Keithley 7072 Instruction Manual page 11

Semiconductor matrix card
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3
.........................................................................................................
2.24
Magnetic Fields .........................................................................................................................................
2-24
Electromagnetic Intcrfcrencc (EMI). .........................................................................................................
2-25
Ground Loops.. ..........................................................................................................................................
2-25
Keeping Connectors Clean ........................................................................................................................
2-26
Noise Currents Caused by Cable Flexing.. ................................................................................................
2-26
Shielding.. ..................................................................................................................................................
2.26
Guarding.. ..................................................................................................................................................
2-28
Matrix Expansion Effects on Card Spccilications.. ................................................................................... 2-29
.............................................................................................................................................
....................................................................................................................................
3-l
Stand AIonc System Configuration.. ...........................................................................................................
3-l
Computerized System Configuration ..........................................................................................................
3-l
Optimizing CV Measurement Accuracy .......................................................... ........................... ......... .... 3-4
Basic CV Test Procedure.. ...........................................................................................................................
3-4
Typical CV Curves ......................................................................................................................................
3-4
TEST MATRIX ...............................................................................................................
3-6
System Configuration.. ................................................................................................................................
3-6
Testing Common-Source Characteristic of FETs.. ......................................................................................
3-8
RESlSTIVITY
MEASUREMENTS
...................................................................................................................
3-9
Test Configuration ............................................................................................
.......................................... 3-9
Test Procedure.. ...........................................................................................................................................
3-9
Resistivity Calculations.. ........................ ................. ..........................................................
... .................. 3-9
SEMICONDUCTOR
PARAMETER ANALYSIS ,.,..,..................................................................,..., .............. 3.12
System Configuration.. ..............................................................................................................................
3-12
Cable Connections.. ...................................................................................................................................
3- I3
SPA Mcasuremcnt Considerations.. ..........................................................................................................
3- I.5
Typical Test Proccdurc.. ............................................................................................................................
3.15
4
...............................................................................................................................................
HANDLING AND CLEANING PRECAUTIONS ............................................................................................
4-I
.................................................................................................................
4 -1
Environmental Conditions.. .........................................................................................................................
4-l
Recommended Test Equipment.. .................................................................................................................
4-l
Relay Testing.. .............................................................................................................................................
4-2
Offset Current Verification.. ........................................................................................................................
4-3
Path Isolation Verification.. .........................................................................................................................
4-S
Path Resistance Verification.. ......................................................................................................................
4-7
SPECIAL HANDLING
OF STATIC-SENSITIVE
DEVICES ........................................................................ 4 -IO
TROUBLESHOOTING
....................................................................................................................................
4-10
Recommended Equipment .........................................................................................................................
4-10
Using the Extcndcr Card ...........................................................................................................................
4-10
Troubleshooting Prwxdure .......................................................................................................................
4-10
PRINCIPLES OF OPERATION.. .....................................................................................................................
Block Diagram.. .........................................................................................................................................
4-12
ID Data Circuits.. .......................................................................................................................................
Relay Control.. ...........................................................................................................................................
Powcr-on Safeguard ..................................................................................................................................
4-l 3
Isolator Relays ...........................................................................................................................................
REAR SHIELD.. ................................................................................................................................................
4-13
ii

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