Thermocouple Conditioning And Preparation; Thermocouple Attachment To Ihs; Orientation Of Thermocouple Groove Relative To Package Pin; Bending Tip Of Thermocouple - Intel WiFi Link 5100 Design Manual

Figure 7.

Orientation of Thermocouple Groove Relative to Package Pin

5.1.4

Thermocouple Conditioning and Preparation

1. Use a calibrated thermocouple as specified in
2. Measure the thermocouple resistance by holding both wires on one probe and the
tip of the thermocouple to the other probe of the DMM (compare to thermocouple
resistance specifications).
3. Straighten the wire for about 38 mm (1½") from the bead to place it inside the
channel.
4. Bend the tip of the thermocouple to approximately a 45 degree angle by 0.8 mm
(0.030") from the tip
Figure 8.

Bending Tip of Thermocouple

5.1.5

Thermocouple Attachment to IHS

Caution: To avoid impact on the thermocouple during the SMT process, reflow must be
performed before attaching the thermocouple to the grooved MCH IHS.
1. Clean the thermocouple wire groove with isopropyl alcohol (IPA) and a lint-free
cloth removing all residue prior to thermocouple attachment.
®
Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
18
(Figure 8).
®
Intel 5100 MCH Chipset
Table 5.
Order Number: 318676-003US
July 2008