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4-4.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: parts mounted on the conductor side.
x
•
: Through hole.
z
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•
: connected by carbon pattern
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
specified.
•
%
: indicates tolerance.
• C : panel designation.
• U : B+ Line.
• Power voltages are dc 9 V and fed with regulated dc power
supply from external power voltage jack (J1004) on the
BASE MAIN board, dc 12 V and fed with regulated dc
power supply modular jack (J1003 or J1011) on the BASE
MAIN board with 100 Ω in series, and dc 3.6 V and fed
with regulated dc power supply battery terminal on the
HAND MAIN board.
• Voltages and waveforms are dc with respect to ground in
test mode.
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path
N
: RX
O : TX
F
: RX (INTERCOM)
f
: TX (INTERCOM)
P : BELL
– 31 –
1
/
W or less unless otherwise
4
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