Intel CORE 2 DUO E4000 - DATASHEET 3-2008 Datasheet page 4

5.2.4 PROCHOT# Signal ..................................................................................87
5.2.5 THERMTRIP# Signal ................................................................................87
5.3 Thermal Diode...................................................................................................88
5.4 Platform Environment Control Interface (PECI) ......................................................90
5.4.1 Introduction ...........................................................................................90
5.4.1.1
5.4.2 PECI Specifications .................................................................................92
5.4.2.1
5.4.2.2
5.4.2.3
5.4.2.4
6 Features ..................................................................................................................93
6.1 Power-On Configuration Options ..........................................................................93
6.2 Clock Control and Low Power States .....................................................................93
6.2.1 Normal State .........................................................................................94
6.2.2 HALT and Extended HALT Powerdown States ..............................................94
6.2.2.1
6.2.2.2
6.2.3 Stop Grant and Extended Stop Grant States ...............................................95
6.2.3.1
6.2.3.2
6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................96
6.2.4.1
6.2.4.2
6.3 Enhanced Intel
7 Boxed Processor Specifications................................................................................99
7.1 Mechanical Specifications .................................................................................. 100
7.1.1 Boxed Processor Cooling Solution Dimensions........................................... 100
7.1.2 Boxed Processor Fan Heatsink Weight ..................................................... 101
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly............................................................................................. 101
7.2 Electrical Requirements .................................................................................... 101
7.2.1 Fan Heatsink Power Supply .................................................................... 101
7.3 Thermal Specifications...................................................................................... 103
7.3.1 Boxed Processor Cooling Requirements.................................................... 103
7.3.2 Fan Speed Control Operation (Intel
X6800 Only) ........................................................................................ 105
7.3.3 Fan Speed Control Operation (Intel
E6000 and E4000 Series Only) ............................................................... 105
8 Balanced Technology Extended (BTX) Boxed Processor Specifications ................... 107
8.1 Mechanical Specifications .................................................................................. 108
8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions .................................................................. 108
8.1.2 Boxed Processor Thermal Module Assembly Weight ................................... 110
8.1.3 Boxed Processor Support and Retention Module (SRM) .............................. 111
8.2 Electrical Requirements .................................................................................... 112
8.2.1 Thermal Module Assembly Power Supply .................................................. 112
8.3 Thermal Specifications...................................................................................... 114
8.3.1 Boxed Processor Cooling Requirements.................................................... 114
8.3.2 Variable Speed Fan ............................................................................... 114
9 Debug Tools Specifications .................................................................................... 117
9.1 Logic Analyzer Interface (LAI) ........................................................................... 117
9.1.1 Mechanical Considerations ..................................................................... 117
9.1.2 Electrical Considerations ........................................................................ 117
4
Key Difference with Legacy Diode-Based Thermal
Management ............................................................................90
PECI Device Address..................................................................92
PECI Command Support .............................................................92
PECI Fault Handling Requirements ...............................................92
PECI GetTemp0() Error Code Support ..........................................92
HALT Powerdown State ..............................................................94
Extended HALT Powerdown State ................................................95
Stop Grant State .......................................................................95
Extended Stop Grant State .........................................................96
HALT Snoop State, Stop Grant Snoop State ..................................96
Extended HALT Snoop State, Extended Stop Grant Snoop
State .......................................................................................96
® ®
SpeedStep Technology .............................................................96
®
Core2 Extreme Processor
®
Core2 Duo Desktop Processor
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