Typical Smt Reflow Profile; Moisture Sensitivity Level (Msl) - SimCom SIM7000G User Manual

6.3

Typical SMT Reflow Profile

SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 33: The ramp-soak-spike reflow profile of SIM7000
Note: For more details about secondary SMT, please refer to the document [21].
6.4

Moisture Sensitivity Level (MSL)

SIM7000 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
If the prescribed time limit is exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 34: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
1
2
2a
3
4
5
5a
6
SIM7000 _Hardware Design _V1.00
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
Unlimited at ≦30℃/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, it must be reflowed within the
Smart Machine Smart Decision
2017-05-23