Table of Contents
Advertisement
Philips Semiconductors
15. Package outline
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
y
1
pin 1 index
24
Z
DIMENSIONS (mm are the original dimensions)
A
UNIT
A 2
A 3
max.
3.5
mm
3.5
0.35
3.2
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT566-3
Fig 29. HSOP24 package outline.
9397 750 13356
Preliminary data sheet
D
D 1
12
13
b p
e
(1)
(2)
A 4
b p
c
D
D 1
+0.08
0.53
0.32
16.0
13.0
−0.04
0.40
0.23
15.8
12.6
REFERENCES
IEC
JEDEC
c
D 2
A 2
E 1
w
M
0
5
scale
(2)
D 2
E
E 1
E 2
e
1.1
11.1
6.2
2.9
1
0.9
10.9
5.8
2.5
JEITA
Rev. 01 — 1 October 2004
2 × 100 W class-D power amplifier
E
x
E 2
H E
A 4
detail X
10 mm
H E
L p
Q
v
w
14.5
1.1
1.7
0.25
0.25
13.9
0.8
1.5
EUROPEAN
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
TDA8920B
SOT566-3
A
X
v
A
M
Q
A
(A 3 )
θ
L p
θ
x
y
Z
8°
2.7
0.03
0.07
0°
2.2
ISSUE DATE
03-02-18
03-07-23
27 of 34
Advertisement
Table of Contents
