Advancedtca* Reference Heatsink; Thermal Performance; Mechanical Design Envelope; Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity - Intel WiFi Link 5100 Design Manual

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Intel 5100 MCH Chipset
The Intel
a similar package size. Due to this, any thermal solutions for the Intel
Chipset should be reusable for the Intel
reference solutions. The system designer still needs to verify that the entire thermal
solution will meet the component temperature specifications and TDP in the intended
system.
6.1

AdvancedTCA* Reference Heatsink

6.1.1

Thermal Performance

The AdvancedTCA* reference heatsink should be made from aluminum to achieve the
necessary thermal performance. Depending on the boundary conditions, the reference
heatsink can meet the thermal performance needed to cool the Intel
Chipset in the AdvancedTCA* form factor. The heatsink performance versus airflow
velocity is shown in
provide the required amount of airflow to meet the components thermal specifications.
Figure 18. Torsional Clip Heatsink Measured Thermal Performance versus Approach
Velocity
6.1.2

Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel
Intel
July 2008
Order Number: 318676-003US
®
5100 MCH Chipset has a lower TDP than the Intel
Figure 18. The heatsink may be used in other form factors that can
4.500
4.000
3.500
3.000
2.500
2.000
1.500
1.000
0.500
0.000
0 100 200 300
®
5100 MCH Chipset thermal solution are shown in
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5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
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5100 MCH Chipset including the Intel
400 500 600 700 800
Airflow Approach Velocity (LFM)
AdvancedTCA* Heatsink
ATCA Heatsink
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5000 Series Chipset and
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5000 Series
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5100 MCH
900 1000 1100 1200 1300
Figure 19.
TDG
25