent to B- phase input, increasing operation starts, and if B-phase input is antecedent to A-phase input, decreasing operation starts.
  • Page 206 Chapter 10 DC Input Option Function (2) Counter type Option board supports linear counter. (a) Linear counter 1) Linear Count range: -2,147,483,648 ~ 2,147,483,647 2) If count value reaches the maximum value while increased, Carry will occur, and if count value reaches the minimum value while decreased, Borrow will occur.
  • Page 207 Chapter10 DC Input Option function (5) Count latch (a) When Count latch signal is On, present count value is latched (b) Setting If present counter value is to latch, Count Latch function is set ‘Use’. Device area per channel Type Ref.

  • Page 208: Installation And Wiring

    Chapter 10 DC Input Option Function 10.3 Installation and Wiring 10.3.1 Precaution for wiring Pay attention to the counteractions against wiring noise especially for High-speed pulse input (1) Make sure to use twisted pair shielded cable, grounded with 3 class applied. (2) Keep away from power cable or I/O line which may cause noise.
  • Page 209 Chapter10 DC Input Option function (2) When pulse generator is open collector type Pulse Generator 10-9...

  • Page 210: Internal Memory

    Chapter 10 DC Input Option Function 10.4 Internal Memory 10.4.1 Special area for High-speed counter U device is used for parameter and operation command area of built-in high-speed counter. This chapter describes how to register basic paramter and each item. (1) U device auto-registration (a) Set the module at slot in [I/O parameter] (b) Double-click [Variable/comment]...
  • Page 211 Chapter10 DC Input Option function (d) Click ‘Yes’. (e) Variables are registered as follows. Remark When registered by “auto-registration”, data type is expressed as BIT, WORD. If you want to check with other types such as DINT, DWORD, change the type. 10-11...
  • Page 212 Chapter 10 DC Input Option Function (2) No. 9 slot device area (a) Action command Device area per each channel Type Ref. Enable counter %UX0.9.0 %UX0.9.128 %UX0.9.256 %UX0.9.384 Enable internal preset %UX0.9.1 %UX0.9.129 %UX0.9.257 %UX0.9.385 Count inc/dec flag %UX0.9.3 %UX0.9.131 %UX0.9.259 %UX0.9.387 Latch counter enable...

  • Page 213: Error Code

    Chapter10 DC Input Option function (4)Parameter setup (a) Action command Device status information (based on slot 9, ch0) Type Ref. Information Enable counter %UX0.9.0 0: disable, 1: enable Enable internal preset %UX0.9.1 0: disable, 1: enable Count inc/dec flag %UX0.9.3 0: INC, 1: DEC Latch counter enable %UX0.9.6...

  • Page 214: Example Using High-Speed Counter

    Chapter 10 DC Input Option Function 10.5 Example using high-speed counter Describes option board high-speed counter example (1) High-speed counter setup Set up option board high-speed counter operation by using U area. (a) Select high-speed counter mode. Set up high-speed counter mode (b) If you need ‘Preset’...

  • Page 215: Xbo-Tn04A Specification

    Chapter11 TR Output Option Board Chapter11 TR Output Option Board This chapter describes specification and how to use the output option board. 11.1 XBO-TN04A Specification 11.1.1 Output option board specification Transistor output specification Item XBO-TN04A Remark 4 (Pulse output function is supported when mounted on No.

  • Page 216: Positioning Specification

    Chapter11 TR Output Option Board 11.2 Positioning Specification Positioning function is built in XGB output option board. This section describes specification, how-to-use, function, programming and wiring of built-in positioning. 11.2.1 Performance Specification (1) Performance Specification Model XBO-TN04A Item No. of axes Control method Position control, speed control Control unit...
  • Page 217 Chapter11 TR Output Option Board Connector Output point No. Description Remark Positioning X-axis pulse string output point X-axis Pulse (Open collector output) output Positioning Y-axis pulse string output point Y-axis (Open collector output) High Positioning X-axis direction output point Active X-axis Direction (Open collector output)

  • Page 218: Before Positioning

    Chapter11 TR Output Option Board 11.2.3 Before Positioning (1) Positioning function list Positioning function of XGB option board built-in positioning is as follows. Positioning description Instruction Ref. function Speed Operation Time pattern Start command Position control Dec. stop If the rising edge of start command is detected, it moves with designated speed to Operation designated position, and complete signal is on (dwell is not supported) Speed...
  • Page 219 Chapter11 TR Output Option Board (2) Position control Position control moves the designated axis from start address (present position) up to target address (movement). There are two position control methods, absolute and incremental. Control by absolute coordinates (Absolute coordinates) Object moves from start address to target address. Position control is performed, based on the address designated in Home Return (home address).

