Related Manuals for Intel Core i7-800
Summary of Contents for Intel Core i7-800
- Page 1 ® Intel Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines September 2009 Document Number:322167-002...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Core and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
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Page 3: Table Of Contents
Environmental Requirements ................34 Thermal Specifications .................... 35 Thermal Specifications ..................35 ® 6.1.1 Intel Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile ..37 6.1.2 Processor Specification for Operation Where Digital Thermal Sensor Exceeds T ............39 CONTROL... - Page 4 Thermal Solution Characterization................58 ATX Reference Thermal Solution ................59 Heatsink Thermal Solution ..................59 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design....60 Heatsink Mass and Center of Gravity ..............60 Thermal Interface Material ..................60 Thermal Solution Quality and Reliability Requirements ..........61 Reference Heatsink Thermal Verification ...............61...
- Page 5 Temperature Sensor Data Format................45 Comparison of Case Temperature versus Sensor Based Specification......48 ® Intel Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile ....49 Thermal solution Performance ................. 50 Required YCA for Various T Conditions ............52 AMBIENT Thermal Solution Performance versus Fan Speed ............
- Page 6 Socket Mechanical Drawing (Sheet 2 of 4)..............91 Socket Mechanical Drawing (Sheet 3 of 4)..............92 Socket Mechanical Drawing (Sheet 4 of 4)..............93 Processor Package Drawing (Sheet 1 of 2) ..............96 Processor Package Drawing (Sheet 2 of 2) ..............97 Heat Sink Back Plate Keep In Zone ................ 100 Heat Sink Back Plate ....................
- Page 7 Thermal Test Vehicle Thermal Profile for Intel Core™ i7-800 and i5-700 Desktop Processor Series....................38 ® Thermal Solution Performance above TCONTROL for the Intel Core™ i7-800 and i5-700 Desktop Processor Series ................39 Supported PECI Command Functions and Codes ............45 Error Codes and Descriptions ..................
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Page 8: Revision History
Revision History Revision Description Revision Date Number September -001 • Initial release 2009 • Updated Tables A-2 and A-3. September -002 2009 • Updated Chapters 3, 4, 8, and Appendix B § Thermal/Mechanical Specifications and Design Guidelines... -
Page 9: Introduction
Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Location http://download.intel.com/ ® Intel Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 1 design/processor/datashts/ 322164.pdf http://download.intel.com/ ® Intel Core™ i7-800 and i5-700 Desktop Processor Series Datasheet, Volume 2 design/processor/datashts/ 322165.pdf http://download.intel.com/... -
Page 10: Definition Of Terms
LGA1156 socket socket. The Platform Environment Control Interface (PECI) is a one-wire interface that provides PECI a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal characterization parameter (psi). A measure of thermal Ψ solution performance using total package power. Defined as (T –... -
Page 11: Package Mechanical And Storage Specifications
Package Mechanical and Storage Specifications Package Mechanical and Storage Specifications Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1156 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. -
Page 12: Package Mechanical Drawing
Package Mechanical and Storage Specifications 2.1.1 Package Mechanical Drawing Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: 1. -
Page 13: Package Loading Specifications
Package Mechanical and Storage Specifications 2.1.3 Package Loading Specifications Table 2-1 provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. -
Page 14: Processor Materials
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the identification of the processor. Figure 2-3. Processor Top-Side Markings Legend: Mark Text (Production Mark): INTEL{M}{C}'08 PROC# GRP1LINE1 BRAND GRP1LINE2 SLxxx C00 GRP1LINE3 SPEED/CACHE/FMB GRP1LINE4... -
Page 15: Processor Land Coordinates
Package Mechanical and Storage Specifications 2.1.9 Processor Land Coordinates Figure 2-4 shows the bottom view of the processor package. Figure 2-4. Processor Package Lands Coordinates 25 27 29 31 33 35 37 39 11 13 15 17 19 21 23 26 28 30 32 34 36 38 40 10 12 14 16 18 20 22 24 Thermal/Mechanical Specifications and Design Guidelines... -
Page 16: Processor Storage Specifications
Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by T and customer shelf life in applicable Intel box and bags. SUSTAINED § Thermal/Mechanical Specifications and Design Guidelines... -
Page 17: Lga1156 Socket
LGA1156 Socket LGA1156 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power, and ground contacts. The socket contains 1156 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. -
Page 18: Lga1156 Socket Contact Numbering (Top View Of Socket)
