Audio Pa Component Replacement Procedure; For High Power Models - Motorola MCS 2000 Service Instructions Manual

Audio PA Component Replacement Procedure

For High Power Models

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C a u t i o n
2-4 Basic Maintenance
This procedure must be used when replacing these components to ensure
proper alignment and heatsinking.
1. Remove the main board from the chassis per disassembly instructions in
Chapter 5.
2. Remove the faulty component in the Audio PA section of the main
board. Ensure that the through-holes are free of solder.
3. Place the main board in a chassis eliminator (Motorola Part Number
2705815W03). Assemble the screws based on the Screw-Down sequence
in Figure 5-19.
4. Place new component(s) in the proper location. Assemble the Audio PA
Clip per the reassembly instructions Step 8. on page 5-22.
5. Flip the chassis eliminator over.
6. Using a large tip soldering iron set to 750
around through holes for approximately 15 seconds. Dispense 6337 Tin
Lead solder wire until a uniform solder fillet exists. Repeat this operation
for all leads.
7. Inspect solder joints. There should be a uniform fillet. The joints should
be shiny and not dull in appearance.
8. Remove the Audio PA clip per disassembly instructions Step 2. on page 5-
14. Remove all screws. Pull board out of chassis eliminator.
°
F max, heat ground plane