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Philips TDA8950 Product Data Sheet

2 × 150 w class-d power amplifier
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1. General description

2. Features

3. Applications

TDA8950
2
150 W class-D power amplifier
Rev. 02 — 11 June 2009
The TDA8950 is a high-efficiency Class D audio power amplifier. The typical output power
is 2
150 W with a speaker load impedance of 4 .
The TDA8950 is available in both HSOP24 and DBS23P power packages. The amplifier
operates over a wide supply voltage range from 12.5 V to 40 V and features low
quiescent current consumption.
I
Pin compatible with TDA8920B for both HSOP24 and DBS23P packages
I
Symmetrical operating supply voltage range from 12.5 V to 40 V
I
Stereo full differential inputs, can be used as stereo Single-Ended (SE) or mono
Bridge-Tied Load (BTL) amplifier
I
High output power in typical applications:
N
SE 2
150 W, R
N
SE 2
170 W, R
N
SE 2
100 W, R
N
BTL 1
300 W, R
I
Low noise
I
Smooth pop noise-free start-up and switch off
I
Zero dead time switching
I
Fixed frequency
I
Internal or external clock
I
High efficiency
I
Low quiescent current
I
Advanced protection strategy: voltage protection and output current limiting
I
Thermal FoldBack (TFB)
I
Fixed gain of 30 dB in SE and 36 dB in BTL applications
I
Fully short-circuit proof across load
I
BD modulation in BTL configuration
I
DVD
I
Mini and micro receiver
I
Home Theater In A Box (HTIAB) system
I
High-power speaker system
= 4
(V
= 37 V)
L
P
= 4
(V
= 39 V)
L
P
= 6
(V
= 37 V)
L
P
= 8
(V
= 37 V)
L
P
Product data sheet

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  Summary of Contents for Philips TDA8950

  • Page 1: General Description

    TDA8950 Rev. 02 — 11 June 2009 1. General description The TDA8950 is a high-efficiency Class D audio power amplifier. The typical output power is 2 150 W with a speaker load impedance of 4 . The TDA8950 is available in both HSOP24 and DBS23P power packages. The amplifier operates over a wide supply voltage range from 12.5 V to 40 V and features low...
  • Page 2: Quick Reference Data

    = 37 V = 4 ; V = 37 V = 6 ; V = 37 V = 680 nF = 8 ; = 37 V Section 13.3. TDA8950 Unit Version SOT566-3 © NXP B.V. 2009. All rights reserved. 2 of 39...
  • Page 3: Block Diagram

    CURRENT PROTECTION VOLTAGE PROTECTION CONTROL SWITCH2 HANDSHAKE MODULATOR 24 (17) 19 (-) VSSD n.c. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier VDDP2 VDDP1 23 (16) 14 (8) 15 (9) DRIVER HIGH 16 (10) DRIVER SSP1...
  • Page 4: Pinning Information

    Product data sheet VSSA SGND VDDA IN2M IN2P MODE IN1P IN1M n.c. n.c. n.c. 001aah654 Fig 3. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier IN1P IN1M n.c. n.c. n.c. PROT VDDP1 BOOT1 OUT1 VSSP1 TDA8950J STABI VSSP2...
  • Page 5: Pin Description

    8. Functional description 8.1 General The TDA8950 is a two-channel audio power amplifier that uses Class D technology. For each channel, the audio input signal is converted into a digital PWM signal using an analog input stage and a PWM modulator; see transistors, the digital PWM signal is fed to a control and handshake block and to high- and low-side driver circuits.
  • Page 6 Each of the two audio channels contains a PWM modulator, an analog feedback loop and a differential input stage. The TDA8950 also contains circuits common to both channels such as the oscillator, all reference sources, the mode interface and a digital timing manager.
  • Page 7 PWM operating > 350 ms 50 ms audio output modulated PWM operating mute > 350 ms 50 ms TDA8950 and V time time 001aah657 reaches the MODE © NXP B.V. 2009. All rights reserved. 7 of 39...
  • Page 8: Pulse-Width Modulation Frequency

