Winbond W83627Ehg Super I/O Chipset; Figure 2-14: Bios Chipset - IEI Technology WAFER-LX3 User Manual

WAFER-LX3 3.5" Motherboard

Figure 2-14: BIOS Chipset

2.6.3 Winbond W83627EHG Super I/O chipset

The Winbond W83627EHG Super I/O chipset is connected to the AMD Geode™ CS5536
companion device through the LPC bus. The Winbond W83627EHG is an LPC
interface-based Super I/O device that comes with Environment Controller integration,
floppy disk controller, and UART controller. Some of the features of the Winbond
W83697HG chipset are listed below:
LPC Spec. 1.01 compliant
LDRQ# (LPC DMA) and SERIRQ (serial IRQ) supported
Hardware monitor functions integrated
Microsoft PC98/PC99 Hardware Design Guide compliant
ACPI DPM (Device Power Management) supported
Some of the Super I/O features are described in more detail below. The super I/O chipset
is shown in Figure 2-15.
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