LGA1156 Socket Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket) W A A A C A E A G A J A L A N A R A U AW W A A A C A E A G A J A L A N A R A U AW W A A A C A E A G A J A L A N A R A U AW W A A A C A E A G A J A L A N A R A U AW Y A B A D A F A H A K A M A P A T A V A Y... -
Page 19: Board Layout
LGA1156 Socket Board Layout The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction (see Figure... -
Page 20: Attachment To Motherboard
LGA1156 Socket Attachment to Motherboard The socket is attached to the motherboard by 1156 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, etc.) to attach the socket. As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. -
Page 21: Solder Balls
LGA1156 Socket 3.3.2 Solder Balls A total of 1156 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics: • Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. -
Page 22: Package Installation / Removal
LGA1156 Socket Figure 3-5. Pick and Place Cover Pin 1 Pin 1 Pick & Place Cover Pick & Place Cover ILM Installation ILM Installation Package Installation / Removal As indicated in Figure 3-6, access is provided to facilitate manual installation and removal of the package. -
Page 23: Socket Standoffs And Package Seating Plane
LGA1156 Socket Figure 3-6. Package Installation / Removal Features Package Orientation Pin 1 Notch Indicator (2 Places) Finger Access (2 Places) Alignment Post Pin 1 (2 Places) Chamfer 3.4.1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix Similarly, a seating plane on the top-side of the socket establishes the minimum... -
Page 24: Markings
LGA1156 Socket Markings There are three markings on the socket: • LGA1156: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion). • Lot identification code (allows traceability of manufacturing date and location). All markings must withstand 260°C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard. -
Page 25: Independent Loading Mechanism (Ilm)
Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. -
Page 26: Ilm Back Plate Design Overview
Independent Loading Mechanism (ILM) When closed, the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints. -
Page 27: Shoulder Screw And Fasteners Design Overview
Independent Loading Mechanism (ILM) 4.1.3 Shoulder Screw and Fasteners Design Overview The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. -
Page 28: Assembly Of Ilm To A Motherboard
Independent Loading Mechanism (ILM) Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. See Figure 4-4 for step by step assembly sequence. 1. Place the back plate in a fixture. The motherboard is aligned with the fixture. 2. -
Page 29: Ilm Interchangeability
Note: Desktop and Server ILM backplate/screws are NOT interchangeable. Note: ILMs that are not compliant with the Intel controlled ILM drawings can not be assured to be interchangeable. Markings There are four markings on the ILM: •... - Page 30 Independent Loading Mechanism (ILM) Thermal/Mechanical Specifications and Design Guidelines...
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Page 31: Lga1156 Socket And Ilm Electrical, Mechanical, And Environmental Specifications
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LGA1156 socket and the Independent Loading Mechanism. Component Mass Table 5-1. Socket Component Mass Component Mass... -
Page 32: Socket Maximum Temperature
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated to these limits. -
Page 33: Electrical Requirements
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications Electrical Requirements LGA1156 socket electrical requirements are measured from the socket-seating plane of the processor to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. -
Page 34: Environmental Requirements
Freeze stressing Perform stressing to requirements and perform validate accelerated additional data turns stressing assumptions and determine acceleration factors A detailed description of this methodology can be found at: ftp://download.intel.com/ technology/itj/q32000/pdf/reliability.pdf. § Thermal/Mechanical Specifications and Design Guidelines... -
Page 35: Thermal Specifications
ATX reference thermal solution design, refer to Chapter Thermal Specifications To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (T ) specifications as defined by the applicable thermal profile. -
Page 36: Processor Thermal Specifications
The 2009B (09B) is equivalent to the thermal requirements for the Intel Core™ 2 Quad ® Q9000 processor series. The 2009A (09A) is equivalent to the thermal requirements for the Intel Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with the updated mechanical attach to straddle the LGA1156 socket. -
Page 37: Intel ® Core™ I7-800 And I5-700 Desktop Processor Series Thermal Profile
Thermal Specifications ® 6.1.1 Intel Core™ i7-800 and i5-700 Desktop Processor Series Thermal Profile Figure 6-1. Thermal Test Vehicle Thermal Profile for Intel ® Core™ i7-800 and i5-700 Desktop Processor Series TTV Thermal Profile 75.0 Y = Power x 0.29 + 45.1 70.0... - Page 38 Thermal Specifications ® Table 6-2. Thermal Test Vehicle Thermal Profile for Intel Core™ i7-800 and i5-700 Desktop Processor Series Power (W) (°C) Power (W) (°C) CASE_MAX CASE_MAX 45.1 59.6 45.7 60.2 46.3 60.8 46.8 61.3 47.4 61.9 48.0 62.5 48.6 63.1...
