When Mounting The Camera - Sony XCL-SG510C Technical Manual

When mounting the camera

When the value read from temperature sensor is above
78 °C (173 °F), heat dissipation is required.
To promote heat dissipation from the unit and maintain
performance, mount the camera to a metallic heat
dissipation plate.
Dimension of the heat dissipation plate: 160 mm ×
130 mm × 5 mm or more (Thermal conductivity:
16.3 W/m·K or more)
Notes
• When mounting the camera to the heat dissipation
plate, secure the camera tightly by using the reference
screw holes (see page 7) and screws.
• Do not mount the camera to a plate made of a material
such as wood or resin that prevents heat dissipation.
Metallic heat dissipation plate
Metallic heat dissipation plate
Plate that prevents heat dissipation
(made of wood, resin, etc.)
Plate that prevents heat dissipation
(made of wood, resin, etc.)
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