Table 1. Specification Summary - Intel 845PE Thermal Design Manual

Introduction

Table 1. Specification Summary

(G)MCH
(G)MCH
(G)MCH
(G)MCH Heatsink
Maximum (G)MCH Local Ambient Temperature (T
Assumption [For use with Intel
Processors at or below the flexible motherboard 1
(FMB1) target.]
Maximum (G)MCH Local Ambient Temperature
Assumption [For use with Intel® Pentium® 4
Processors at or below the flexible motherboard 2
(FMB2) target.]
Minimum Airflow
82845PE MCH
82845GE GMCH
(G)MCH
8
Package Dimensions
37.5 mm x 37.5 mm x 2.54 mm
Handling Keep out on Substrate
2 mm from edge of die
Max Allowable Die Pressure
400 kPa (this corresponds to 50 lbf load on die)
Heatsink Volume Keep outs
X:37.5 mm, Y:37.5 mm, Z:40 mm
Operating Environment
53 °C
)
A
® ®
Pentium 4
50 °C
50 lfm
Thermal Design Power (TDP)
5.6 W (333 MHz DDR, 533 MHz FSB, Discrete
Graphics)
6.3 W (333 MHz DDR, 533 MHz FSB, w/ Integrated
Graphics)
(G)MCH Maximum Case Temperature
92 °C
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
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