Keithley 7072 Instruction Manual page 74

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SERVICE INFORMATION
4.4 SPECIAL HANDLING OF STATIC-
SENSITIVE DEVICES
CMOS and other high-impedance devices are subject to
possible static discharge damage because of the high-
impedance levels involved. When handling such devices,
use the precautions listed below.
NOTE
In order to prevent damage, assume that all parts
are static sensitive.
1. Such devices should be transported and handled only
in containers specially designed to prevent or dissipate
static build-up. Typically, these devices will be received
in anti-static containers made of plastic or foam. Keep
these parts in their original containers until ready for
installation or use.
2. Remove the devices from their protective containers only
at a properly-grounded work station. Also ground
yourself with an appropriate wrist strap while working
with these devices.
3. Handle the devices only by the body; do not touch the
pins or terminals.
4. Any printed circuit board into which the device is to be
-
inserted must fist be grounded to the bench or table.
5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.
4.6 TROUBLESHOOTING
4.5.1 Recommended Equipment
Table 4-2 summarizes the recommended equipment for
general troubleshooting.
Table 4-2. Recommended Troubleshooting
Equipment
Description
Manufacturer
and Model Application
5%Digit DMM Keithley 199
Measure DC voltages
Oscilloscope
TEK 2243 View logic waveforms
Extender card Keithley 7070 Allow circuit access
4.5.2 Using the Extender Card
In order to gain access to the test points and other circuitry
on the Model 7072, the card must be plugged into the
Model 7070 Extender Card, which, in turn, must be plug-
ged into the desired slot of the mainframe. The Model 7wO
must be configured as an extender card by placing the con-
figuration jumper in the EXTEND position. See the
documentation supplied with the Model 7070 for complete
details on using the card.
NOTE
The Model 7070 cannot be used for performing the
verification tests because its presence will affect the
results.
4.5.3 Troubleshooting Procedure
Table 4-3 summarizes the troubleshooting procedure for
the Model 7072 Semiconductor Matrix Card. Some of the
troubleshooting steps refer to the ID data timing diagram
shown in Figure 4-8. In addition to the procedure shown,
the relay tests outlined in paragraph 4.3.3 can be used to
aid in troubleshooting. Also, refer to paragraph 4.6 for an
overview of operating principles.
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