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Page 39: Processor Specification For Operation Where Digital Thermal Sensor Exceeds Tcontrol
(Ψ ) shown in Table 6-3 for the Intel Core™ i7-800 and i5-700 desktop processor series (95 W). To get the full acoustic benefit of the DTS specification, ambient temperature monitoring is necessary. See Chapter 7 for details on characterizing the fan speed to Ψ... -
Page 40: Thermal Metrology
The following supplier can machine the groove and attach a thermocouple to the IHS. The supplier is listed the table below as a convenience to Intel’s general customers and the list may be subject to change without notice. THERM-X OF CALIFORNIA, 1837 Whipple Road, Hayward, Ca 94544. -
Page 41: Adaptive Thermal Monitor
Mechanical Design Guidelines for information on designing a compliant thermal solution. The Intel Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines. The following sections provide more details on the different TCC mechanisms used by the processor. -
Page 42: Frequency And Voltage Ordering
Cycle times are independent of processor frequency. The duty cycle for the TCC, when ® activated by the Intel Thermal Monitor, is factory configured and cannot be modified. It is possible for software to initiate clock modulation with configurable duty cycles. - Page 43 Thermtrip temperature (see Section 6.2.3 Thermtrip Signal) within a short time. In order to prevent possible permanent silicon damage, Intel recommends removing power from the processor within ½ second of the Critical Temperature Flag being set. 6.2.2.5...
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Page 44: Thermtrip# Signal
Introduction The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. The processor implements a PECI interface to allow communication of processor thermal and other information to other devices on the platform. The processor provides a digital thermal sensor (DTS) for fan speed control. -
Page 45: Peci Client Capabilities
Thermal Specifications For desktop system temperature monitoring and fan speed control management purposes, the PECI 2.0 commands that are commonly implemented include Ping(), GetDIB(), and GetTemp(). Table 6-4. Supported PECI Command Functions and Codes Supported on the Command Function Note processor Ping() GetDIB() -
Page 46: Error Codes And Descriptions
Thermal Specifications Temperature readings from the processor are always negative in a 2’s complement format, and imply an offset from the reference TCC activation temperature. As an example, assume that the TCC activation temperature reference is 100 °C. A PECI thermal reading of -10 indicates that the processor is running at approximately 10 °C below the TCC activation temperature, or 90 °C. -
Page 47: Sensor Based Thermal Specification Design Guidance
Sensor Based Thermal Specification Design Guidance Sensor Based Thermal Specification Design Guidance The sensor based thermal specification presents opportunities for the system designer to optimize the acoustics and simplify thermal validation. The sensor based specification uses the Digital Thermal Sensor information accessed using the PECI interface. -
Page 48: Comparison Of Case Temperature Versus Sensor Based Specification
Sensor Based Thermal Specification Design Guidance Figure 7-1. Comparison of Case Temperature versus Sensor Based Specification T a = 4 5 . 1 ° C T a = 4 5 . 1 ° C T c o n t r o l T c o n t r o l T a = 3 0 °... -
Page 49: Sensor Based Thermal Specification
The TTV is placed in the socket and powered to the recommended value to simulate the TDP condition. See Figure 7-2 for an example of the Intel Core™ i7-800 and i5-700 desktop processor series TTV thermal profile. ® Figure 7-2. -
Page 50: Specification When Dts Value Is Greater Than Tcontrol
Sensor Based Thermal Specification Design Guidance 7.2.2 Specification When DTS value is Greater than T CONTROL The product specification provides a table of Ψ values at DTS = T CONTROL DTS = -1 as a function of T (inlet to heatsink). Between these two defined AMBIENT points, a linear interpolation can be done for any DTS value reported by the processor. -