  • Page 220: Positioning Stop Factor

    Chapter11 TR Output Option Board 11.2.4 Positioning Stop Factor (1) Stop factor and how to deal with stop factor • If following factor occurs during positioning, it stops without completing positioning. In case positioning stops by stop instruction (STP, EMG) or following stop factor, generally, the only axis where stop instruction is executed or stop factor occurs stops.

  • Page 221: Manual Operation

    Chapter11 TR Output Option Board (d) Emergency stop • It immediately stops if it meets emergency stop while performing start-related instructions (indirect start, direct start, Home Return start, jog start). • Emergency stop generates Error 481. • Since it turns into “Output prohibited status” and “un-defined origin status”, once emergency stop is executed, execute origin determination (Home return, Current position preset) again to run an instruction that requires defined origin status”...
  • Page 222 Chapter11 TR Output Option Board 11.2.6 Home return XBO-TN04A supports only “Home return by DOG”. (a) When homing command (ORG instruction) is executed, it accelerates to home direction set in Home Parameter and it homes with high speed. (The above figure is example when homing direction is forward) (b) While target is homing with high speed, if rising edge of DOG (U9.1.B: X-axis) occurs, target speed decreases and change its direction.

  • Page 223: Positioning Basic Parameter Setup

    Chapter11 TR Output Option Board 11.2.7 Positioning Basic Parameter Setup This chapter describes how to register basic parameter of XGB main output option board positioning function and each item. (1) U device auto registration (a) Set up the module at the slot in [I/O Parameter] (b) Double-click [Variable/Comment].
  • Page 224 Chapter11 TR Output Option Board (d) Click ‘yes’. (e) Variables are registered as the screen below. Remark When variables are registered by above method, variables are expressed by BIT and WORD. If you want to check them as DINT, DOWRD, change the data type. 11-10...
  • Page 225 Chapter11 TR Output Option Board (2) Positioning parameter of XBO-TN04A U area of each item is as follows. U area for Signal Item Data type Status information positioning direction X-axis Y-axis BUSY 0: Stop, 1: Run %UX0.9.0 %UX0.9.256 Error 0: No error, 1: Error occurred %UX0.9.1 %UX0.9.257 Positioning complete...
  • Page 226 Chapter11 TR Output Option Board U area for Signal positioning Item Data type Status information direction X-axis Y-axis Bias speed WORD 1 ~ 10,000[pulse/s] %UW0.9.6 %UW0.9.22 Speed limit WORD 1 ~ 10,000[pulse/s] %UW0.9.7 %UW0.9.23 Acc. time WORD 0 ~ 10,000[unit: ms] %UW0.9.8 %UW0.9.24 Dec.

  • Page 227: Tr Output Option Board Operation Sequence Of Positioning

    Chapter11 TR Output Option Board 11.3 TR Output Option Board Operation Sequence of Positioning 11.3.1 Operation Sequence of Positioning Operation sequence is as follows. Positioning function of the option board operates only at slot number 9. 11-13...

  • Page 228: Positioning Instruction List

    Chapter11 TR Output Option Board 11.4 Positioning Instruction List Positioning instructions used in XBO-TN04A positioning are summarized as follows. (1) XBO-TN04A positioning instruction XGB built-in Instructi Command Command condition positioning manual Home return Slot, command axis 5.2.1 Slot, command axis, position, speed, dwell time, M code, control Direct start 5.2.3 word...

  • Page 229: Positioning Example

    Chapter11 TR Output Option Board 11.5 Positioning Example This chapter describes positioning example of XBO-TN04A. (1)Positioning setup Option board positioning is set up by U area. Set up each parameter to use positioning function. (a) Input each parameter value. (b) Turn On or Off according whether to use positioning 11-15...
  • Page 230 Chapter11 TR Output Option Board (c) Set up the function as follows. Monitoring You can check option board posioing speed, crrent position by regstering %UW0.9.4,% UW0.9.1(No. 9 slot, X-axis) at variable monitor window or program 11-16...

  • Page 231: Memory Module Specification

    Chapter12 Memory Module Chapter12 Memory Module 12.1 Memory Module Specification You can save user program safely or download user program to PLC without special handling when user program is damaged by using external memory module in XGB PLC 12.1.1 Memory module specification Item XBO-M2MB Ref.

