Electrical Parts List - Sony HDCU1000 Maintenance Manual

4-3. Electrical Parts List

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ADO-10/10G BOARD
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Ref. No.
or Q'ty Part No. SP Description
1pc A-1161-078-A s MOUNTED CIRCUIT BOARD, ADO-10G
1pc A-1129-230-A s MOUNTED CIRCUIT BOARD, ADO-10
CN2 1-778-451-31 s CONNECTOR, FFC/FPC(ZIF) AN 50P
1-778-451-21 o CONNECTOR, FPC (50P) (SILVER)
4-12
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AT-167 BOARD (suffix 12)
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Ref. No.
or Q'ty Part No.
1pc
(GOLD) 1pc
4pcs
(SILVER)
BT101
(GOLD) C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C18
C19
C20
C21
C22
C23
C24
C25
C26
C28
C29
C30
C31
C33
C34
C35
C37
C38
C39
C41
C101
C102
C103
C104
C105
C107
C108
C109
C110
C111
C112
C113
C115
C117
C118
C119
C120
C121
SP Description
A-1129-299-A s MOUNTED CIRCUIT BOARD, AT-167
1-528-174-11 s BATTERY, LITHIUM (CR2032 TYPE)
7-682-947-01 s SCREW +PSW 3X6
1-756-076-21 s HOLDER, LITHIUM BATTERY
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-165-989-91 s CAP, CERAMIC 10MF (2012)
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-104-905-11 s CAP, DOUBLE LAYERS 0.22F
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
MM/HDCU1000 Series