Table of Contents
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TABLE OF CONTENTS
1.
Identifying the Parts ........................................................ 3
Setting Up the Base unit ................................................. 4
Preparing the Battery Pack ............................................. 5
Entering the Area code .................................................... 5
Making Calls ................................................................... 6
Receiving Calls ............................................................... 7
Telephone Features ......................................................... 8
Answering Machine Features ......................................... 12
Caller ID Features ........................................................... 15
2.
......................................................... 18
3.
Base Unit ......................................................................... 21
Handset ............................................................................ 22
4.
4-1. Block Diagram - MAIN Section - ................................ 25
POWER SUPPLY Section - ........................................... 27
4-3. Block Diagram - HANDSET Section - ........................ 29
Schematic Diagrams ....................................................... 31
4-5. Printed Wiring Board
- BASE MAIN Board (Component Side) - ................... 33
- BASE MAIN Board (Conductor Side) - ................... 35
4-7. Schematic Diagram - BASE MAIN Board (1/3) - ....... 37
4-8. Schematic Diagram - BASE MAIN Board (2/3) - ....... 39
4-9. Schematic Diagram - BASE MAIN Board (3/3) - ....... 41
4-10. Printed Wiring Board - BASE KEY Board - ............... 43
4-11. Schematic Diagram - BASE KEY Board - .................. 44
4-12. Printed Wiring Board - HAND MAIN Board - .......... 45
4-13. Schematic Diagram - HAND MAIN Board - .............. 47
5.
6.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
................................................ 52
............................... 54
NOTE FOR REPLACEMENT OF THE EEPROM
The ID cord is written in the EEPROM.
When replacing the EEPROM, U1011 on the BASE MAIN board
and U1006 on HAND MAIN board should be replaced together
as a pair.
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