Figure 7-4. Locating Geometric Center Of Processor; Figure 7-5. Thermocouple Preparation - Intel FCPGA2 - Processor - 1 x Pentium 4 2.66 GHz Design Manuallines

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Intel Pentium III Processor in the FC-PGA2 Package Thermal Design Guidelines

Figure 7-4. Locating Geometric Center of Processor

3. After the marks are scribed, clean the desired thermocouple attach location with a mild solvent and
a lint-free wipe or cloth. Alcohol or acetone should suffice. Remember that the cleaner the part is,
the stronger the bond will be after curing.
4. Straighten the thermocouple wire by hand so that the first 4-6 inches are reasonably straight. Use
fine point tweezers to make sure that the bead and the two wires coming out are straight and
untwisted. Make sure that the second layer of thermocouple insulation, sometimes clear, is not
covering the bead.
5. Create a slight downward bend in the wires about a 1/16" from the bead. Once the thermocouple
is in place, this will ensure that the thermocouple is making contact with the surface.
6. Place the thermocouple bead on the geometric center of the IHS (previously scribed). Apply tape
across the wire about ¼" back from the bead to hold the thermocouple in place. Apply pressure to
the tape to ensure a good bond. Apply additional tape pieces along the length of the wire to ensure
a good temporary bond to the part (see Figure 7-5). Check the electrical continuity between the
thermocouple and the IHS using a multimeter. If there is no electrical continuity between the
thermocouple and the IHS, repeat steps 4 through 6.

Figure 7-5. Thermocouple Preparation

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