  • Page 232: How To Use Memory Module

    Chapter12 Memory Module 12.1.3 How to use memory module (1) Save program, parameter, communication parameter at external memory module (a) Set the switch of memory module as 1 (b) Install memory module at the RS-232C port of main unit - After installation, program and parameter (including communication) is saved into memory module and READ LED is on - If Saving program and parameter is complete, READ LED is off (c) Separate memory module from main unit (2) Save user program of external memory module at main unit...
  • Page 233 Chapter12 Memory Module (c) ‘Write’ window is created as follows. (d) “Writing completed” window appears. (e) With above method, through XG5000, you can save program, parameter, communication parameter at XBO-M2MB (4) Open from memory module (a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC (b) Select “Project ...
  • Page 234 Chapter12 Memory Module (c) “Read” window is created as follows. (d) “Reading is completed” window appears. (e) With above method, through XG5000, you can save program, parameter, communication parameter from XBO-M2MB 12-4...
  • Page 235 Chapter12 Memory Module (5) Write to Memory module (a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port (b) Click “Online  Write to Memory module” on XG-PD menu (c) If you click “OK” button, it saves each parameter at the memory module. (d) If “Enable Link”...
  • Page 236 Chapter12 Memory Module (e) “Enable, Disable” window appears 12-6...
  • Page 237 Chapter12 Memory Module (6) Read from Memory module (a) Set the mode switch of XBO-M2MB as “5” and connect XBO-M2MB to USB port of PC (b) Select “Online  Read from Memory module” on XG-PD menu. (c) If you click “OK” button”, it read each parameter form the memory module. Remark -.

  • Page 238: How To Use When Password Is Set

    Chapter12 Memory Module 12.1.4 How to use when password is set (1) When connecting XG5000 with memory module (a) When setting password at program and writing program to memory module, it is saved according to rotary switch operating mode without functions cancelling the password 1) When writing program, check whether to use password at ‘Write’...
  • Page 239 Chapter12 Memory Module (2) Write to PLC by memory module (a) When password of program in memory module is not set 1) When no password is set in PLC - Saves program of the memory module in PLC 2) When password is set in PLC - Writing is not executed (b) When password of program in memory module is set 1) When no password is set in PLC...
  • Page 240 Chapter12 Memory Module (3) Reading program in PLC to memory module (a) When password of program in PLC is not set 1) When no password is set in the memory module - Reads program from PLC 2) When password is set in the memory module - After reading, it clears password of the memory module (b) When password of program in PLC is set 3) When no password is set in the memory module...

  • Page 241: Safety Instruction

    Chapter13 Installation and Wiring Chapter 13 Installation and Wiring 13.1 Safety Instruction Danger  Please design protection circuit at the external of PLC for entire system to operate safely because an abnormal output or an malfunction may cause accident when any error of external power or malfunction of PLC module. (1) It should be installed at the external side of PLC to emergency stop circuit, protection circuit, interlock circuit of opposition action such as forward /reverse operation and interlock circuit for protecting machine damage such as upper/lower limit of positioning.
  • Page 242 Chapter13 Installation and Wiring Danger Don’t close the control line or communication cable to main circuit or power line. Distance should be more than 100mm. It may cause malfunction by noise. In case of controlling lamp load, heater, solenoid valve, etc. in case of Off -> On, large current (10 times of normal current) may flows, so consider changing the module to module that has margin at rated current.

  • Page 243: Fail Safe Circuit

    Chapter13 Installation and Wiring 13.1.1 Fail safe circuit (1) example of system design (When ERR contact point of power module is not used) In case of AC In case of AC . DC Power Power Check direct Trans Trans Trans current Fuse Fuse...
  • Page 244 Chapter13 Installation and Wiring (2) System design circuit example (When ERR contact point of power module is used) Power Checking Trans Trans Fuse Fuse current Signal input DC power %FX69 Start stop circuit Fuse %FX156 Timer setting PLC RUN output which DC input Available to start as signal is...
  • Page 245 Chapter13 Installation and Wiring (3) Fail safe countermeasure in case of PLC error Error of PLC CPU and memory is detected by self diagnosis but in case error occurs in IO control part, etc., CPU can detect the error. In this case, though it is different according to status error, all contact point is on or off, so safety may not be guaranteed.

