System On A Chip (Soc); System Memory - Kontron COM Express COMe-bDV7 User Manual

3.3. System on a Chip (SoC)

The Intel® Atom® Denverton-NS product family is a SoC solution with integrated Platform Controller Hub (PCH).
The following table lists specific SoC features.
USB
SATA
LAN
VT-d
PCIe Clock Buffer

3.4. System Memory

Two DDR4 SODIMM sockets support a maximum of up to 32 GBytes (ECC/non ECC) system memory. As an option, four
DDR4 SODIMM can be assembled for a maximum of up to 64 GBytes of (ECC/non ECC) system memory, where the
two additional SODIMMs are assembled on the bottom side of the module, see Figure 6: Module Top and Bottom
SODIMM Assembly (Option).
The two additional SODIMM sockets on the bottom side of the module increase the height of the on-board
components and therefore modules assembled with four SODIMM sockets only fit on a carrier board with an
8 mm high COMe connector. This additional height requirement must be considered when designing the carrier board.
For more information, see Chapter 8.2.1: Module Height with Four SODIMM Memory Sockets.
The following table lists specific system memory features.
Socket
Memory Type
Memory Module Size
Peak Bandwidth
Total Height
In general, memory modules have a much lower longevity than embedded motherboards, and therefore the EOL of
the memory modules may occur several times during the lifetime of the module. Kontron guarantees to maintain
memory modules by replacing EOL memory modules with another similar type of qualified module.
As a minimum, it is recommend to use Kontron memory modules for prototype system(s) in order to prove the
stability of the system and as a reference.
For volume production, if required, test and qualify other types of RAM. In order to qualify RAM it is recommend to
configure three systems running a RAM Stress Test program in a heat chamber at 60°C, for a minimum of 24 hours.
For a list of Kontron memory modules, see Table 6: Memory Modules.
www.kontron.com
USB 3.0
SATA Gen.3
Quad Ethernet ports with up to 10 Gb
Supported
3 Clocks supported (GbE, COMe connector, XDP debug connector)
2x DDR4 SODIMM
(Option: 4x DDR4 SODIMM)
Default: One SODIMM per channel for up to 16 GB per channel
Channel A: DDR4-2400 SODIMM up to16 GB non-ECC/ECC
Channel B: DDR4-2400 SODIMM up to16 GB non-ECC/ECC
(Option: Two SODIMMs per channel for up to 32 GB per channel)
(Channel A: DDR4-2400 SODIMM up to16 GB + 16 GB non-ECC/ECC)
(Channel B: DDR4-2400 SODIMM up to16 GB + 16 GB non-ECC/ECC)
4 GByte, 8 GByte and 16 GByte
34.1 GB/s at 2400 MT/s
8 mm with one SODIMM per channel ( top side assembly only)
16 mm with two SODIMMS per channel ( top and bottom side assembly)
COMe-bDV7 - User Guide, Rev 1.0
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