Table of Contents
Advertisement
IP5900 (IC1004)
LP5900
SNVS358Q – JULY 2005 – REVISED FEBRUARY 2015
7 Detailed Description
7.1 Overview
Designed to meet the needs of sensitive RF and analog circuits, the LP5900 provides low noise, high PSRR, low
quiescent current, as well as low line and load transient response figures. Using new innovative design
techniques, the LP5900 offers class-leading noise performance without the need for a separate noise filter
capacitor.
7.2 Functional Block Diagram
Block Diagram
IN
V
BG
1.2 V
EN
1 M
Pin Discription
7.3 Feature Description
PIN
NAME
DSBGA
WSON
7.3.1 No-Load Stability
A1
4
The LP5900 will remain stable and in regulation with no external load.
A2
6
B1
3
7.3.2 Enable Control
B2
1
The LP5900 Enable (EN) pin is internally held low by a 1-MΩ resistor to GND. The EN must be higher than the
-
2
V
threshold to ensure that the device is fully enabled under all operating conditions. The EN pin voltage must
IH
be lower than the V
threshold to ensure that the device is fully disabled.
IL
Thermal
Thermal
7.3.3 Low Noise Output
-
Pad
Any internal noise at the LP5900 reference voltage is reduced by a first order low-pass RC filter before it is
passed to the output buffer stage. This eliminates the need for the external bypass capacitor for noise
suppression.
10
Submit Documentation Feedback
OUT 1
N/C 2
GND 3
PIN
DSBGA
WSON
EN
A1
4
A2
6
B1
3
+
B2
1
—
2
Thermal
—
Pad
+
V
IH
Copyright © 2005–2015, Texas Instruments Incorporated
TYPE
Enable input; disables the regulator when ≤ 0.4 V. Enables the regulator when ≥ 1.2 V. An
EN
I
internal 1-M Ω pull-down resistor connects this input to ground.
IN
I
Input voltage supply. A 0.47-μF capacitor should be connected at this input.
GND
-
Common ground
Output voltage. A 0.47-μF Low ESR capacitor should be connected to this Pin. Connect this
OUT
O
output to the load circuit.
NC
-
No internal connection.
The exposed thermal pad on the bottom of the package should be connected to a copper
area on the PCB under the package. The use of thermal vias to remove heat from the package
into the PCB is recommended. Connect the thermal pad to ground potential or leave floating.
-
Pad
Do not connect the thermal pad to any potential other than the same ground potential seen
at device pin 3. For additional information on using TI's Non Pull Back WSON package, see
Application Note AN-1187 (SNOA401).
Product Folder Links:
A1
EN
Top View
WSON Package with Exposed Thermal Pad (NGF)
Thermal
Pad
Top View
NAME
TYPE
POR
EN
I
IN
I
GND
—
OUT
O
R
F
C
F
NC
—
Thermal Pad
—
EN
DESCRIPTION
LP5900
81
B1
B1
GND
GND
Bottom View
6 Pins
6 IN
IN 6
5 N/C
N/C 5
EN 4
4 EN
Pin Functions
Enable input; disables the regulator when ≤ 0.4 V. Enable
1.2 V. An internal 1-MΩ pull-down resistor connects this i
Input voltage supply. A 0.47-µF capacitor should be conn
Common ground
Output voltage. A 0.47-μF Low ESR capacitor should be
Connect this output to the load circuit.
+
No internal connection.
The exposed thermal pad on the bottom of the package s
copper area on the PCB under the package. The use of t
heat from the package into the PCB is recommended. Co
ground potential or leave floating. Do not connect the the
other than the same ground potential seen at device pin 3
information on using TI's Non Pull Back WSON package,
AN-1187 (SNOA401).
Product Folder Links:
LP5900
Copyright © 2005–2015, Texas Instruments Incorporated
A1
EN
www.ti.com
Thermal
Pad
Bottom View
OUT
DESCRIPTION
GND
Submit Docume
Advertisement
Table of Contents
