Table Of Contents - Intel WiFi Link 5100 Design Manual

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Intel 5100 MCH Chipset
Contents
1.0 Introduction .............................................................................................................. 6
1.1 Design Flow........................................................................................................ 6
1.2 Definition of Terms .............................................................................................. 7
1.3 Related Documents ............................................................................................. 8
1.4 Thermal Simulation ............................................................................................. 9
2.0 Packaging Technology ............................................................................................... 9
2.1 Package Mechanical Requirements ....................................................................... 11
3.0 Thermal Specifications ............................................................................................ 12
3.1 Thermal Design Power (TDP) .............................................................................. 12
3.2 Case Temperature ............................................................................................. 12
4.0 Thermal Solution Requirements............................................................................... 12
4.1 Characterizing the Thermal Solution Requirement .................................................. 12
5.0 Thermal Metrology .................................................................................................. 15
5.1 MCH Case Measurement..................................................................................... 15
5.1.1 Supporting Test Equipment...................................................................... 15
5.1.2 Thermal Calibration and Controls.............................................................. 16
5.1.3 IHS Groove ........................................................................................... 16
5.1.4 Thermocouple Conditioning and Preparation............................................... 18
5.1.5 Thermocouple Attachment to IHS ............................................................. 18
5.1.6 Curing Process ....................................................................................... 22
5.1.7 Thermocouple Wire Management.............................................................. 23
5.2 Power Simulation Software ................................................................................. 24
6.0 Reference Thermal Solution..................................................................................... 24
6.1 AdvancedTCA* Reference Heatsink ...................................................................... 25
6.1.1 Thermal Performance.............................................................................. 25
6.1.2 Mechanical Design Envelope .................................................................... 25
6.1.3 Board-level Components Keepout Dimensions ............................................ 26
6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26
6.1.5 Heatsink Orientation ............................................................................... 27
6.1.6 Extruded Heatsink Profiles ....................................................................... 27
6.1.7 Mechanical Interface Material ................................................................... 27
6.1.8 Thermal Interface Material....................................................................... 27
6.1.8.1
6.1.9 Heatsink Clip ......................................................................................... 28
6.1.10 Clip Retention Anchors ............................................................................ 28
6.1.11 Reliability Guidelines............................................................................... 28
6.2 CompactPCI* Reference Heatsink ........................................................................ 29
6.2.1 Component Overview.............................................................................. 29
6.2.2 Thermal Solution Performance Characteristics ............................................ 30
7.0 Reliability Guidelines ............................................................................................... 30
A Mechanical Drawings ............................................................................................... 31
B Thermal Solution Component Suppliers ................................................................... 40
Intel
July 2008
Order Number: 318676-003US
Effect of Pressure on TIM Performance......................................... 28
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5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
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