  • Page 246: Plc Heat Calculation

    Chapter13 Installation and Wiring 13.1.2 PLC heat calculation (1) Power consumption of each part (a) Power consumption of module The power conversion efficiency of power module is about 70% and the other 30% is gone with heat; 3/7 of the output power is the pure power consumption.
  • Page 247 Chapter13 Installation and Wiring (e) Input average power consumption of input module (power consumption of simultaneous On point)  W X E X input point X simultaneous On rate (W) : input current (root mean square value in case of AC) (A) E : input voltage (actually used voltage) (V) (f) Power consumption of special module power assembly ...

  • Page 248: Attachment/Detachment Of Modules

    Chapter13 Installation and Wiring 13.2 Attachment/Detachment of Modules 13.2.1 Attachment/Detachment of modules Caution in handling Use PLC in the range of general specification specified by manual. In case of usage out of range, it may cause electric shock, fire, malfunction, damage of product. Remark ...
  • Page 249 Chapter13 Installation and Wiring (2) Detachment of module  Get up the hook for fixation of upper part and lower part and disconnect it.  Detach the module with two hands. (Do not apply excessive force) Hook for module fixation Remark ...
  • Page 250 Chapter13 Installation and Wiring (3) Installation of module XGB PLC has a hook for DIN rail (rail width: 35mm) so that cab be installed at DIN rail. (a) In case of installing at DIN rail  Pull the hook as shown below for DIN rail at the bottom of module and install it at DIN rail ...
  • Page 251 Chapter13 Installation and Wiring (4) Module equipment location Keep the following distance between module and structure or part for ventilation, easy detachment and attachment. 30㎜ or above 20㎜or above 30㎜or above 5㎜ or above 5㎜ or above *1 : In case height of wiring duct is less than 50 mm (except this 40mm or more) *2 : In case of equipping cable without removing near module, 20mm or more *3 : In case of connector type, 20mm or above (5) Module equipment direction...
  • Page 252 Chapter13 Installation and Wiring (6) Distance with other device To avoid radiation noise or heat, keep the distance between PLC and device (connector and relay) as far as the following figure. Device installed in front of PLC: 100 ㎜ or more Device installed beside PLC: 50 ㎜...

  • Page 253: Caution In Handling

    Chapter13 Installation and Wiring 13.2.2 Caution in handling Here describes caution from open to install  Don’t drop or impact product.  Don’t disassemble the PCB from case. It may cause an error.  In case of wiring, make sure foreign substance not to enter upper part of module.

  • Page 254: Wire

    Chapter13 Installation and Wiring 13.3 Wire In case using system, it describes caution about wiring. Danger When wiring, cut off the external power. If all power is cut, it may cause electric shock or damage of product. In case of flowing electric or testing after wiring, equip terminal cover included in product. It not, it may cause electric shock. Remark ...
  • Page 255 Chapter13 Installation and Wiring (3) Isolate the PLC power, I/O devices and power devices as follows. Main unit Main power Constant power Voltage AC220V AC100-240V Transformer IO power Main circuit device (4) If using DC24V of the main unit (a) Do not connect DC24V of several power modules in parallel. It may cause the destruction of a module. (b) If a power module can not meet the DC24V output capacity, supply DC24V externally as presented below.

  • Page 256: O Device Wiring

    Chapter13 Installation and Wiring (8) To prevent surge from lightning, use the lightning surge absorber as presented below. I/O device Surge absorber to prevent lighting Remark (1) Isolate the grounding(E1) of lightning surge absorber from the grounding(E2) of the PLC. (2) Select a lightning surge absorber type so that the max.

  • Page 257: Grounding Wiring

    Chapter13 Installation and Wiring 13.3.3 Grounding wiring (1) The PLC contains a proper noise measure, so it can be used without any separate grounding if there is a large noise. However, if grounding is required, please refer to the followings. (2) For grounding, please make sure to use the exclusive grounding.

  • Page 258: Specifications Of Wiring Cable

    Chapter13 Installation and Wiring 13.3.4 Specifications of wiring cable The specifications of cable used for wiring are as follows. Cable specification (mm Types of external connection Lower limit Upper limit Digital input 0.18 (AWG24) 1.5 (AWG16) Digital output 0.18 (AWG24) 2.0 (AWG14) Analogue I/O 0.18 (AWG24)

  • Page 259: Maintenance And Inspection

    Chapter14 Maintenance Chapter 14 Maintenance Be sure to perform daily and periodic maintenance and inspection in order to maintain the PLC in the best conditions. 14.1 Maintenance and Inspection The I/O module mainly consist of semiconductor devices and its service life is semi-permanent. However, periodic inspection is requested for ambient environment may cause damage to the devices.

