Appendix A: Package Dimensions; (G)Mch Fc-Bga Package Dimensions (Top And Side View) - Intel 845PE Thermal Design Manual

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Appendix A: Package Dimensions

This appendix provides package dimensions and keep-out zone requirements for the 82845GE
GMCH / 8245PE MCH.
®
Figure 12. Intel

(G)MCH FC-BGA Package Dimensions (Top and Side View)

ϕ 0.6500 ±0.05
ϕ 0.500
Units = Millimeters
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
Detail A
18.75 17.9250
37.50 ±0.05
16.9500
Detail B
0.500 ±0.070
Detail A
0.203 C A B 0.203
ϕ 1.1500 ±0.05
ϕ 1.00
Appendix A: Package Dimensions
Top View
37.50 ±0.050
17.9250 18.75
16.9500
Side View
Die
Substrate
Detail C
Detail B
C A B
0.57 ±0.1
3 x 0.07
0.57 ±0.1
Detail A
Detail C
See Detail D
1.08 ±0.06
A
0.200
Detail D
Underfill
0.74 ±0.025
Epoxy
1.5 ±0.05
Die Solder
0.100 ±0.025
Bumps
Pkg760_Side-Top
29