Heatsink Orientation; Extruded Heatsink Profiles; Mechanical Interface Material; Thermal Interface Material - Intel WiFi Link 5100 Design Manual

®
Intel 5100 MCH Chipset
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in
solution component.
6.1.5

Heatsink Orientation

Because this solution is based on a unidirectional heatsink, the mean airflow direction
must be aligned with the direction of the heatsink fins.
Figure 20.

Torsional Clip Heatsink Assembly

6.1.6

Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the MCH.
Appendix B
dimensions and increased thermal performance may be available. A full mechanical
drawing of this heatsink is provided in
6.1.7

Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.
6.1.8

Thermal Interface Material

A thermal interface material (TIM) provides improved conductivity between the IHS
and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.25 mm
(0.010") thick, 25 mm x 25 mm (0.984" x 0.984") squared.
Note: Unflowed or "dry" Honeywell* PCM45F has a material thickness of 0.010". The flowed
or "wet" Honeywell* PCM45F has a material thickness of ~0.003" after it reaches its
phase change temperature.
Intel
July 2008
Order Number: 318676-003US
Appendix A. Appendix B
lists a supplier for this extruded heatsink. Other heatsinks with similar
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
contains vendor information for each thermal
Appendix A.
TDG
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