Quectel EP06 Manual page 41

EP06 Module
Thermal Pad
NOTES
Make sure that customers' PCB design provides sufficient cooling for the module: proper mounting,
1.
heatsinks, and active cooling may be required depending on the integrated application.
The module's internal temperature must be kept below 105°C to protect the components from
2.
damage when it is integrated to customers' applications. And the temperature can be queried by
AT+QTEMP command.
Thermal Pad
PCBA
Shielding Cover
MiniPCIe Connector
Application Board
Figure 14: Referenced Thermal Pad Design
EP06 Module
Application Board
40 / 50