Page 51: Thermal Solution Design Process
For the and Intel Core™ i7-800 and i5-700 desktop processor series, the thermal boundary conditions for an ATX tower system are as follows: • T = 35 °C. -
Page 52: Thermal Design And Modelling
Sensor Based Thermal Specification Design Guidance Figure 7-4. Required Ψ for Various T Conditions AMBIENT Ψ-ca = 0.45 Ψ-ca = 0.40 Ψ-ca = 0.34 Ψ-ca = 0.29 Ta = 30 °C Ta = 35 °C Ta = 40 °C Ta = 45.1 °C 80.0 70.0 60.0... -
Page 53: Thermal Solution Performance Versus Fan Speed
Sensor Based Thermal Specification Design Guidance 7.3.3.2 Thermal Solution Characterization for Fan Speed Control The final step in thermal solution validation is to establish the thermal solution performance,Ψ and acoustics as a function of fan speed. This data is necessary to allow the fan speed control algorithm developer to program the device. -
Page 54: Fan Speed Control (Fsc) Design Process
AMBIENT derived in Section 7.3.1. This is consistent past FSC guidance from Intel, to accelerate the fan to full speed when the DTS value is greater than T . As will be shown below, the DTS thermal CONTROL specification at DTS = T... -
Page 55: Fan Speed Control Algorithm With T Data
. For simplicity, the graph shows a linear acceleration of the fans CONTROL from T - 10 to T as has been Intel’s guidance for simple fan speed CONTROL CONTROL control algorithms. As the processor workload continues to increase, the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 2300 RPM at DTS = -20 to full speed at DTS value = -1. -
Page 56: Fan Response With T
For simplicity, the graph shows a linear acceleration of the fans from T - 10 to CONTROL as has been Intel’s guidance for simple fan speed control algorithms. CONTROL As the processor workload continues to increase the DTS value will increase and the FSC algorithm will linearly increase the fan speed from the 1500 RPM at DTS = -20 to 2150 RPM at DTS value = -1. -
Page 57: System Validation
Sensor Based Thermal Specification Design Guidance System Validation System validation should focus on ensuring the fan speed control algorithm is responding appropriately to the DTS values and T data as well as any other AMBIENT device being monitored for thermal compliance. Since the processor thermal solution has already been validated using the TTV to the thermal specifications at the predicted T , additional TTV based testing in the... -
Page 58: Thermal Solution Characterization
Sensor Based Thermal Specification Design Guidance Thermal Solution Characterization Table 7-1 is early engineering data on the RCBF7-1156 (DHA-A) thermal solution as a reference for the development of thermal solutions and the fan speed control algorithm. Table 7-1. Thermal Solution Performance above T CONTROL Ψ... -
Page 59: Atx Reference Thermal Solution
Intel. ® The design strategy is to use the design concepts from the prior Intel Radial Curved ® Bifurcated Fin Heatsink Reference Design (Intel RCBFH Reference Design) designed ®... -
Page 60: Geometric Envelope For The Intel Reference Atx Thermal Mechanical Design
ATX Reference Thermal Solution Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design Figure 8-2 shows a 3-D representation of the board component keep out for the reference ATX thermal solution. A fully dimensioned drawing of the keepout information... -
Page 61: Thermal Solution Quality And Reliability Requirements
Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. The Intel reference thermal solution will be evaluated to the boundary conditions in... -
Page 62: Recommended Test Sequence
• All enabling components, including socket and thermal solution parts. The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be used for this test. -
Page 63: Material And Recycling Requirements
Thermal Solution Quality and Reliability Requirements Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (such as polyester and some polyethers), plastics that contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. - Page 64 Thermal Solution Quality and Reliability Requirements Thermal/Mechanical Specifications and Design Guidelines...