  • Page 260: Periodic Inspection

    Chapter14 Maintenance 14.3 Periodic Inspection Check the following items once or twice every six months, and perform corrective actions as needed. Check Items Checking Methods Judgment Corrective Actions 0 ~ 55 C Ambient temperature -. Measure with thermometer and Adjust to general standard Ambient Ambient Humidity 5 ~ 95%RH...

  • Page 261: Basic Procedure Of Troubleshooting

    Chapter 15 Troubleshooting Chapter 15 Troubleshooting The following explains contents, diagnosis and corrective actions for various errors that can occur during system operation. 15.1 Basic Procedure of Troubleshooting System reliability not only depends on reliable equipment but also on short downtimes in the event of fault. The short discovery and corrective action are needed for speedy operation of system.
  • Page 262 Chapter15 Troubleshooting 15.2.1 Troubleshooting flowchart used when the PWR (Power) LED turns Off. The following flowchart explains corrective action procedure used when the power is supplied or the power LED turns Off during operation. Power LED is turned Off. Is the power supply Supply the power.

  • Page 263: Troubleshooting Flowchart Used With When The Err(Error) Led Is Flickering

    Chapter 15 Troubleshooting 15.2.2 Troubleshooting flowchart used with when the ERR (Error) LED is flickering The following flowchart explains corrective action procedure used when the power is supplied starts or the ERR LED is flickering during operation. STOP LED goes flickering Check error code,...

  • Page 264: Troubleshooting Flowchart Used With When The Run,Stop Led Turns Off

    Chapter15 Troubleshooting 15.2.3 Troubleshooting flowchart used with when the RUN , STOP LED turns Off. The following flowchart explains corrective action procedure to treat the lights-out of RUN LED when the power is supplied, operation starts or is in the process. RUN, STOP LED is Off.
  • Page 265 Chapter 15 Troubleshooting 15.2.4 Troubleshooting flowchart used when the I/O part doesn’t operate normally. The following flowchart explains corrective action procedure used when the I/O module doesn’t operate normally. When the I/O module doesn’t work normally. Is the output LED of SOL1 Replace the connector of Correct wiring.
  • Page 266 Chapter15 Troubleshooting Continue Are the indicator LED of the switch 1 and 2 on? Check voltage of switch 1,2 by Check voltage of switch 1,2 by tester tester Is the Is the measured value Is the measured value terminal screw tighten normal? normal? securely?

  • Page 267: Troubleshooting Questionnaire

    Chapter 15 Troubleshooting 15.3 Troubleshooting Questionnaire If any problem occurs during the operation of XGB series, please write down this Questionnaires and contact the service center via telephone or facsimile.  For errors relating to special or communication modules, use the questionnaire included in the User’s manual of the unit. 1.

  • Page 268: Troubleshooting Examples

    Chapter15 Troubleshooting 15.4 Troubleshooting Examples Possible troubles with various circuits and their corrective actions are explained. 15.4.1 Input circuit troubles and corrective actions The followings describe possible troubles with input circuits, as well as corrective actions. Corrective Actions Cause Condition Leakage current of external device ...
  • Page 269 Chapter 15 Troubleshooting  Use only one power supply. Input signal  Sneak current due to the use of two different  Connect a sneak current prevention diode. doesn’t turn power supplies. off. DC input DC input  E1 > E2, sneaked. 15.4.2 Outpt circuit and corrective actions The following describes possible troubles with output circuits, as well as their corrective actions.
  • Page 270 Chapter15 Troubleshooting When the load is  Leakage current by surge absorbing circuit, which is  Drive the relay using a contact and drive the C-R type C-R type timer, connected to output element in parallel. timer using the since contact. time ...
  • Page 271 Chapter 15 Troubleshooting Output Surge current of the white lamp on.  To suppress the surge current make the dark transistor current of 1/3 to 1/5 rated current flow. destroyed. Output Output Sink type transistor output Output A surge current of 10 times or more when turned Source type transistor...