    8.3.1 Thermal protection The TDA8950 employes an advanced thermal protection strategy. A TFB function gradually reduces the output power within a defined temperature range. If the temperature continues to rise, OTP is activated to shut down the device completely.
  • Page 9: Overtemperature Protection (Otp)

    (3) Amplifier is switched off due to OTP. Fig 6. 8.3.2 OverCurrent Protection (OCP) In order to guarantee the robustness of the TDA8950, the maximum output current that can be delivered at the output stages is limited. OCP is built in for each output power switch.
  • Page 10: Window Protection (Wp)

    • During the start-up sequence, when the TDA8950 is switching from Standby to Mute. Start-up will be interrupted If a short-circuit is detected between one of the output terminals and pin VDDP1/VDDP2 or VSSP1/VSSP2. The TDA8950 will wait until the short-circuit to the supply lines has been removed before resuming start-up.
  • Page 11: Supply Voltage Protection

    TDA8950. In practice (because of the OCP threshold) the output power can be boosted to twice the output power that can be achieved with the single-ended configuration.
  • Page 12: Limiting Values

    RC-snubber network connected on pins OUT1 and OUT2 Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier OUT1 SGND OUT2 power stage mbl466...
  • Page 13: Static Characteristics

    5 C, gain reduction commences and at a junction temperature of approximately act(th_fold) Rev. 02 — 11 June 2009 150 W class-D power amplifier 12.5 [4][5] [4][5] [4][5] Figure TDA8950 Unit 10.3 © NXP B.V. 2009. All rights reserved. 13 of 39...
  • Page 14: Dynamic Characteristics

    SGND + 0 V SGND + 5 V (500 kHz minimum, 900 kHz maximum) will result in a PWM frequency f track Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier Mute MODE SGND + 5 SGND + 6 SGND + 2.5...
  • Page 15: Stereo Se Configuration Characteristics

    = 37 V = 100 Hz = 1 kHz = 100 Hz = 100 Hz = 1 kHz = 100 Hz [10] [10] Section 13.3. TDA8950 0.05 - 0.05 - © NXP B.V. 2009. All rights reserved. 15 of 39...
  • Page 16: Mono Btl Application Characteristics

    = 8 ; V = 37 V = 100 Hz = 1 kHz = 100 Hz = 100 Hz = 1 kHz = 100 Hz Section 13.3. TDA8950 0.05 - 0.05 - © NXP B.V. 2009. All rights reserved. 16 of 39...
  • Page 17: Application Information

    9.2 A o(peak) Rev. 02 — 11 June 2009 150 W class-D power amplifier – 0.5 f w min (Section 8.3.2). I TDA8950 Figure is the sum of o(peak) © NXP B.V. 2009. All rights reserved. 17 of 39...
  • Page 18: Bridge-Tied Load (Btl)

    Rev. 02 — 11 June 2009 150 W class-D power amplifier – 0.5 f w min Section 8.3.2. I , connected between pin OSC TDA8950 is the sum o(peak) © NXP B.V. 2009. All rights reserved. 18 of 39...
  • Page 19: Heatsink Requirements

    TFB and total thermal resistance from junction to ambient. th j a – Power dissipation (P) is determined by the efficiency of the TDA8950. Efficiency measured as a function of output power is given in derived as a function of output power as shown in...
  • Page 20: Pumping Effects

    Figure 13.6 Pumping effects In a typical stereo single-ended configuration, the TDA8950 is supplied by a symmetrical supply voltage (e.g. V configuration, a ‘pumping effect’ can occur. During one switching interval, energy is taken from one supply (e.g.
  • Page 21: Application Schematic

    NXP Semiconductors The most effective way to avoid pumping effects is to connect the TDA8950 in a mono full-bridge configuration. In the case of stereo single-ended applications, it is advised to connect the inputs in anti-phase (see adapted; for example, by increasing the values of the supply line decoupling capacitors.
  • Page 22 R VDDA VDDA VDDP VDDP C VDDP 470 F C VP 22 F C VSSP 470 F VSSP VSSP R VSSA operating VSSA n.c. n.c. n.c. C IN IN1P 470 nF C IN IN1M 470 nF SGND C IN IN2P 470 nF C IN IN2M...
  • Page 23: Curves Measured In Reference Design

