Board-Level Components Keepout Dimensions; Torsional Clip Heatsink Thermal Solution Assembly; Advancedtca* Torsional Clip Heatsink Volumetric Envelope For Mch Heatsink - Intel WiFi Link 5100 Design Manual

When using heatsinks that extend beyond the MCH chipset reference heatsink envelope
shown in
motherboard cannot exceed 2 mm (0.07") in height.
Figure 19.

AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink

6.1.3

Board-level Components Keepout Dimensions

The location of hole patterns and keepout zones for the AdvancedTCA* reference
thermal solution are shown in
hole patterns as that of the Intel
Chipset.
6.1.4

Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the MCH is a passive extruded heatsink with a
thermal interface. It is attached using a clip with each end hooked through an anchor
soldered to the board.
associated components. The torsional clip and the clip retention anchor are the same as
the ones used on the Intel
®
Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
26
Figure 19, any motherboard components placed between the heatsink and
Figure
Figure 20
®
E7500 Series Chipset reference thermal solution.
25. This reference thermal solution has the same
®
E7500 Series Chipset and Intel
shows the reference thermal solution assembly and
®
Intel 5100 MCH Chipset
®
5000 Series
July 2008
Order Number: 318676-003US