Panasonic ENW89841A3KF Manuals

Manuals and User Guides for Panasonic ENW89841A3KF. We have 1 Panasonic ENW89841A3KF manual available for free PDF download: User Manual

Panasonic ENW89841A3KF User Manual

Panasonic ENW89841A3KF User Manual (52 pages)

Intel's BlueMoonUniversal Platform Wireless Modules

Brand: Panasonic | Category: Control Unit | Size: 2.42 MB

Table of Contents

Table of Contents

4
List of Figures

6
List of Tables

7
1 General Device Overview

8
2 Basic Operating Information

15
- Power Supply
  15
- Clocking
  15
- Low Power Modes
  15
- Low Power Mode
  15
- Complete Power down
  15
- On/Off
  15
3 PAN1322-SPP Interfaces

16
- UART Interface
  16
- Uart
  16
- Baud Rates
  16
- Figure 4 UART Interface
  16
- Detailed UART Behavior
  17
- UARTCTS Response Time
  17
- Low Power Control
  17
- Figure 5 UARTCTS Response Time
  17
- Table 2 UART Baud Rates
  17
- Table 3 Default (Non-Inverted) Behavior of UART Signals
  17
4 General Device Capabilities

18
- RF Test Application
  18
- Firmware ROM Patching
  18
- Patch Support
  18
5 Ordering Information

18
6 Bluetooth Capabilities

19
- Supported Features
  19
- PAN1322-SPP Bluetooth Features
  19
- Secure Simple Pairing
  19
- Role Switch
  19
- Sniff Mode
  19
- Sniff Subrating
  19
- Enhanced Power Control
  19
- Encryption Pause and Resume
  20
7 Electrical Characteristics

21
- Absolute Maximum Ratings
  21
- Operating Conditions
  21
- Table 5 Absolute Maximum Ratings
  21
- Table 6 Operating Conditions
  21
- Table 5
  21
- DC Characteristics
  22
- Pad Driver and Input Stages
  22
- Table 7 Internal1 (1.5 V) Supplied Pins
  22
- Table 8 Internal2 (2.5 V) Supplied Pins
  22
- Table 9 VDDUART Supplied Pins
  22
- Table 10 VDD1 Supplied Pins
  23
- Onoff Pin
  23
- Pull-Ups and Pull-Downs
  24
- Protection Circuits
  24
- Table 12 Pull-Up and Pull-Down Currents
  24
- System Power Consumption
  25
- RF Part
  25
- Characteristics RF Part
  25
- Bluetooth Related Specifications
  25
- Table 13 Max. Load at the Different Supply Voltages
  25
- Table 14 BDR - Transmitter Part
  25
- Table 15 BDR - Receiver Part
  26
- Table 16 EDR - Transmitter Part
  27
8 Package Information

29
- Package Marking
  29
- Production Package
  29
- Figure 6 Package Marking
  29
- Figure 7 Production Package
  29
- Pin Mark
  30
- Figure 8 Top View and Bottom View
  30
9 Bluetooth Qualification and Regulatory Certification

31
10 Assembly Guidelines

37
- General Description of the Module
  37
- Printed Circuit Board Design
  37
- Figure 13 Pad Layout on the Module (Top View)
  37
- Figure 14 Cutout Drawing
  38
- Solder Paste Printing
  39
- Assembly
  39
- Component Placement
  39
- Pin Mark
  39
- Figure 15 Pin Marking
  39
- Package
  40
- Figure 16 Tape on Reel
  40
- Soldering Profile
  41
- Figure 17 Eutectic Lead-Solder Profile
  41
- Figure 18 Eutectic Leadfree-Solder Profile
  41
- Rework
  42
- Removal Procedure
  42
- Replacement Procedure
  42
- Alternative 1: Dispensing Solder
  42
- Alternative 2: Printing Solder
  43
- Inspection
  43
- Component Salvage
  43
- Figure 19 Solder Printing
  43
- Voids in the Solder Joints
  44
- Expected Void Content and Reliability
  44
- Parameters with an Impact on Voiding
  44
- Figure 20 X-Ray Picture Showing Voids Conforming to IPC-A-610D
  44
11 Terminology

46
12 References

50

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