F
Specifications
SXRD Device
Display device
Size
Resolution
Reflectivity
Contrast (as device)
Pixel pitch
Width (between pixels)
Response speed
Liquid crystal mode
Alignment layer
Backplane process
Liquid crystal cell gap
Optical
Projection system
Imaging device
Lamp
Screen coverage
Light output
General
Xenon white reference
Contrast
Resolution
Power requirements
Operating temperature
Storage temperature
Operating humidity
Storage humidity
Dimensions
(W x H x D)
Mass
Input/Output
Input A
Input B
Input C
Input D
Remote interface
SXRD (Silicon X-tal Reflective Display)
1.55-inch across diagonal
4,096 (H) X 2,160 (V) pixels
72 %
More than 4,000 : 1
8.5 µm
0.35 µm
5 msec (tr + tf)
Vertical Aligned Mode
Inorganic Thin Film
0.35 µm MOS process
Less than 2 µm
SRX-S110 / SRX-S105
3-SXRD panel, prism color integrated system
SXRD, 1.55-inch (diagonal), 4,096(H) x 2,160(V) pixels
on each chip
2 kW Xenon lamp x 2 (SRX-R110/S110)
1kW Xenon lamp x 2 (SRX-R105/S105)
Approx. 4.5 to 15.5 m (14 to 51 feet)
(viewable area, measured horizontally)
10,000 ANSI lumens ±10 % (SRX-R110/S110)*
5,000 ANSI lumens ±10 % (SRX-R105/S105)
X: 0.314, Y: 0.351
More than 1800:1
600 TV lines (SDI input/SMPTE-259M)
1,920 x 1,080 pixels (HD-SDI input, SMPTE-292M)
4,096 x 2,160 pixels (RGB)
AC 200 to 240 V, 50/60 Hz (SRX-R110/S110)
AC 100 to 240 V, 50/60 Hz (SRX-R105/S105)
+5 ºC to +35 ºC (+41 ºF to +90 ºF)
-20 ºC to +60 ºC (-4 ºF to +140 ºF)
35 % to 85 % (without condensation)
10 % to 90 %
Approx. 740 x 500 x 1,330mm
(29 4/5 x 19 4/5 x 52 3/5 inches)
Approx. 110 kg (242 lb 8 oz) (without lens)
Approx. 120 kg (264 lb 9 oz) (with lens)
DVI-D interface board
Open for optional signal interface board
Open for optional signal interface board
Open for optional signal interface board
D-sub 9-pin, RS-232C (female) x 1
Ethernet terminal, 10Base-T/100Base-TX x 1
SRX-R110 / SRX-R105
Open for optional signal interface board
F
Appendix
49