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Page 65: Boxed Processor Specifications
10.1 Introduction The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed processor. -
Page 66: Mechanical Specifications
Boxed Processor Specifications 10.2 Mechanical Specifications 10.2.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 10-1 shows a boxed processor fan heatsink. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. -
Page 67: Space Requirements For The Boxed Processor (Top View)
Boxed Processor Specifications Figure 10-3. Space Requirements for the Boxed Processor (top view) Note: Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation. Figure 10-4. Space Requirements for the Boxed Processor (overall view) Thermal/Mechanical Specifications and Design Guidelines... -
Page 68: Boxed Processor Fan Heatsink Weight
Boxed Processor Specifications 10.2.2 Boxed Processor Fan Heatsink Weight The boxed processor fan heatsink will not weigh more than 450 grams. 10.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. -
Page 69: Thermal Specifications
Boxed Processor Specifications Table 10-1. Fan Heatsink Power and Signal Specifications Description Unit Notes +12 V: 12 volt fan power supply 11.4 12.0 12.6 — — • Maximum fan steady-state current draw — — • Average steady-state fan current draw —... -
Page 70: Boxed Processor Fan Heatsink Airspace Keepout Requirements (Top View)
Boxed Processor Specifications Figure 10-7. Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) Figure 10-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) Thermal/Mechanical Specifications and Design Guidelines... -
Page 71: Variable Speed Fan
Boxed Processor Specifications 10.4.2 Variable Speed Fan If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header, it will operate as follows: The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. - Page 72 As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.
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Page 73: A Component Suppliers
The part numbers listed below identifies the reference components. End-users are responsible for the verification of the Intel enabled component offerings with the supplier. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. -
Page 74: Supplier Contact Information
Component Suppliers Table A-3. Supplier Contact Information Supplier Contact Phone Email (Asia Vital +86 755 3366 8888 Kai Chang kai_chang@avc.com.tw Components Co., x63588 Ltd.) +1 510 668 5570 William Delta WBradshaw@delta-corp.com Bradshaw +86 136 8623 1080 Foxconn Julia Jiang +1 408 919 6178 juliaj@foxconn.com ITW Fastex Roger Knell... -
Page 75: B Mechanical Drawings
Mechanical Drawings Mechanical Drawings Table B-1 lists the mechanical drawings included in this appendix. Table B-1. Mechanical Drawing List Drawing Description Figure Number “Socket / Heatsink / ILM Keepout Zone Primary Side (Top)” Figure B-1 “Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom)” Figure B-2 “Socket / Processor / ILM Keepout Zone Primary Side (Top)”... -
Page 76: Socket / Heatsink / Ilm Keepout Zone Primary Side (Top)
Mechanical Drawings Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top) 46.89 45.50 37.31 2X 38.40 37.54 2X 36.89 33.80 26.70 28.46 25.79 25.81 21.25 23.81 18.90 20.90 10.00 0.00 5.40 10.50 10.00 20.13 2X 21.25 27.02 2X 25.25 29.69 35.03... -
Page 77: Socket / Heatsink / Ilm Keepout Zone Secondary Side (Bottom)
Mechanical Drawings Figure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side (Bottom) 37.54 25.81 13.67 0.00 13.67 35.21 35.21 40.71 Thermal/Mechanical Specifications and Design Guidelines... -
Page 78: Socket / Processor / Ilm Keepout Zone Primary Side (Top)
Mechanical Drawings Figure B-3. Socket / Processor / ILM Keepout Zone Primary Side (Top) Thermal/Mechanical Specifications and Design Guidelines... -
Page 79: Socket / Processor / Ilm Keepout Zone Secondary Side (Bottom)
Mechanical Drawings Figure B-4. Socket / Processor / ILM Keepout Zone Secondary Side (Bottom) 25.70 0.00 25.70 18.00 0.00 18.00 Thermal/Mechanical Specifications and Design Guidelines... -
Page 80: Reference Design Heatsink Assembly
Mechanical Drawings Figure B-5. Reference Design Heatsink Assembly Thermal/Mechanical Specifications and Design Guidelines... -
Page 81: Reference Fastener (Sheet 1 Of 4)
Mechanical Drawings Figure B-6. Reference Fastener (Sheet 1 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 82: Reference Fastener (Sheet 2 Of 4)
Mechanical Drawings Figure B-7. Reference Fastener (Sheet 2 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 83: Reference Fastener (Sheet 3 Of 4)
Mechanical Drawings Figure B-8. Reference Fastener (Sheet 3 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 84: Reference Fastener (Sheet 4 Of 4)
Mechanical Drawings Figure B-9. Reference Fastener (Sheet 4 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 85: Reference Clip (Sheet 1 Of 2)
Mechanical Drawings Figure B-10. Reference Clip (Sheet 1 of 2) Thermal/Mechanical Specifications and Design Guidelines... -
Page 86: Reference Clip (Sheet 2 Of 2)
Mechanical Drawings Figure B-11. Reference Clip (Sheet 2 of 2) Thermal/Mechanical Specifications and Design Guidelines... -
Page 87: Thermocouple Attach Drawing
Mechanical Drawings Figure B-12. Thermocouple Attach Drawing Thermal/Mechanical Specifications and Design Guidelines... - Page 88 Mechanical Drawings § Thermal/Mechanical Specifications and Design Guidelines...
