Thermal Solution Design Process; Boundary Condition Definition - Intel Core i7-800 Specifications

Desktop processor series and lga1156 socket thermal/mechanical specifications and design guidelines
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Sensor Based Thermal Specification Design Guidance
7.3

Thermal Solution Design Process

Thermal solution design guidance for this specification is the same as with previous
products. The initial design needs to take into account the target market and overall
product requirements for the system. This can be broken down into several steps:

• Boundary condition definition

• Thermal design / modelling
• Thermal testing
7.3.1
Boundary Condition Definition
Using the knowledge of the system boundary conditions such as inlet air temperature,
acoustic requirements, cost, design for manufacturing, package and socket mechanical
specifications and chassis environmental test limits the designer can make informed
thermal solution design decisions.
For the and Intel Core™ i7-800 and i5-700 desktop processor series, the thermal
boundary conditions for an ATX tower system are as follows:
• T
EXTERNAL
• T
RISE
• T
AMBIENT
Based on the system boundary conditions the designer can select a T
to use in thermal modelling. The assumption of a T
the required Ψ
assumed T
Figure 7-4
700 desktop processor series.
Note:
If the assumed T
thermal solution performance may not be sufficient to meet the product requirements.
The results may be excessive noise from fans having to operate at a speed higher than
intended. In the worst case this can lead to performance loss with excessive activation
of the Thermal Control Circuit (TCC).
Thermal/Mechanical Specifications and Design Guidelines
= 35 °C. This is typical of a maximum system operating environment
= 5 °C. This is typical of a chassis compliant to CAG 1.1 or TAC 2.0.
= 40 °C (T
= T
AMBIENT
needed to meet TTV T
CA
can utilize a design with a higher Ψ
AMBIENT
shows a number of satisfactory solutions for the Intel Core™ i7-800 and i5-
is inappropriate for the intended system environment, the
AMBIENT
+ T
)
EXTERNAL
RISE
AMBIENT
at TDP. A system that can deliver lower
CASEMAX
, which can have a lower cost.
CA
and Ψ
AMBIENT
has a significant impact on
CA
51

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