Package Outline - Philips TDA8950 Product Data Sheet

NXP Semiconductors

14. Package outline

DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm)
1
Z
DIMENSIONS (mm are the original dimensions)
UNIT A A A b
2 4 5
4.6 1.15 1.65 0.75
mm
4.3 0.85 1.35 0.60
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT411-1
Fig 28. Package outline SOT411-1 (DBS23P)
TDA8950_2
Product data sheet
D
d
e
w
1
b
p
e
(1) (1)
c D d D E
p h
0.55 30.4 28.0 12.2
12 2.54
0.35 29.9 27.5 11.8
IEC JEDEC
non-concave
E h
j
23
M
0 5 10 mm
scale
e e e E E E
1 2 h 1 2
10.15 6.2 1.85
1.27 5.08 6
9.85 5.8 1.65
REFERENCES
JEITA
Rev. 02 — 11 June 2009
2 150 W class-D power amplifier
D
h
x
view B: mounting base side
A
2
A
5
A
4
E
B
2
L
2
L
L
1 3
L
c
Q
e
m
2
j L L L L m
1 2 3
3.6 14 10.7 2.4
2.1
4.3
2.8 13 9.9 1.6
1.8
EUROPEAN
PROJECTION
TDA8950
SOT411-1
E
E
1
v
M
(1)
Q v w x Z
1.43
0.6 0.25 0.03 45
0.78
ISSUE DATE
98-02-20
02-04-24
© NXP B.V. 2009. All rights reserved.
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