Intel CORE 2 DUO E4000 - DATASHEET 3-2008 Datasheet page 5

Figures
1 V Static and Transient Tolerance ............................................................................. 23
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2 V Overshoot Example Waveform ............................................................................. 24
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3 Differential Clock Waveform ...................................................................................... 31
4 Differential Clock Crosspoint Specification ................................................................... 31
5 Differential Measurements......................................................................................... 31
6 Differential Clock Crosspoint Specification ................................................................... 32
7 Processor Package Assembly Sketch ........................................................................... 35
8 Processor Package Drawing Sheet 1 of 3 ..................................................................... 36
9 Processor Package Drawing Sheet 2 of 3 ..................................................................... 37
10 Processor Package Drawing Sheet 3 of 3 ..................................................................... 38
11 Processor Top-Side Markings Example for the Intel
Processor E6000 Series with 4 MB L2 Cache with 1333 MHz FSB..................................... 40
12 Processor Top-Side Markings Example for the Intel
Processors E6000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 41
13 Processor Top-Side Markings Example for the Intel
Processors E6000 Series with 2 MB L2 Cache ............................................................... 41
14 Processor Top-Side Markings Example for the Intel
Processors E4000 Series with 2 MB L2 Cache ............................................................... 42
15 Processor Top-Side Markings for the Intel
16 Processor Land Coordinates and Quadrants (Top View) ................................................. 43
17 land-out Diagram (Top View - Left Side) ..................................................................... 46
18 land-out Diagram (Top View - Right Side) ................................................................... 47
19 Thermal Profile 1 ..................................................................................................... 79
20 Thermal Profile 2 ..................................................................................................... 80
21 Thermal Profile 3 ..................................................................................................... 81
22 Thermal Profile 4 ..................................................................................................... 82
23 Thermal Profile 5 ..................................................................................................... 83
24 Case Temperature (TC) Measurement Location ............................................................ 84
25 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 86
26 Processor PECI Topology ........................................................................................... 90
27 Conceptual Fan Control on PECI-Based Platforms ......................................................... 91
28 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 91
29 Processor Low Power State Machine ........................................................................... 94
30 Mechanical Representation of the Boxed Processor ....................................................... 99
31 Space Requirements for the Boxed Processor (Side View)............................................ 100
32 Space Requirements for the Boxed Processor (Top View)............................................. 100
33 Space Requirements for the Boxed Processor (Overall View) ........................................ 101
34 Boxed Processor Fan Heatsink Power Cable Connector Description ................................ 102
35 Baseboard Power Header Placement Relative to Processor Socket ................................. 103
36 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 104
37 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 104
38 Boxed Processor Fan Heatsink Set Points................................................................... 106
39 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 109
40 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 110
41 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out
Volumes ............................................................................................................... 111
42 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out
Volume................................................................................................................. 112
43 Assembly Stack Including the Support and Retention Module ....................................... 113
44 Boxed Processor TMA Power Cable Connector Description ............................................ 114
45 Balanced Technology Extended (BTX) Mainboard Power Header Placement
(hatched area) ...................................................................................................... 115
46 Boxed Processor TMA Set Points............................................................................... 117
Datasheet
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Core™2 Duo Desktop
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Core™2 Duo Desktop
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Core™2 Duo Desktop
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Core™2 Duo Desktop
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Core™2 Extreme Processor X6800 ................. 42
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