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Page 89: C Socket Mechanical Drawings
Socket Mechanical Drawings Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1. Mechanical Drawing List Drawing Description Figure Number “Socket Mechanical Drawing (Sheet 1 of 4)” Figure C-1 “Socket Mechanical Drawing (Sheet 2 of 4)” Figure C-2 “Socket Mechanical Drawing (Sheet 3 of 4)”... -
Page 90: Socket Mechanical Drawing (Sheet 1 Of 4)
Socket Mechanical Drawings Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 91: Socket Mechanical Drawing (Sheet 2 Of 4)
Socket Mechanical Drawings Figure C-2. Socket Mechanical Drawing (Sheet 2 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 92: Socket Mechanical Drawing (Sheet 3 Of 4)
Socket Mechanical Drawings Figure C-3. Socket Mechanical Drawing (Sheet 3 of 4) Thermal/Mechanical Specifications and Design Guidelines... -
Page 93: Socket Mechanical Drawing (Sheet 4 Of 4)
Socket Mechanical Drawings Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4) § Thermal/Mechanical Specifications and Design Guidelines... - Page 94 Socket Mechanical Drawings Thermal/Mechanical Specifications and Design Guidelines...
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Page 95: D Package Mechanical Drawings
Package Mechanical Drawings Package Mechanical Drawings Table D-1 lists the mechanical drawings included in this appendix. Table D-1. Mechanical Drawing List Drawing Description Figure Number “Processor Package Drawing (Sheet 1 of 2)” Figure D-1 “Processor Package Drawing (Sheet 2 of 2)” Figure D-2 Thermal/Mechanical Specifications and Design Guidelines... -
Page 96: Processor Package Drawing (Sheet 1 Of 2)
Package Mechanical Drawings Figure D-1. Processor Package Drawing (Sheet 1 of 2) Thermal/Mechanical Specifications and Design Guidelines... -
Page 97: Processor Package Drawing (Sheet 2 Of 2)
Package Mechanical Drawings Figure D-2. Processor Package Drawing (Sheet 2 of 2) § Thermal/Mechanical Specifications and Design Guidelines... - Page 98 Package Mechanical Drawings Thermal/Mechanical Specifications and Design Guidelines...
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Page 99: E Heat Sink Back Plate Drawings
Design modifications for specific application and manufacturing are the responsibility of OEM and the listed vendors for customized system implementation and validation. These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. -
Page 100: Heat Sink Back Plate Keep In Zone
Heat Sink Back Plate Drawings Figure E-1. Heat Sink Back Plate Keep In Zone Thermal/Mechanical Specifications and Design Guidelines... -
Page 101: Heat Sink Back Plate
Heat Sink Back Plate Drawings Figure E-2. Heat Sink Back Plate § Thermal/Mechanical Specifications and Design Guidelines... - Page 102 Heat Sink Back Plate Drawings Thermal/Mechanical Specifications and Design Guidelines...