Fronius TransPocket 1500 Service Manual page 29

Heat dissipation Heat-transfer compound
from power
componentry To ensure optimum heat dissipation, there is a heat-transfer compound applied onto the
(continued) underside of the secondary diode and transistor module.
After every separation of the secondary diode and transistor module from the heat sink,
the heat-transfer compound must be renewed.
Fig.1
Fig.2
Fig.3
- Clean the underside of the transistor
module with contact spray and a non-
linting cloth
- Place a blob of heat-transfer
compound on a flat, clean and smooth
surface (e.g. coated wooden board)
- Using an application roller, spread the
heat-transfer compound evenly across
the surface
- Roll alternately from left to right until
part of the surface is completely and
evenly covered with heat-transfer
compound
- Roll alternately at right angles to the
previous direction until part of the
surface is completely and evenly
covered with heat-transfer compound
- Once there is an even, thin layer of
compound on the roller of the
application tool, lift the tool out of the
compound
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