  • Page 272: Error Code List

    Chapter15 Troubleshooting 15.5 Error Code List Error code Error cause Action Operation Diagnosis (Dec) (restart mode after taking an action) status status point Program to execute is 0.5 second Start after reloading the program Warning RUN mode abnormal Flicker Start after reloading I/O parameter, Reset Battery change if battery has a problem.
  • Page 273 Chapter 15 Troubleshooting Error Action Operation Diagnosis Error cause code (restart mode after taking an action) status status point Data memory backup not If not error in battery, power reinput 1 second Warning Reset possible Remote mode is switched to STOP mode. Flicker second Ordinary...
  • Page 274 Appendix 1 Flag List Appendix 1 Flag List Appendix 1.1 Special Relay (F) List Word Variables Function Description %FD0 _SYS_STATE Mode and state Indicates PLC mode and operation State. %FX0 _RUN Run state. %FX1 _STOP Stop Stop state. %FX2 _ERROR Error Error state.
  • Page 275 Appendix 1 Flag List Word Variable Function Description %FX40 _BPRM_ER Basic parameter Basic parameter error. %FX41 _IOPRM_ER IO parameter I/O configuration parameter error. Special module parameter is %FX42 _SPPRM_ER Special module parameter Abnormal. Communication module Communication module parameter %FX43 _CPPRM_ER parameter is abnormal.
  • Page 276 Appendix 1 Flag List Word Variable Function Description %FW10 _USER_CLK User Clock Clock available for user setting. %FX160 _USR_CLK0 Setting scan repeat On/Off as much as set scan Clock 0. %FX161 _USR_CLK1 Setting scan repeat On/Off as much as set scan Clock 1. %FX162 _USR_CLK2 Setting scan repeat...
  • Page 277 Appendix 1 Flag List Word Variable Function Description %FW90 _IO_TYER_N Mismatch slot Module Type mismatched slot no. %FW91 _IO_DEER_N Detach slot Module detached slot no. %FW93 _IO_RWER_N RW error slot Module read/write error slot no. %FW95 _IP_IFER_N IF error slot Module interface error slot no.
  • Page 278 Appendix 1 Flag List Appendix 1.2 Communication Relay (L) List Here describes data link communication relay(L). (1) High-speed Link 1 Device Keyword Type Description High speed link parameter 1 normal operation of all station Indicates normal operation of all station according to parameter set in High speed link, and On under the condition as below.
  • Page 279 Appendix 1 Flag List (2) High-speed Link2 Device Keyword Type Description High-speed link parameter 2 normal operation of all station. Indicates normal operation of all station according to parameter set in High- speed link and On under the condition as below. %LX416 _HS2_RLINK 1.
  • Page 280 Appendix 1 Flag List (3) Common area Communication flag list according to P2P service setting. P2P parameter: 1~3, P2P block: 0~31 Device Keyword Type Description Indicates P2P parameter 1, 0 Block service %LX8192 _P2P1_NDR00 normal end. Indicates P2P parameter 1, 0 Block service %LX8193 _P2P1_ERR00 abnormal end.
  • Page 281 Appendix 2 Dimension Appendix 2 Dimension (Unit: mm) (1) Economy type main unit(“E”type) -. XEC-Dx10/14E -. XEC-Dx20/30E App.2-1...
  • Page 282 Appendix 2 Dimension (2) Standard type main unit(“SU”타입) -. XEC-Dx20/30SU - XEC-Dx40SU App2-2...
  • Page 283 Appendix 2 Dimension - XEC-Dx60SU App.2-3...
  • Page 284 Appendix 2 Dimension (3) Extension I/O module -. XBE-DC32A, XBE-TR32A -. XBE-RY16A App2-4...
  • Page 285 Appendix 2 Dimension -. XBE-DC08A, XBE-DC16A, XBE-TN08A, XBE-TN16A -. XBE-DR16A, XBE-RY08A App.2-5...
  • Page 286 Appendix 3 Compatibility with GLOFA Appendix 3 Compatibility with GLOFA Appendix 3.1 Compatibility of Flag Classification Type Contents Description Operation error latch flag which is on the basis of program block Operation error (PB), the error indication which occurs while program block _LER _LER BOOL...
  • Page 287 Appendix 3 Compatibility with GLOFA Classification Type Contents Description System error Handles error flags about fault of operation stop _CNF_ER WORD (heavy fault) as below. Error flag occurred when normal operation cannot be done due to diagnosis error of CPU _CPU_ER BOOL CPU Configuration error...
