Sony HDCU1000 Maintenance Manual page 59
Hd camera control unit
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Also See for HDCU1000:
- Operation manual (67 pages) ,
- Installation manual (102 pages) ,
- Maintenance manual (150 pages)
Table of Contents
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(AT-167 BOARD suffix 12)
Ref. No.
or Q'ty Part No.
SP Description
C779
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C780
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C781
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C782
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C783
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C784
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C785
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C786
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C787
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C789
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C790
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C791
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C792
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C793
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C796
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C798
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C799
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C801
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C802
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C803
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C804
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C805
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C806
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C807
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C808
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C809
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C810
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C811
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C812
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C813
1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C814
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C815
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C816
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C817
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C818
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C819
1-164-858-81 s CAP, CHIP CERAMIC 22PF CH 1005
C820
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C821
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C822
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C823
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C827
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C829
1-164-878-81 s CAP,CHIP CERAMIC 150PF CH 1005
C830
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C831
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C833
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C834
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C835
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C836
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C837
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C840
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C841
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C842
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C843
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C844
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C845
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C846
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C847
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
C848
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C849
1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)
MM/HDCU1000 Series
(AT-167 BOARD suffix 12)
Ref. No.
or Q'ty Part No.
SP Description
C850
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C851
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C852
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C853
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C854
1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C855
1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C856
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C857
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C858
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C859
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C860
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C861
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C862
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C863
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C864
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C865
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C866
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C867
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C868
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C870
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C871
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C873
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C874
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C875
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C876
1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
CN103
1-794-917-11 s CONNECTOR, MEMORY STICK
CN104
1-793-093-91 o CONNECTOR, BOARD TO BOARD 60P
CN301
1-580-057-21 s PIN, CONNECTOR (SMD) 4P
CN601
1-764-093-21 o PIN, CONNECTOR (PC BOARD) 8P
D1
8-719-017-03 s DIODE 02DZ4.7-TPH3
D2
8-719-017-03 s DIODE 02DZ4.7-TPH3
D4
8-719-074-31 s DIODE CL-196YG-CD-T
D101
8-719-820-42 s DIODE 1SS302-TE85L
D102
8-719-070-20 s DIODE RB706F-40
D103
8-719-820-42 s DIODE 1SS302-TE85L
D104
8-719-820-42 s DIODE 1SS302-TE85L
D105
8-719-820-42 s DIODE 1SS302-TE85L
D106
8-719-820-42 s DIODE 1SS302-TE85L
D107
8-719-820-42 s DIODE 1SS302-TE85L
D401
8-719-024-81 s DIODE 1SS300-TE85L
D402
8-719-024-81 s DIODE 1SS300-TE85L
D403
8-719-024-81 s DIODE 1SS300-TE85L
D404
8-719-024-81 s DIODE 1SS300-TE85L
D405
8-719-024-81 s DIODE 1SS300-TE85L
D406
8-719-024-81 s DIODE 1SS300-TE85L
D407
8-719-024-81 s DIODE 1SS300-TE85L
D408
8-719-024-81 s DIODE 1SS300-TE85L
D409
8-719-074-31 s DIODE CL-196YG-CD-T
D410
8-719-077-09 s DIODE CL-196HR-CD-T
D411
8-719-027-83 s DIODE CL-155UR/G-DT
D412
8-719-027-83 s DIODE CL-155UR/G-DT
D416
8-719-024-81 s DIODE 1SS300-TE85L
D417
8-719-024-81 s DIODE 1SS300-TE85L
D418
8-719-024-81 s DIODE 1SS300-TE85L
D419
8-719-024-81 s DIODE 1SS300-TE85L
D420
8-719-024-81 s DIODE 1SS300-TE85L
D421
8-719-024-81 s DIODE 1SS300-TE85L
D422
8-719-024-81 s DIODE 1SS300-TE85L
D423
8-719-024-81 s DIODE 1SS300-TE85L
4-15
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