Introduction; Design Flow - Intel WiFi Link 5100 Design Manual

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Introduction

As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
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Intel
• Describe reference thermal solutions that meet the specification of the Intel
MCH Chipset
Properly designed thermal solutions provide adequate cooling to maintain the Intel
5100 MCH Chipset die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the
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Intel 5100 MCH Chipset die temperature at or below the specified limits, a system
designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel
Chipset components only. For thermal design information on other chipset components,
refer to the respective component datasheet. For the ICH9R, refer to the Intel
Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Note: Unless otherwise specified, the term "MCH" refers to the Intel
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Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer.
and the tools appropriate for each step.
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Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
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5100 Memory Controller Hub Chipset (Intel
Figure 1 illustrates the design process implicit to this document
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Intel 5100 MCH Chipset
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5100 MCH Chipset)
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5100 MCH
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5100 MCH Chipset.
Order Number: 318676-003US
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5100
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I/O
July 2008