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Philips Semiconductors
16. Package outline
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
1
Z
DIMENSIONS (mm are the original dimensions)
A
2
UNIT
A
A
3
max.
18.5
8.7
mm
3.7
17.8
8.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT110-1
Fig 15. SIL9MPF package outline.
9397 750 06865
Product specification
D
D
1
q
P
P
1
pin 1 index
e
b
2
A
b
b
b
c
4
1
2
15.8
1.40
0.67
1.40
0.48
15.4
1.14
0.50
1.14
0.38
REFERENCES
IEC
JEDEC
Rev. 02 — 7 April 2000
6 W mono Bridge Tied Load (BTL) audio amplifier
q
2
q
1
L
9
b
w
M
b
1
0
5
10 mm
scale
(1)
(1)
D
D
E
e
L
1
21.8
21.4
6.48
3.9
2.54
21.4
20.7
6.20
3.4
EIAJ
TDA8943SF
A
2
A
3
A
A
4
Q
P
P
Q
q
q
1
1
2.75
3.4
1.75
15.1
4.4
2.50
3.2
1.55
14.9
4.2
EUROPEAN
PROJECTION
© Philips Electronics N.V. 2000. All rights reserved.
SOT110-1
E
c
(1)
Z
q
w
2
max.
5.9
0.25
1.0
5.7
ISSUE DATE
92-11-17
95-02-25
15 of 20
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