When Mounting The Camera - Sony XCG-C30 Technical Manual

Digital video camera module
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When mounting the camera

When you operate this unit in the following conditions,
heat dissipation is required depending on the usage
environment because the inside of the camera becomes
hot.
• when using PoE system
• when the partial scan is set to less than 120 lines
during the power is supplied through DC IN
To promote heat dissipation from the unit and maintain
performance, mount the camera to a metallic heat
dissipation plate.
Dimension of the heat dissipation plate: 180 mm ×
110 mm × 5 mm or more (Thermal conductivity:
16.3 W/m·K or more)
For heat dissipation, refer to the User's Guide.
Notes
• When mounting the camera to the heat dissipation
plate, secure the camera tightly by using the reference
screw holes (see page 7) and screws.
• Do not mount the camera to a plate made of a material
such as wood or resin that prevents heat dissipation.
Metallic heat dissipation plate
Metallic heat dissipation plate
Plate that prevents heat dissipation
(made of wood, resin, etc.)
Plate that prevents heat dissipation
(made of wood, resin, etc.)
Page 10

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Xcg-c32Xcg-c130Xcg-c30cXcg-c32cXcg-c130c

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