Package Mechanical Specifications; Package Mechanical Drawing; Processor Package Assembly Sketch - Intel CORE 2 DUO E4000 - DATASHEET 3-2008 Datasheet

Package Mechanical Specifications

3 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
the processor package components and how they are assembled together. Refer to the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 7.

Processor Package Assembly Sketch

System Board
NOTE:
1. Socket and System Board are included for reference and are not part of processor
package.
3.1

Package Mechanical Drawing

The package mechanical drawings are shown in
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal and
Mechanical Design Guidelines.
Datasheet
Figure 7
Core (die)
IHS
Substrate
Figure 7
include the following:
TIM
Capacitors
Figure 8 and Figure
shows a sketch of
LGA775 Socket
9. The drawings
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