  • Page 288 Appendix 3 Compatibility with GLOFA Classification Type Contents Description System warning (light _CNF_WAR _CNF_WAR WORD Handles warning flag about continuation operation as below fault) _RTC_ERR _RTC_ERR BOOL RTC data error Indicates that RTC data is abnormal. Indicates that cold restart starts operation instead of hot or warm restart program, since data memory is destroyed by _D_BCK_ER _D_BCK_ER...
  • Page 289 Appendix 3 Compatibility with GLOFA Classification Type Contents Description When I/O configuration parameter for each slot is not matched with Mismatched practical module configuration or a specific module is applied in the wrong _IO_TYER_N _IO_TYER_N UINT module type slot location, it is displayed as the lowest slot number after detecting these number mismatch error in slot locations.
  • Page 290 Appendix 3 Compatibility with GLOFA Classification Type Contents Description Light fault detection Light fault of external device (detected by user program) is _ANC_WB[n] bit-map of external saved on bit-map. device (“0”value is not available.) Task Collision Bit- Displayed on bit-map when same task is operating or is ready _TC_BMAP[n] for operation.
  • Page 291 Appendix 3 Compatibility with GLOFA Classification Type Contents Description _CPU_TYPE _CPU_TYPE UINT CPU type information Indicates the type information of PLC CPU _VER_NUM _OS_VER UINT OS Version Number OS version number of PLC CPU Program memory module type _MEM_TYPE UINT Memory module type (0:unmounted, 1~5:Type) PLC mode and...
  • Page 292 Appendix 3 Compatibility with GLOFA Classification Type Contents Description GMWIN connection Indicates the connection state of CPU module and PADT state Local GMWIN Bit indicated connection state of local PADT connection _PADT_CNF BYTE Remote GMWIN Bit indicated connection state of remote PADT connection Remote communication...
  • Page 293 Appendix 4 Instruction List Appendix 4 Instruction List It’s a list of function and function block. For each function and function block, please refer to XGI/XGR/XEC user’s manuals for Instrurction Appendix 4.1 Basic Function Appendix 4.1.1 Type Conversion Function It converts each input data type into an output data type. Function Group Function Input data type...
  • Page 294 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks SINT_TO_INT SINT SINT_TO_DINT SINT DINT SINT_TO_LINT SINT LINT SINT_TO_USINT SINT USINT SINT_TO_UINT SINT UINT SINT_TO_UDINT SINT UDINT SINT_TO_ULINT SINT ULINT SINT_TO_*** SINT_TO_BOOL SINT BOOL SINT_TO_BYTE SINT BYTE SINT_TO_WORD SINT...
  • Page 295 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks LINT_TO_WORD LINT WORD LINT_TO_DWORD LINT DWORD LINT_TO_LWORD LINT LWORD LINT_TO_REAL LINT REAL LINT_TO_LREAL LINT LREAL LINT_TO_STRING LINT STRING USINT_TO_SINT USINT SINT USINT_TO_INT USINT USINT_TO_DINT USINT DINT USINT_TO_LINT USINT LINT...
  • Page 296 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks ULINT_TO_SINT ULINT SINT ULINT_TO_INT ULINT ULINT_TO_DINT ULINT DINT ULINT_TO_LINT ULINT LINT ULINT_TO_USINT ULINT USINT ULINT_TO_UINT ULINT UINT ULINT_TO_UDINT ULINT UDINT ULINT_TO_*** ULINT_TO_BOOL ULINT BOOL ULINT_TO_BYTE ULINT BYTE ULINT_TO_WORD ULINT...
  • Page 297 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks WORD_TO_STRING WORD STRING DWORD_TO_SINT DWORD SINT DWORD_TO_INT DWORD DWORD_TO_DINT DWORD DINT DWORD_TO_LINT DWORD LINT DWORD_TO_USINT DWORD USINT DWORD_TO_UINT DWORD UINT DWORD_TO_UDINT DWORD UDINT DWORD_TO_*** DWORD_TO_ULINT DWORD ULINT DWORD_TO_BOOL DWORD...
  • Page 298 Appendix 4 Instruction List Function Group Function Input data type Output data type Remarks DATE_TO_UINT DATE UINT DATE_TO_*** DATE_TO_WORD DATE WORD DATE_TO_STRING DATE STRING TOD_TO_UDINT UDINT TOD_TO_*** TOD_TO_DWORD DWORD TOD_TO_STRING STRING DT_TO_LWORD LWORD DT_TO_DATE DATE DT_TO_*** DT_TO_TOD DT_TO_STRING STRING SINT_TO_BCD_BYTE SINT BYTE(BCD) INT_TO_BCD_WORD...
  • Page 299 Appendix 4 Instruction List Appendix 4.1.2 Numerical Operation Function (1) Numerical Operation Function with One Input Function name Description Remarks General Function Absolute value operation SQRT Square root operation Log function Natural logarithm operation Common logarithm Base to 10 operation Natural exponential operation Trigonometric function Sine operation...
