Panasonic eUniStone Application Note Design Manual page 5

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5.2
Smart Phone specifics............................................................................................... 32
5.2.1
Android Smart Phones .............................................................................................. 33
5.2.1.1
Registering service for Android compatibility .................................................. 33
5.2.1.2
in the phone ................................................................................................................. 34
5.2.1.3
5.2.2
Windows phone ........................................................................................................... 35
5.2.2.1
Registering service for Windows Phone ............................................................. 35
5.2.2.2
Bonding .......................................................................................................................... 36
5.2.2.3
Windows Phone Store, development and design ........................................... 36
5.2.2.4
Programming language for Windows Phone .................................................... 37
5.2.3
iPhone ............................................................................................................................. 37
5.2.3.1
Registering service for iPhone ............................................................................... 38
5.2.3.2
Bonding .......................................................................................................................... 39
5.2.3.3
iOS and MFi license .................................................................................................... 40
6
Reference Design Schematic ................................................................................. 41
7
Layout ............................................................................................................................. 44
7.1
Two layer PCB reference design ........................................................................... 44
7.2
General four layer PCB design .............................................................................. 46
7.2.1
Phase1: Layer Assignment .................................................................................... 46
7.2.1.1
Via Holes ........................................................................................................................ 47
7.2.2
Phase 2: Components Placement ....................................................................... 48
7.2.3
Phase 3: Routing ....................................................................................................... 48
7.2.3.1
Basic Hints..................................................................................................................... 48
7.2.3.2
Layout Specific Hints ................................................................................................. 48
8
Antenna .......................................................................................................................... 50
9
Test and Development Tools.................................................................................. 51
9.1
Tools available for development and testing ................................................... 51
9.1.1
SPP Toolbox .................................................................................................................. 51
Application Note
Design Guide
5
PAN1322
Revision 1.2, 2013-12-18

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