Processor Thermal Characterization Parameter Relationships - Intel WiFi Link 5100 Design Manual

®
Intel 5100 MCH Chipset
The case-to-local ambient thermal characterization parameter (Ψ
measure of the thermal performance of the overall thermal solution. It is defined by
Equation 1
Equation 1. Case-to-local Ambient Thermal Characterization Parameter (Ψ
The case-to-local ambient thermal characterization parameter, Ψ
Ψ , the thermal interface material (TIM) thermal characterization parameter, and of
CS
, the sink-to-local ambient thermal characterization parameter.
Ψ
SA
Equation 2. Case-to-local Ambient Thermal Characterization Parameter (Ψ
is strongly dependent on the thermal conductivity and thickness of the TIM
Ψ
CS
between the heatsink and device package.
is a measure of the thermal characterization parameter from the bottom of the
Ψ
SA
heatsink to the local ambient air. Ψ
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
characterization parameters.
Figure 5.

Processor Thermal Characterization Parameter Relationships

Example 1. Calculating the Required Thermal Performance
The cooling performance, Ψ
previously described. The process to determine the required thermal performance to
cool the device includes the following.
1. Define a target component temperature T
Intel
July 2008
Order Number: 318676-003US
and is measured in units of °C/W.
Ψ
CA
Ψ
CA
Figure 5 illustrates the combination of the different thermal
TIM
Device
is defined using the thermal characterization parameter
CA,
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
T – T
CASE LA
- - - - - - - - - - - - - - - - - - - - - - - - -
=
TDP
Ψ Ψ
= +
CS SA
is dependent on the heatsink material, thermal
SA
T
A
T
S
Ψ
T
C
and corresponding TDP.
CASE
) is used as a
CA
)
CA
, is comprised of
CA
)
CA
Ψ
SA
Ψ
CA
CS
TDG
13