    = 35 V, f = 345 kHz, 2 SE configuration. = 6 kHz. = 1 kHz. = 100 Hz. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 010aaa553 load 010aaa554 load © NXP B.V. 2009. All rights reserved.
  • Page 24 = 100 Hz. = 35 V, f = 345 kH, 2 SE configuration. = 1 W. = 10 W. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai423 001aai424 (Hz) load © NXP B.V. 2009. All rights reserved.
  • Page 25 = 10 W. = 35 V, f = 345 kHz, 1 BTL configuration. = 1 W. = 10 W. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai701 (Hz) load 001aai702 (Hz) © NXP B.V. 2009. All rights reserved.
  • Page 26 1 W and 10 W respectively. = 35 V, f = 345 kHz, 2 SE configuration. 1 W and 10 W respectively. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai703 (Hz) 001aai704 (Hz) © NXP B.V. 2009. All rights reserved.
  • Page 27 = 35 V, f = 1 kHz, f = 345 kHz. SE configuration. SE configuration. SE configuration. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai705 001aai706 © NXP B.V. 2009. All rights reserved. 27 of 39...
  • Page 28 = 1 kHz, f = 345 kHz. 12.5 17.5 22.5 Infinite heat sink used. = 1 kHz, f = 345 kHz. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai707 27.5 32.5 37.5 001aai708 27.5 32.5 37.5...
  • Page 29 Ripple on V , short on input pins. = 35 V, f = 345 kHz, R = 4 , V Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai709 (Hz) = 330 pF, L = 15 H, C = 680 nF.
  • Page 30 , short on input pins. = 35 V, f = 345 kHz, R = 4 , V = 35 V, f = 345 kHz. Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai711 (Hz) ripple = 2 V (p-p). ripple...
  • Page 31 TDA8950_2 Product data sheet = 35 V, f = 325 kHz, V = 2 V (RMS). Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier 001aai713 (Hz) © NXP B.V. 2009. All rights reserved. 31 of 39...
  • Page 32: Package Outline

    Rev. 02 — 11 June 2009 150 W class-D power amplifier non-concave view B: mounting base side 10 mm 1.85 10.7 1.65 EUROPEAN PROJECTION TDA8950 SOT411-1 1.43 0.25 0.03 0.78 ISSUE DATE 98-02-20 02-04-24 © NXP B.V. 2009. All rights reserved.
  • Page 33 0.32 16.0 13.0 11.1 0.23 15.8 12.6 10.9 REFERENCES JEDEC JEITA Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier detail X 10 mm 14.5 0.25 0.25 0.03 13.9 EUROPEAN PROJECTION SOT566-3 (A 3 ) 0.07...
  • Page 34: Soldering Of Smd Packages

    • Solder bath specifications, including temperature and impurities TDA8950_2 Product data sheet Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier © NXP B.V. 2009. All rights reserved. 34 of 39...
  • Page 35: Reflow Soldering

    Lead-free process (from J-STD-020C) Package reflow temperature ( C) Volume (mm < 350 Figure Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier Figure 30) than a SnPb process, thus 350 to 2000 > 2000 © NXP B.V. 2009. All rights reserved.
  • Page 36: Soldering Of Through-Hole Mount Packages

    = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature MSL: Moisture Sensitivity Level Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier peak temperature time 001aac844 ). If the stg(max) ©...
  • Page 37: Package Related Soldering Information

    Suitability of through-hole mount IC packages for dipping and wave soldering Data sheet status Product data sheet Figure Figure Figure 11 Preliminary data sheet Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier Soldering method Dipping Wave suitable suitable suitable...
  • Page 38: Legal Information

    Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 02 — 11 June 2009 TDA8950 150 W class-D power amplifier © NXP B.V. 2009. All rights reserved. 38 of 39...
  • Page 39: Table Of Contents

    ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com TDA8950 All rights reserved. Date of release: 11 June 2009 Document identifier: TDA8950_2...