Thermal And Mechanical Reliability; Table 2. Reliability Validation - Intel 845PE Thermal Design Manual

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Thermal and Mechanical Reliability

Recommendations for thermal mechanical reliability testing are shown in Table 2. These should
be considered as general guidelines. The user, based on anticipated use conditions, should define
validation testing requirements.

Table 2. Reliability Validation

Test
Mechanical
Shock
Random
Vibration
Thermal
Cycling
Unbiased
Humidity
Power Cycling
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of
material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
®
Intel 845GE / 845PE Chipset (G)MCH Thermal Design Guide
1
• Quantity: 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration,
170 inches/sec minimum velocity change.
• Setup: Mount sample board on test fixture.
• Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• -5 °C to +70 °C, 500 cycles
• 85 % relative humidity / 55 °C, 1000 hours
• 7,500 on/off cycles with each cycle specified as 3 minutes on,
2 minutes off 70 °C
Requirement
Product Specifications
2
Pass/Fail Criteria
Visual\Electrical
Check
Visual/Electrical
Check
Visual Check
Visual Check
Visual Check
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