Storage; Manufacturing And Welding - Quectel EC25 series User Manual

8
S Storag
8.1. Stor rage
EC25 is sto red in avacu
1. Shelf life e in sealed b
2. After thi is bag is op
process ses must be:
 Mo ounted withi
 Sto ored at <10%
3. Devices s require bak
 Hu umidity indic
Mo ounted for m more than 72

4. If baking g is required
NOTE
As plastic c ontainer can
container fo orhigh tem
IPC/JEDEC CJ-STD-033
8.2. Man nufacturi
The squeeg gee should
openings an nd penetrate
clean stenc il surface on
the hole of t the module
It is sugges sted that the e peak reflow
max reflow temperatur
ge an nd Ma
uum-sealed bag. The re
bag is 12 mo onths at < 4
ened, devic es that will
:
n 72 hours a at factory co
% RH.
ke before m ounting, if:
ator card is >10% when
2 hours at fa
d, devices m may be baked
nnot be subj jected to hig
perature (1 25ºC) baki
for bakingp rocedure.
ng and W Welding
push the pa aste on the
e to the PC B. The force
n a single pa ass. To ensu
pads should d be 0.18mm
w temperatu
re is 260ºC . To avoid d
EC25-A_Us E ser_ManualC
anufa acturi
estrictions of f storage con
40ºC/90%RH H.
be subjecte d to reflow s
onditions of ≤ ≤ 30ºC/60%
n ambient te emperature i
actory condit tions of ≤ 30
d for 48 hou urs at 125ºC
gh temperatu ure, the mod
ng. If shor rter baking
surface of stencil,so a
e on the squ ueegee sho
ure the mod dule solderin
m. For detail s, please re
ure is 235 ~ 245ºC (for
damage to the module
Confidentia al / Release
EC25-AU
ng
ndition ares hown as be
soldering or r other high
RH.
s23ºC±5ºC.
0ºC/60% RH .
±5ºC.
dule needs t to be taken
time is de esired, plea
as to make the paste fi
uld be adjus sted so as t
ng quality, th he thickness
fer to docum ment [4] .
SnAg3.0Cu 0.5 alloy). T
e when it is repeatedly
d 60 / 6 69
LTE Module L e
ser Manua al
low.
temperature e
out from the e
ase refer to o
ll the stenci il
to produce a a
s of stencil a at
The absolute e
heated, it is s