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2.5
2.5
Package
Package
Information
Information
2.5 Package
2.5
Package Information
Information
2.5.1 Recommended Reflow Profile
NO.
NO.
Item
Item
NO.
NO.
Item
Item
1
Reflow Time
2
Peak-Temp
Note:
Note:
Note:
Note:
1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm).
2.5.2 Device Handling Instruction (Module IC SMT Preparation)
�
Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)
�
After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
�
Recommend to oven bake with N2 supplied.
Baked required with 24 hours at 125 ± 5 ℃ before rework process for two modules, one is
�
new module and two is board with module.
Recommend to store at ≦10% RH with vacuum packing.
�
�
If SMT process needs twice reflow:
(1) Top side SMT and reflow à
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours.
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process.
Note:
Window time means from last bake end to next reflow start that has 168 hours space.
Jinan USR IOT Technology Limited
USR-WIFI232-A/B/C User Manual
Figure 5 Reflow
Reflow
Reflow
Soldering
Soldering
Reflow Soldering
Soldering Profile
Table 2 Reflow Soldering Parameter
Temperature
Temperature
Temperature (Degree)
Temperature
Time of above 220
260 max
(2) Bottom side SMT and reflow
Page 12 of 93
http://www.usriot.com
Profile
Profile
Profile
(Degree)
(Degree)
(Degree)
Time(Sec)
Time(Sec)
Time(Sec)
Time(Sec)
35~55 sec
tec@usr.cn
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