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Philips Semiconductors
GSM/DCS/PCS power amplifier
PACKAGE OUTLINE
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
y
Z
20
1
DIMENSIONS (mm are the original dimensions)
A
UNIT
A 1
A 2
max.
0.15
0.95
mm
1.10
0.05
0.80
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT527-1
2000 Oct 16
D
heathsink side
D h
pin 1 index
b p
e
0
(1)
A 3
b p
c
D
0.30
0.20
6.6
0.25
0.19
0.09
6.4
REFERENCES
IEC
JEDEC
c
11
A
2
E h
A
1
10
w
M
2.5
5 mm
scale
(2)
D h
E
E h
e
4.3
4.5
3.1
0.65
4.1
4.3
2.9
EIAJ
10
E
A
H
E
(A )
3
L
p
L
detail X
H E
L
L p
v
6.6
0.75
1.0
0.2
0.13
6.2
0.50
EUROPEAN
PROJECTION
Product specification
CGY2014TT
SOT527-1
X
v
A
M
A
(1)
w
y
Z
o
0.5
8
0.1
o
0.2
0
ISSUE DATE
99-11-12
00-07-12
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