  • Page 300 Appendix 4 Instruction List Appendix 4.1.3 Bit Arrary Function (1) Bit-shift Function Function name Description Remarks Shift input to the left of N bit(the right is filled with 0) Shift input to the right of N bit (the left is filled with 0) Shift input to designated direction as much as N bit (carry) SHIFT_C_*** Rotate input to the left of N bit...
  • Page 301 Appendix 4 Instruction List Appendix 4.1.5 Data Exchange Function Function name Description Remarks Swaps upper NIBBLE for lower NIBBLE data of BYTE. SWAP_BYTE Swaps upper BYTE for lower BYTE data of WORD. SWAP_WORD Swaps upper WORD for lower WORD data DWORD. SWAP_DWORD Swaps upper DWORD for lower DWORD data of LWORD.
  • Page 302 Appendix 4 Instruction List Appendix 4.1.8 Date and Time of Day Function Function name Description Remarks ADD_TIME Add time (Time/time of day/date and time addition) SUB_TIME Subtract time (Time/time of day/date and time subtraction) SUB_DATE Calculate time by subtracting date from date SUB_TOD Calculate time by subtracting TOD from TOD SUB_DT...
  • Page 303 Appendix 4 Instruction List Appendix 4.1.9 System Control Function Function name Description Remarks Invalidates interrupt (Not to permit task program starting) Permits running for a task program STOP Stop running by a task program ESTOP Emergency running stop by a program DIREC_IN Update input data DIREC_O...
  • Page 304 Appendix 4 Instruction List Appendix 4.1.11 Data Manipulation Function Function name Description Remarks MEQ_*** Compare whether two inputs are equal after masking DIS_*** Data distribution UNI_*** Unite data BIT_BYTE Combine 8 bits into one BYTE BYTE_BIT Divide one BYTE into 8 bits BYTE_WORD Combine two bytes into one WORD WORD_BYTE...
  • Page 305 Appendix 4 Instruction List Appendix 4.2 GLOFA Function Function name Description(n can be extended up to 8) Remarks Output a position of On bit by number ENCO_B,W,D,L Turn a selected bit on DECO_B,W,D,L Output a number of On bit BSUM_B,W,D,L Convert BCD/HEX into 7-segment code SEG_WORD Move part of a bit string...
  • Page 306 Appendix 4 Instruction List Appendix 4.4 Basic Function Block Appendix 4.4.1 Bistable Function Block Function block name Description Remarks Set preference bistable Reset preference bistable Semaphore SEMA Appendix 4.4.2 Edge Detection Function Block Function block name Description Remarks R_TRIG Rising edge detector F_TRIG Falling edge detector Reverse output if input condition rises...
  • Page 307 Appendix 4 Instruction List Appendix 4.4.5 File Function Block No. Function block name Description Remarks EBREAD Read R area data from flash area EBWRITE Write R area data to flash area Appendix 4.4.6 Other Function Block No. Function block name Description Remarks SCON...
  • Page 308 Appendix 4 Instruction List Appendix 4.4.10 Positioning Function Block Function block name Description Remarks APM_ORG Return to original point run APM_FLT Floating original point setting APM_DST Direct run APM_IST Indirect run APM_LIN Linear interpolation run APM_SST Simultaneous run APM_VTP Speed/position control conversion APM_PTV Position/speed control conversion APM_STP...
  • Page 309 Appendix 4 Instruction List Appendix 4.5 Expanded Function Function name Description Remarks Repeat a block of FOR ~ NEXT n times NEXT BREAK Escape a block of FOR ~ NEXT CALL Call a SBRT routine SBRT Assign a routine to be called by the CALL function RETURN Jump to a place of LABLE INIT_DONE...
  • Page 310 3. Since the above warranty is limited to PLC unit only, make sure to use the product considering the safety for system configuration or applications. Environmental Policy LSIS Co.,Ltd. supports and observes the environmental policy as below. Environmental Management About Disposal LSIS considers the environmental LSIS’...
  • Page 311 2 Zhongshan Liu Road.Guangzhou.P.R China Tel : 86-20-8328-6754/Fax : 86-20-8326-6287 e-mail : chenxs@lsis.com.cn ※ LSIS constantly endeavors to improve its product so that 2012. 11 information in this manual is subject to change without notice. ⓒ LSIS Co., Ltd 2009 All Rights Reserved.

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