Product Specifications; Package Description; Intel ® (G)Mch Package Dimensions; Heatsink And Clip Mechanical Reference Design - Intel 845PE Thermal Design Manual

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Product Specifications

2.1

Package Description

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2.1.1 Intel
The 82845GE GMCH and 82845PE MCH are in a 37.5 mm x 37.5 mm, 760 FC-BGA package
(see Appendix A).
2.2

Heatsink and Clip Mechanical Reference Design

The reference heatsink solution is a passive extruded aluminum heatsink with thermal and
mechanical interfaces. It is attached using a clip frame and mechanical advantage lever. The clip
frame is secured to the system board via four solder down anchors in four locations around the
(G)MCH.
The heatsink clip for the (G)MCH is designed to be used in conjunction with the mechanical
attach solution for the Intel
applied to the heatsink and package via a mechanical advantage lever. This preload assures
minimal bond line thickness and adds rigidity to the heatsink and package assembly. The clip is
designed to prevent component damage and potential failures under environmental system
loading.
2.2.1

Mechanical Keep-Outs

The mechanical keep-out restrictions are included in Appendix A (Figure 14). The component
height restrictions are illustrated by a legend in the drawing. It is important to note that the keep-
out and height restrictions differ slightly from the Intel
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
(G)MCH Package Dimensions
®
Pentium
®
4 processor. The clip provides a mechanical preload
®
82845 chipset keep-outs.
Product Specifications
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